SECTION 1
SERVICING NOTE
TABLE OF CONTENTS
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
1. SERVICING NOTE..........................................................3
The laser diode in the optical pick-up block may suffer electrostatic
2. GENERAL..........................................................................break-down because of the potential difference g6enerated by the
charged electrostatic load, etc. on clothing and the human body.
3. DISASSEMBLYDuring repair, pay attention to electrostatic break-down and also
3-1. Front Panel Assembly ...........................................................use the procedure in the printed matter which is included in the7
3-2. Back Panel Assembly............................................................repain parts.7
3-3. Base (Door, Gear) Assembly ................................................The flexible board is easily dama8ged and should be handled with
3-4. Table Assembly .....................................................................care.8
3-5. Mechanism Deck .................................................................. 9
3-6. Base Unit .............................................................................NOTES ON LASER DIODE EMISSION CHECK9
The laser beam on this model is concentrated so as to be focused on
4. TEST MODE.....................................................................10
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
5. ADJUSTMENTS
serve from more than 30 cm away from the objective lens.
5-1. Mechanical Adjustment ...................................................... 13
The emission check enables continuous checking of the S curve.
5-2. Electrical Block Checking .................................................. 19
LASER DIODE AND FOCUS SEARCH OPERATION
6. DIAGRAMS
CHECK
6-1. Circuit Boards Location ...................................................... 22
6-2. Block Diagrams
Carry out the OS curve check� in OCD section adjustment� and check
Y BD Section........................................................................ 23
that the S curve waveform is output three times.
Y Main Section..................................................................... 25
6-3. Schematic Diagram � BD Section � ................................... 29
6-4. Printed Wiring Board � BD Section � ................................. 31
6-5. Printed Wiring Board � Main Section �.............................. 33
6-6. Schematic Diagram � Main (1/2) Section �........................ 35
6-7. Schematic Diagram � Jack Section �.................................. 37
6-8. Printed Wiring Board � Jack Section � ............................... 39
6-9. Schematic Diagram � Display Section � ............................ 41
6-10. Printed Wiring Board � Display Section � ........................ 43
6-11. Schematic Diagram � Sensor/Motor Section � ................. 45
6-12. Printed Wiring Board � Sensor/Motor Section � .............. 46
6-13. IC Block Diagrams............................................................ 47
6-14. IC Pin Functions................................................................ 49
7. EXPLODED VIEWS
7-1. Case and Back Panel Section .............................................. 54
7-2. Disc Table Section .............................................................. 55
7-3. Front Panel Section ............................................................. 56
7-4. Mechanism Section-1 (CDM-40B) ..................................... 57
7-5. Mechanism Section-2 (CDM-40B) ..................................... 58
7-6. Mechanism Section-3 (CDM-40B) ..................................... 59
7-7. Base Unit Section (KSM-213BKN/M-N)........................... 60
8. ELECTRICAL PARTS LIST........................................61
� 3 � |
ACEC
SONY
