HCD-CQ1
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP Notes on chip component replacement
BLOCK OR BASE UNITY Never reuse a disconnected chip component.
Y Notice that the minus side of a tantalum capacitor may be
The laser diode in the optical pick-up block may suffer electrostaticdamaged by heat.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.Flexible Circuit Board Repairing
During repair, pay attention to electrostatic break-down and alsoY Keep the temperature of soldering iron around 270uC
use the procedure in the printed matter which is included in theduring repairing.
repair parts.Y Do not touch the soldering iron on the same conductor of the
The flexible board is easily damaged and should be handled withcircuit board (within 3 times).
care.Y Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
ATTENTION AU COMPOSANT AYANT RAPPORT
the disc reflective surface by the objective lens in the optical pick-
� LA S?CURIT?!
up block. Therefore, when checking the laser diode emission,
LES COMPOSANTS IDENTIF?S PAR UNE MARQUE 0 SUR LES
observe from more than 30 cm away from the objective lens.
DIAGRAMMES SCH?MATIQUES ET LA LISTE DES PIéCES SONT
CRITIQUES POUR LA S?CURIT? DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIéSES SONY
Laser component in this product is capable
DONT LES NUM?ROS SONT DONN?S DANS CE MANUEL OU
of emitting radiation exceeding the limit for
DANS LES SUPP?MENTS PUBLI?S PAR SONY.
Class 1.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
This appliance is classified as a CLASS 1 LASER product. ThePUBLISHED BY SONY.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Unleaded solder
This cautionBoards requiring use of unleaded solder are printed with the lead-
label isfree mark (LF) indicating the solder contains no lead.
located inside(Caution: Some printed circuit boards may not come printed with
the unit.the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Y Unleaded solder melts at a temperature about 40!C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
CAUTIONabout 350!C.
Use of controls or adjustments or performance of proceduresCaution: The printed pattern (copper foil) may peel away if the
other than those specified herein may result in hazardous radiationheated tip is applied for too long, so be careful!
exposure.Y Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
Y Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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ACEC
SONY
