With Soldering Iron:(4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
(1) Using desoldering braid, remove the solder from allsoldering iron to center of the flat pack-IC and heat
pins of the flat pack-IC. When you use solder flux
up. Then remove (glue will be melted). (Fig. S-1-6)
which is applied to all pins of the flat pack-IC, you can(5) Release the flat pack-IC from the CBA using twee-
remove it easily. (Fig. S-1-3)
zers. (Fig. S-1-6)
Flat Pack-ICDesoldering BraidNote:
When using a soldering iron, care must be taken to
ensure that the flat pack-IC is not being held by glue.
When the flat pack-IC is removed from the CBA,
handle it gently because it may be damaged if force
is applied.
Soldering IronHot Air Blower
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by one,or
using a sharp pin or wire to which solder will not
adhere (iron wire). When heating the pins, use a fine
tip soldering iron or a hot air desoldering machine.Iron Wire
(Fig. S-1-4)
Soldering Iron
To Solid
Mounting Point
Fig. S-1-5
Sharp
Pin
Fine Tip
CBASoldeing Iron
Fine Tip
Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)Flat Pack-IC
(4) Release the flat pack-IC from the CBA using twee-Tweezers
zers. (Fig. S-1-6)
Fig. S-1-6
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you can
remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting point,
as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering iron
or hot air blower, pull up the wire as the solder melts
so as to lift the IC leads from the CBA contact pads
as shown in Fig. S-1-5.
1-4-2DVD_NOTE |