3. The flat pack-IC on the BOARD is affixed with With Soldering Iron:
glue, so be careful not to break or damage the foil 1. Using desoldering braid, remove the solder from
of each pin or the solder lands under the IC when
all pins of the flat pack-IC. When you use solder
removing it.
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
Hot-air
Desoldering Braid
Flat Pack-ICFlat Pack-IC
Desoldering
Machine
BOARD
Soldering Iron
Masking Flat Pack-IC
Fig. S-1-3
Tape
Tweezers
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
Fig. S-1-2
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
3. Bottom of the flat pack-IC is fixed with glue to the
BOARD; when removing entire flat pack-IC, first
apply soldering iron to center of the flat pack-IC
and heat up. Then remove (glue will be melted).
(Fig. S-1-6)
4. Release the flat pack-IC from the BOARD using
tweezers. (Fig. S-1-6)
1-4-2DVDN_SN |
ACEC
