SERVICE NOTETABLE OF CONTENTS
CAUTION1. GENERAL
Use of controls or adjustments or performance of proce-Location of controls................................................................. 3
dures other than those specified herein may result in haz-Getting Started......................................................................... 3
ardous radiation exposure.Operation ................................................................................. 3
Connections ............................................................................. 4
2. DISASSEMBLYNotes on Chip Component Replacement
" Never reuse a disconnected chip component.2-1. Panel Assy, Front ................................................................. 5
" Notice that the minus side of a tantalum capacitor may be dam-2-2. CD Mechanism Block ......................................................... 5
aged by heat.2-3. Main Board ......................................................................... 6
2-4. Chassis (Rear) ..................................................................... 6
2-5. Chassis (T) Sub Assy .......................................................... 7
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
2-6. Lever Assy ........................................................................... 7OR BASE UNIT
2-7. Servo Board ......................................................................... 8
2-8. Roller Assy .......................................................................... 8The laser diode in the optical pick-up block may suffer electrostatic
2-9. Chassis (OP) (O/S) Assy ..................................................... 9breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
2-10. Optical Pick-up Block ......................................................... 9During repair, pay attention to electrostatic breakdown and also use
3. ELECTRICAL ADJUSTMENTSthe procedure in the printed matter which is included in the repair
CD Section ............................................................................ 10parts.
The flexible board is easily damaged and should be handled with
care.
4. DIAGRAMS
4-1. IC Pin Description ............................................................. 11
NOTES ON LASER DIODE EMISSION CHECK
4-2. Block Diagram �CD Section (1/2)� .................................. 12The laser beam on this model is concentrated so as to be focused on
4-3. Block Diagram �CD Section (2/2)� .................................. 13the disc reflective surface by the objective lens in the optical pick-
4-4. Block Diagram �Display, Power Supply Section�............ 14
4-5. Circuit Boards Location .................................................... 15up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
4-6. Printed Wiring Boards �CD Mechanism Section�............ 16
4-7. Schematic Diagram �CD Mechanism Section� ................ 17
4-8. Printed Wiring Board �Main Section� .............................. 18NOTES ON PICK-UP FLEXIBLE BOARD
4-9. Schematic Diagram �Main Section (1/2)� ........................ 19The pick-up flexible board in this set is secured to the optical pick-
up with an adhesive tape. Once the tape is removed, an adhering
4-10. Schematic Diagram �Main Section (2/2)� ........................ 20force becomes weak, and it cannot be reused.
4-11. Schematic Diagram �Display Section�............................. 21
4-12. Printed Wiring Board �Display Section� .......................... 22Therefore, if the optical pick-up is replaced, replace also the pick-
up flexible board with a new one.
5. EXPLODED VIEWS
SAFETY-RELATED COMPONENT WARNING!!5-1. Chassis Section ................................................................. 26
5-2. Front Panel Section ........................................................... 27
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE5-3. CD Mechanism Section (1) ............................................... 28
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN5-4. CD Mechanism Section (2)...............................................29
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.5-5. CD Mechanism Section (3)...............................................30
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
6. ELECTRICAL PARTS LIST........................................31IN SUPPLEMENTS PUBLISHED BY SONY.
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ACEC
