Section VI Model 166D, MX-2962/USM-lOSA
Paragraph 6-6 cont?d
component mounting; nevertheless, remove and re- protruding components with their respective chassis
place components carefully. Use a small soldering holes. Do not force the board into place by turning
iron, one with a maximum rating of 50watts. Follow- down on the mounting screws.
ing removal of a component, clean circuit boards
and eyelets of old solder. Tin the leads of new com-
ponents before inserting them into a board, and cut C. REPLACEMENT OF TRANSISTORS AND DI-
the leads short enough that they do not project below ODES. - To solder and unsolder transistors and
the circuit board and contact the chassis or other semiconductor diodes, place a heat sink on the lead
leads. Use a minimum of solder for the bond. of the component between its body and the point to
which heat is applied. In addition, isolate the instru-
If a circuit board must be removed, first remove ment from ground or ground the body of the solder-
all electron tubes and tube clamps. When reinstalling ing iron to prevent leakage voltage from damaging
the board, carefully align tube sockets and other the component.
Table 6-6. Required Adjustments Following Tube, Transistor, and Mode Replacement
Tube or Function Adjustment
Transistor
CR 1 Limiter None
CR2 Limiter N,one
CR3 Switch Diode Delaying Sweep Time Calibration
CR4 Turn on Protection Delaying Sweep Time Calibration
CR5 Sweep Mixing Diode None
CR6 Coupling Diode Low Frequency Adjustment
High Frequency Adjustment
CR7 Coupling Diode Low Frequency Adjustment
High Frequency Adjustment
v1 Trigger Amplifier Trigger Symmetry
v4 Trigger Generator None
v5 Gate Generator Preset
v7 Gate Generator/Clamp Preset
V8 Cathode Follower None
v9 Integrator Delaying Sweep Time Calibration
v10 Cathode Follower None
V13 Bias Control Cathode Follower None
V 14 Cathode Follower/Phase Inverter Low Frequency Adjustment
V15 Delay Trigger Generator Delaying Sweep Time Calibration
Q1 Amplifier Low Frequency Adjustment
High Frequency Adjustment
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