With Soldering Iron:(4) Bottom of the flat pack-IC is fixed with glue to the
(1) Using desoldering braid, remove the solder from allCBA; when removing entire flat pack-IC, first apply
pins of the flat pack-IC. When you use solder fluxsoldering iron to center of the flat pack-IC and heat
which is applied to all pins of the flat pack-IC, youup. Then remove (glue will be melted). (Fig. S-1-6)
can remove it easily. (Fig. S-1-3)(5) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Flat Pack-ICDesoldering Braid
Note:
When using a soldering iron, care must be taken
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently because it may be damaged
if force is applied.
Soldering Iron
Hot Air Blower
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one byor
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
Iron Wire
machine. (Fig. S-1-4)
Soldering Iron
To Solid
Mounting Point
Fig. S-1-5
Sharp
Pin
Fine TipFine Tip
Soldering IronCBASoldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
Flat Pack-IC
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)Tweezers
With Iron Wire:
(1) Using desoldering braid, remove the solder from allFig. S-1-6
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
1-4-2DVD_NOTE |