REPAIR PROCEDURES
6 REPAIR PROCEDURES
6.1. Introduction
This section provides information on testing the telephone. The layout is as follows:
Section 6.2:Lead Free (PbF) solder: Identification and repair of PCBs using Pbf solder.
Section 6.3External testing: describes equipment requirements and general set up procedure.
Section 6.4Complete Unit Test Setup: describes how the items of test equipment are used together and general set
up procedure.
Section 6.5Channel box test commands: provides detailed explanation of the different commands available using
the test equipment and channel-box software.
Calibration Procedures are described in Section 8.
6.2. Lead Free (PbF) solder
CAUTION
The Printed Circuit Board (PCB) used in this telephone has been manufactured using Lead Free solder.
Lead Free solder has a higher melting point than Lead solder - typically 30 - 40 °C higher. Always use a high temperature soldering iron
When using a soldering iron with temperature control, it should be set to 370 ?10 °C (700 ? 20°F).
When using lead solder, all PbF solder must be removed from the solder area. Where this is not possible, heat the PbF solder until it
melts before applying lead solder.
Avoid overheating PbF solder as it has a tendency to splash at temperatures above 600 °C (1100 °F).
6.3. External Testing
6.3.1 General Information
The handset can be connected to a compatible personal computer for electronic adjustment and fault diagnosis. This section
provides a description of the equipment required to perform those tasks.
Prior to testing and adjustment, the unit should first be disassembled, as detailed in Section 5, and then the PCB connected to
the PCB Repair Jig. Fault tracing can be performed on the PCB using suitable test equipment, such as spectrum analysers
and oscilloscopes.
The unit must be tested and calibrated for both frequency bands (900 MHz and 1800 MHz).
6.3.2 Jigs and Tools
Interface Box (Part No. IFB003 / IFB004)
The Interface box provides:
1. IFB003: Voltage regulation for +7.2 V, +5.6 V or 4.8 V DC outputs. The +7.2 V switch setting is used as a supply to Li-Ion
type batteries (compatible for other products), the 5.6 V switch setting is used for PCB testing and the 4.8 V switch setting
is used for testing the complete unit.
2. Interface Box IFB004 is a later version that provides +4.8 V, +7.2V and +8.2 V DC outputs. It also allows selection of
external power via the Interface cable.
3. RS 232 interface. Ensures that the Unit Under Test is supplied with the correct signal levels and format.
Issue 1Section 6MMCD020801C8
Revision 0- 24 -Service Manual |
ACEC
