HCD-NEZ30
SECTION 1Ver. 1.5
SERVICING NOTES
TABLE OF CONTENTSNOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
1.SERVICING NOTES...............................................3
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
2.GENERAL...................................................................6
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
3.DISASSEMBLYuse the procedure in the printed matter which is included in the
3-1. Disassembly Flow ........................................................... 8repair parts.
3-2. Cabinet............................................................................. 8
3-3. Cabinet (Top) Section ...................................................... 9The flexible board is easily damaged and should be handled with
care.
3-4. Base Unit (BU-K8BD83S-WOD) ................................... 9
3-5. Front Panel Section ......................................................... 10NOTES ON LASER DIODE EMISSION CHECK
3-6. Mechanical Deck (CMAL5Z235A) ................................ 10
3-7. MAIN Board.................................................................... 11The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
3-8. Tuner (FM/AM)............................................................... 11up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
4.TEST MODE..............................................................12
UNLEADED SOLDER
5.MECHANICAL ADJUSTMENTS.......................13Boards requiring use of unleaded solder are printed with the lead-
6.ELECTRICAL ADJUSTMENTS.........................14free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
7.DIAGRAMS
7-1. Block Diagram � CD SERVO Section � ......................... 17
: LEAD FREE MARK
7-2. Block Diagram � MAIN Section � .................................. 18Unleaded solder has the following characteristics.
7-3. Printed Wiring Board � CD Board � ............................... 20
7-4. Schematic Diagram � CD Board � .................................. 21? Unleaded solder melts at a temperature about 40 uC higher
7-5. Printed Wiring Boards � MAIN Section � ...................... 22than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
7-6. Schematic Diagram � MAIN Section (1/2) � .................. 23applied to the solder joint for a slightly longer time.
7-7. Schematic Diagram � MAIN Section (2/2) � .................. 24
7-8. Printed Wiring Board � PANEL Board � ........................ 26Soldering irons using a temperature regulator should be set to
7-9. Schematic Diagram � PANEL Board � ........................... 27about 350 uC.
Caution: The printed pattern (copper foil) may peel away if
7-10. Printed Wiring Boards � DC Section � ........................... 28the heated tip is applied for too long, so be careful!
7-11. Printed Wiring Board � AC Board �................................ 29
7-12. Schematic Diagram � POWER SUPPLY Section � ........ 30? Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
8.EXPLODED VIEWSoccur such as on IC pins, etc.
8-1. Cabinet Section................................................................ 36
8-2. Mechanical Deck Section ................................................ 37? Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
8-3. Panel Board Section ........................................................ 38also be added to ordinary solder.
8-4. Cabinet (Top) Section ...................................................... 39
8-5. MAIN Board Section....................................................... 40
8-6. AC Board, DC Board Section ......................................... 41
9.ELECTRICAL PARTS LIST................................42
Refer to SUPPLEMENT-1 for the MAIN board of printed wiring board,
schematic diagram and electrical parts list of except US and Canadian
models.
When repairing the set of US and Canadian models, refer to either of
original service manual/SUPPLEMENT-1 according to the set.
Refer to SUPPLEMENT-1 for the CD board of printed wiring board,
schematic diagram and electrical parts list of UK and East European
models.
When repairing the set of except UK and East European models, refer to
either of original service manual/SUPPLEMENT-1 according to the set.
Refer to SUPPLEMENT-2 for the HEAD PHONE board of printed wiring
board, schematic diagram and electrical parts list of UK and East European
models.
When repairing the set of except UK and East European models, refer to
either of original service manual/SUPPLEMENT-2 according to the set.
Refer to SUPPLEMENT-3 for the PANEL board of printed wiring board,
schematic diagram and electrical parts list of UK and East European
models.
When repairing the set of except UK and East European models, refer to
either of original service manual/SUPPLEMENT-3 according to the set.
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ACEC
