TABLE OF CONTENTS
The laser component in this product is ca-
pable of emitting radiation exceeding the
limit for Class 1.1. SERVICING NOTE..........................................................3
2. GENERAL..........................................................................4
3. DISASSEMBLY
3-1. Front Panel ........................................................................... 5
3-2. Base Unit (BU-5BD22)......................................................... 5
4. TEST MODE.......................................................................6
This appliance is classified as
a CLASS 1 LASER product.5. ELECTRICAL BLOCK CHECKING..........................8
The CLASS 1 LASER
PRODUCT MARKING is6. DIAGRAMS
located on the rear exterior.6-1. IC Block Diagrams ............................................................. 10
6-2. Circuit Boards Location ...................................................... 13
This caution label is located inside6-3. Printed Wiring Board N BD Section N............................. 15
the unit.6-4. Schematic Diagram N BD Section N ............................... 17
6-5. Printed Wiring Board N Main Section N.......................... 19
6-6. Schematic Diagram N Main Section N ............................ 21
6-7. Printed Wiring Board N Panel Section N ......................... 23
6-8. Schematic Diagram N Panel Section N ............................ 25
6-9. Printed Wiring Board N Loading, HP Section N.............. 27
6-10. Schematic Diagram N Loading, HP Section N .............. 28
6-11. IC Pin Functions ............................................................... 29
7. EXPLODED VIEWS
7-1. Main Section ....................................................................... 33
CAUTION7-2. Mechanism Deck Section (CDM14-5BD22) ...................... 34
Use of controls or adjustments or performance of7-3. Base Unit Section (BU-5BD22).......................................... 35
procedures other than those specified herein may result in
hazardous radiation exposure.8. ELECTRICAL PARTS LIST........................................36
MODEL IDENTIFICATION
Notes on chip component replacement� BACK PANEL �
Y Never reuse a disconnected chip component.
Y Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Y Keep the temperature of soldering iron around 270uCParts No.
during repairing.
Y Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).MODELPARTS No.
Y Be careful not to apply force on the conductor when soldering
or unsoldering.AEP, EE, CIS4-987-946-0
UK4-987-946-1
Y Abbreviation
EE : East European model
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE
WITH MARK ! ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
N 2 N |
ACEC
SONY
