TABLE OF CONTENTS
NOTES ON HANDLING THE OPTICAL PICK-UP1. SERVICE NOTEááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá4
BLOCK OR BASE UNIT
2. GENERALáááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá5
The laser diode in the optical pick-up block may suffer electrostatic
3. DISASSEMBYáááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá7
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body4.TEST MODE áááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá.12
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the5. MECHANICAL ADJUSTMENTSááááááááááááááááááááááááááááá16
repair parts.
The flexible board is easily damaged and should be handled with6. ELECTRICAL ADJUSTMENTSááááááááááááááááááááááááááááááá16
care.7. DIAGRAMS
7-1. Circuit Board Locationááááááááááááááááááááááááááááááááááááááááááááááááá23
NOTES ON LASER DIODE EMISSION CHECK7-2. Block Diagramsáááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá25
7-3. Printed Wiring Board BD Sectionááááááááááááááááááááááááááááá28
The laser beam on this model is concentrated so as to be focused on7-4. Schematic Diagram BD Sectionáááááááááááááááááááááááááááááááá29
the disc reflective surface by the objective lens in the optical pic7-5. Printed Wiring Boark-d Main Sectionáááááááááááááááááááááááááá30
7-6. Schematic Diagram Main Section (1/3)áááááááááááááááááááá31
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.7-7. Schematic Diagram Main Section (2/3)áááááááááááááááááááá32
7-8. Schematic Diagram Main Section (3/3)áááááááááááááááááááá33
7-9. Printed Wiring Board Power áááááááááááááááAMP Section34
Laser component in this product is capable7-10. Schematic Diagram Power ááááááááááááááááAMP Section35
of emitting radiation exceeding the limit for7-11. Printed Wiring Board Pááááááááááááááááááááááááanel Section36
7-12. Schematic Diagram Panel Sectionááááááááááááááááááááááááááá37
Class 1.
7-13. Printed Wiring Board Leaf SW Sectionááááááááááááááááááá38
7-14. Schematic Diagram Leaf SW Sectionááááááááááááááááááááá39
7-15. Printed Wiring Board Driáááááááááááááááááááááááver Section40
7-16. Schematic Diagram Driáááááááááááááááááááááááááver Section41
7-17. Printed Wiring Board Video CD Sectionááááááááááááááááá42
7-18. Schematic Diagram Video CD Section (1/2)ááááááááááá43
7-19. Schematic Diagram Video CD Section (2/2)ááááááááááá44
7-20. Printed Wiring Board Poáááááááááááááááááááááááwer Section45
7-21. Schematic Diagram Poááááááááááááááááááááááááááwer Section45
7-22. IC Pin Function Descriptionááááááááááááááááááááááááááááááááááááááá46
This appliance is classified as a CLASS 1 LASER product. The7-23. IC Block Diagramsááááááááááááááááááááááááááááááááááááááááááááááááááááá50
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.8. EXPLODED VIEWS
8-1. Main Sectionááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá54
CAUTION8-2. Panel Sectionáááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááááá55
8-3. Main Board Sectionáááááááááááááááááááááááááááááááááááááááááááááááááááááá56
Use of controls or adjustments or performance of procedures8-4. Tape Mechanism Section (TCM-230PWR11) (1/2)ááááá57
other than those specified herein may result in hazardous radiation
8-5. Tape Mechanism Section (TCM-230PWR11) (2/2)ááááá58
exposure.8-6. CD Mechanism Section (CDM58-K2BD37)ááááááááááááááá59
Notes on chip component replacement9. ELECTRICAL PARTS LISTááááááááááááááááááááááááááááááááááááááá60
Y Never reuse a disconnected chip component.
Y Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Y Keep the temperature of soldering iruon arCound 270
during repairing.
Y Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Y Be careful not to apply force on the conductor when soldering
or unsoldering.
3 |
ACEC
