NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT6-7. Schematic Diagram Main Section (2/3)ááááááááááááááááááá30
6-8. Schematic Diagram Main Section (3/3)ááááááááááááááááááá31
6-9. Printed Wiring Board DSP Sectionáááááááááááááááááááááááááá32
The laser diode in the optical pick-up block may suffer electrostatic
6-10. Schematic Diagram DSP Section (1/2)ááááááááááááááááááá33
break-down because of the potential difference generated by the
6-11. Schematic Diagram DSP Section (2/2)ááááááááááááááááááá34
charged electrostatic load, etc. on clothing and the human body.
6-12. Printed Wiring Board OPT Sectionáááááááááááááááááááááááá35
During repair, pay attention to electrostatic break-do6-13. Schematic Diagram OPT Sectionwn and alsoááááááááááááááááááááááááááá35
use the procedure in the printed matter which is included in the6-14. Printed Wiring Board Front Amp Section (AEP/US/
repair parts.CND model)ááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá36
The flexible board is easily damaged and should be handled with6-15. Schematic Diagram Front Amp Section (AEP/US/
CND model)ááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá37
care.
6-16. Printed Wiring Board Front Amp Section (E51/MX
model)ááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá38
NOTES ON LASER DIODE EMISSION CHECK
6-17. Schematic Diagram Front Amp Section (E51/MX
model)ááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá39
The laser beam on this model is concentrated so as to be focused on6-18. Schematic Diagram Surround áááááááááááAmp Section40
the disc reflective surface by the objective lens in the optical pic6-19. Printed Wiring Boark-d Surround áááááááá40Amp Section
up block. Therefore, when checking the laser diode emission,6-20. Printed Wiring Board Páááááááááááááááááááááááanel Section41
observe from more than 30 cm away from the objectiv6-21. Schemae lens.tic Diagram Panel Section (1/2)ááááááááááááááááá42
6-22. Schematic Diagram Panel Section (2/2)ááááááááááááááááá43
6-23. Printed Wiring Board Leaf SW Sectionáááááááááááááááááá44
Laser component in this product is capable6-24. Schematic Diagram Leaf SW Sectionáááááááááááááááááááá45
of emitting radiation exceeding the limit for6-25. Printed Wiring Board Drááááááááááááááááááááááiver Section46
Class 1.6-26. Schematic Diagram Drááááááááááááááááááááááááiver Section47
6-27. Printed Wiring Board áááááááááááááááááááááááTrans Section48
6-28. Schematic Diagram Táááááááááááááááááááááááááárans Section49
6-29. IC Pin Function Descriptionááááááááááááááááááááááááááááááááááááááá50
6-30. IC Block Diagramsááááááááááááááááááááááááááááááááááááááááááááááááááááá56
7. EXPLODED VIEWS
7-1. Main Sectionááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá60
7-2. Front Panel Sectionááááááááááááááááááááááááááááááááááááááááááááááááááááááá61
7-3. Chassis Sectionááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá62
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 63
This appliance is classified as a CLASS 1 LASER product. The
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 64
CLASS 1 LASER PRODUCT MARKING is located on the rear7-6. CD Mechanism Deck Section (CDM58E-30BD60)áááá65
exterior.7-7. Base Unit Section (BU-30BD60)ááááááááááááááááááááááááááááááááá66
CAUTION
8. ELECTRICAL PARTS LISTááááááááááááááááááááááááááááááááááááááá67
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
MODEL IDENTIFICATION
Notes on chip component replacementN BACK PANEL NPARTS No.
Y Never reuse a disconnected chip component.
Y Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Y Keep the temperature of soldering iruon arCound 270
during repairing.
Y Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Y Be careful not to apply force on the conductor when soldering
or unsoldering.
TABLE OF CONTENTS
1. GENERALáááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá4
2. DISASSEMBYáááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá6
MODELPARTS No.
3. TEST MODEáááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá13US model4-231-829-0s
CND model4-231-829-1s
4. MECHANICAL ADJUSTMENTSááááááááááááááááááááááááááááá17
AEP model4-231-829-2s
5. ELECTRICAL ADJUSTMENTSááááááááááááááááááááááááááááááá17MX model4-231-829-5s
E51 model4-231-829-6s
6. DIAGRAMS
6-1. Circuit Board Locationááááááááááááááááááááááááááááááááááááááááááááááááá23Y Abbreviation
6-2. Block Diagramsáááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá24CND : Canadian model
6-3. Printed Wiring Board BD Sectionáááááááááááááááááááááááááááá26MX: Mexican model
6-4. Schematic Diagram BD Sectionááááááááááááááááááááááááááááááá27E51 : Chiri and Peru model
6-5. Printed Wiring Board Main Sectionááááááááááááááááááááááááá28
6-6. Schematic Diagram Main Section (1/3)ááááááááááááááááááá29
3 |
ACEC
SONY
