HEWLETT-PACKARD 1707B Instruction Manual

Model 1707B Table of Contents
List of Illustrations
TABLE OF CONTENTS (Cont'd)
) Section Page Section Page
8.50 . Circuit Hoards ..................... 8-6 8.62 . Soldering Tool. Solder. and
8.52 . Hoard Connect ions ............. 8-6 Aids ......................... 8-7
8.64 . Heat Sink Removal ............ 8.8
8.54 . Servicing Etched Circuit
8.66 . Troubleshooting ................... 8.8
Hoards ....................... 8.6
8.69 . DC Voltages ................... 8.8
8.56 . Integrated Circuit Replace- 8-7 1 . Waveforms .................... 8.8
......................... Test Points .................... 8.8
ment 8.6 8.73 .
8.60 . Service Kit ..................... 8.7 8.75 . Circuit Checking ............... 8.9
LIST OF ILLUSTRATIONS
Figure Title Page Figure Title Page
1.1 . Model 1707R Oscilloscope ............... 1-0 5.12 . Main Triggering Test Setup ............ 5.13
5.13 . Delayed Triggering Test Setup ......... 5.14
1.2 . Instrument Serial Number ............ 1-5
5.14 . Main Trigger Level Range and Polarity
1.3 . Service Kit for HP 1700-series
Test Setup ........................... 5.15
Oscilloscopes ....................... 1-6
5.15 . Delayed Trigger Level Range and
2.1 . Rear Panel Power Module ............... 2-1 Polarity Test Setup ................ 5-16
2.2 . Battery Pack Installation ............... 2-2 5-16 . EXT Horizontal Bandwidth
Test Setup ........................... 5.17
3.1 . Controls and Connectors ................ 3-2
517 . EXT Horizontal Deflection Factor
3.2 . Sweep Combinations .................... 3-5
1 3.3 . DC BAL Adjust ......................... 3-8 Test Setup ........................... 5.17
3.4 . CALAdjust ............................. 3-9 518 . Calibrator Test Setup .................. 5.18
3.5 . Algebraic Addition and Differential 5-19 . Adjustment .......................... 529
Operation ............................ 3-10
6-1 . Knob Locator ........................... 6-2
3.6 . Delayed Sweep ......................... 3-11 6-2 . Mechanical Parts Locator ............... 6-3
3.7 . Mixed Sweep ........................... 3-12
8.1 . Vertical Module Mechanical Parts
Removal .............................. 8-4
4.1 . Timing Sequence ........................ 4-2 Attenuator Removal .................... 8-4
8.2 .
4.2 . Step-by-step operation of the 8.3 . Semiconductor Terminal Identification . . 8-7
Gate Schmitt Trigger ............... 4-7 8.4 . Component Identification. Interior Front
and rear Panel ..................... 8-23
4.3 . Step-by-step operation of the Set-
8.5 . Component and Assembly Locations . 8-23
reset Multivibrator .................. 4-9
8.6 . Vertical Module A5 Component
4.4 . Blanking Sequence ................... 4-12
Identification ...................... 8-24
8.7 . Horizontal Module A6 Component
5.1 . Deflection Factor Test Setup ............ 5-2 Identification ...................... 8-24
5-2 . Rise time Test Setup .................... 5-3 8-8 . Main Block Diagram ................. 8-25
5.3 . Bandwidth Test Setup ................. 33 8-9 . Power Supply Block Diagram ........ 8-27
8-10 . Attenuator Component Identification . 8-28
5-4 . A+B Mode Test Setup .................. 5-4
8.11 . Attenuator Schematic ................ 8-29
55 . Input Resistance Test Setup ............. 5-7 8.12 . Vertical Preamplifier Assembly A5A4
5-6 . CMRR Test Setup ....................... 5-8 Component Identification .......... 830
8.13 . Vertical Preamplifier Assembly
5-7 . Main Sweep Time Test Setup ............ 5-8
A5A4 .............................. 8-31
58 . Delayed Sweep Time Test Setup ........ 5.10
8-14 . Vertical Preamplifier Assembly
59 . Delay Time Accuracy Test Setup ....... 5.10 A5A4 ................................ 8.33
5-10 . Delay Time Linearity Test Setup ....... 5.11 8-15 . Vertical Preamplifier Assembly A5A4
Component Identification ............ 8.34
5-11 . Delay Jitter Test Setup ................. 5.12
V