CDX-5V661/5V661A/5V661D/5V661S
Ver 1.2
TABLE OF CONTENTSNOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
1.SERVICING NOTES................................................3
The laser diode in the optical pick-up block may suffer electro-
2.DISASSEMBLYstatic break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
2-1. Disassembly Flow ........................................................... 4body.
2-2. Cover (Up)....................................................................... 5
2-3. Front Panel Section ......................................................... 5During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
2-4. Mechanism Deck (MG-160-154) ................................... 6repair parts.
2-5. MAIN Board ................................................................... 7
The flexible board is easily damaged and should be handled with
2-6. Slide Variable Resistorcare.
(Elevator Height Sensor) (RV1) ..................................... 8
2-7. ASSIST Board................................................................. 8
Laser Diode Properties
2-8. L Motor Assy (Loading) (M103) .................................... 9Y Material: GaAlAs
2-9. Chassis (TR) Main Assy ................................................. 9
2-10. Bracket (DE) Main Assy ................................................. 10Y Wavelength: 780 nm
Y Emission Duration: continuous
2-11. Slider (TOP) Assy ........................................................... 10Y Laser Output Power: less than 44.6 ?W*
2-12. Bracket (UD) Assy .......................................................... 11
2-13. Guide (Chuck) ................................................................. 11* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
2-14. Setting The OP Block Assy In The Highest Position..... 12
2-15. Address Detection Flexible Board.................................. 13
NOTES ON LASER DIODE EMISSION CHECK
2-16. Torsion Spring (OP) ........................................................ 13The laser beam on this model is concentrated so as to be focused
2-17. OP Block Assy ................................................................ 14on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
3.ELECTRICAL ADJUSTMENT............................15sion, observe from more than 30 cm away from the objective lens.
4.DIAGRAMS
4-1. Block Diagram � MAIN Section � ................................. 39
4-2. Block Diagram � DISPLAY/POWER Section � ............ 40
4-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 41
4-4. Schematic Diagram � MAIN Board (1/3) � ................... 43
4-5. Schematic Diagram
� MAIN (2/3)/ASSIST/POS Boards � ........................... 44
4-6. Schematic Diagram � MAIN Board (3/3) � ................... 45
4-7. Printed Wiring Boards
� MAIN (Component Side)/ASSIST/POS Boards � ..... 46
4-8. Printed Wiring Board
� MAIN Board (Conductor Side) � ................................ 47
4-9. Printed Wiring Board � KEY Board �............................ 48
4-10. Schematic Diagram � KEY Board � .............................. 49
4-11. Printed Wiring Board � F2 Board � ................................ 50
4-12. Schematic Diagram � F2 Board �................................... 51
4-13. Printed Wiring Board � F1 Board � ................................CAUTION52
4-14. Schematic Diagram � F1 Board �...................................Use of controls or adjustments or performance of procedures52
4-15. IC Pin Function Description ...........................................other than those specified herein ma57y result in hazardous ra-
diation exposure.
5.EXPLODED VIEWS
Notes on chip component replacement
5-1. Cover Section .................................................................. 60
5-2. Front Panel Section ......................................................... 61Y Never reuse a disconnected chip component.
5-3. Chassis Section ............................................................... 62Y Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
5-4. Mechanism Deck Section-1 (MG-160-154) ................... 63
5-5. Mechanism Deck Section-2 (MG-160-154) ................... 64
Flexible Circuit Board Repairing
Y Keep the temperature of the soldering iron around 270 uC dur-
6.ELECTRICAL PARTS LIST...............................65
ing repairing.
Y Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Y Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
2 |
ACEC
