TABLE OF CONTENTS
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
1. SERVICING NOTE..........................................................4
The laser diode in the optical pick-up block may suffer electrostatic
2. GENERAL..........................................................................break-down because of the potential dif7ference generated by the
charged electrostatic load, etc. on clothing and the human body.
3. DISASSEMBLYDuring repair, pay attention to electrostatic break-down and also
3-1. Loading Panel .......................................................................use the procedure in the printed matter which is included in the8
3-2. Glass ASSY...........................................................................repair parts.8
3-3. Front Panel ...........................................................................The flexible board is easily damaged and should be handled with9
3-4. Main Board and Tuner Unit ..................................................care.9
3-5. CD Mechanism Deck .......................................................... 10
3-6. Back Panel .........................................................................NOTES ON LASER DIODE EMISSION CHECK10
3-7. Disc Table .......................................................................... 11
3-8. Optical Pick-up ...................................................................The laser beam on this model is concentrated so as to be focused on11
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
4. SERVICE MODE.............................................................12
serve from more than 30 cm away from the objective lens.
5. TEST MODE.....................................................................13
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
6. ELECTRICAL ADJUSTMENTS...............................14
Carry out the OS curve check� in OCD section adjustment� and check
7. DIAGRAMS
that the S curve waveform is output two times.
7-1. Circuit Boards Location ...................................................... 16
7-2. Block Diagrams
Y BD Section ....................................................................... 17
Y Main Section .................................................................... 19
7-3. Schematic Diagram � BD Section � ................................... 23
7-4. Printed Wiring Board � BD Section �................................. 25
7-5. Schematic Diagram � Main (1/2) Section �........................ 27
7-6. Schematic Diagram � Main (2/2) Section � ........................ 29
7-7. Printed Wiring Board � Main Section � .............................. 31
7-8. Schematic Diagram � Sub Trans Section � ......................... 33
7-9. Printed Wiring Board � Sub Trans Section � ...................... 34
7-10. Schematic Diagram � Panel Section � ............................. 35
7-11. Printed Wiring Board � Panel Section � ........................... 37
7-12. Schematic Diagram � AMP Section � .............................. 39
7-13. Printed Wiring Board � AMP Section � ........................... 41
7-14. Schematic Diagram � Connector Section �...................... 43
7-15. Printed Wiring Board � Connector Section � ................... 45
7-16. Schematic Diagram � REG Section � .............................. 47
7-17. Printed Wiring Board � REG Section �............................ 49
7-18. IC Block Diagrams ........................................................... 51
7-19. IC Pin Functions ............................................................... 54
8. EXPLODED VIEWS
8-1. Front Panel Section ............................................................. 56
8-2. Chassis Section ................................................................... 57
8-3. Mechanism Deck Section (CDM13B-5BD19) ................... 58
8-4. Base Unit Section (BU-5BD19).......................................... 59
9. ELECTRICAL PARTS LIST........................................60
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ACEC
