D-FJ210/FJ215
FJ-215 :TABLE OF CONTENTS
AC power adaptor (1)
Headphones/earphones with remote control (1)
Rechargeable batteries (2)Specifications ............................................................................ 1
Battery carrying case (1)
1. SERVICING NOTES...................................................3
2. GENERAL
Locating the Controls......................................................... 3
3. DISASSEMBLY
3-1. Upper Lid ASSY, Cabinet (Upper) Sub ASSY ........... 4
3-2. MD ASSY, Main Board .............................................. 5
3-3. OMotor ASSY (Sled) (M902)�,
Optical Pick-up (DAX-25E),
OMotor ASSY, Turn Table (Spindle) (M901)� ............ 5
4. ELECTRICAL ADJUSTMENS...............................6
DANGER
Invisible laser radiation when open and interlock failed or defeated.
5. DIAGRAMS
Avoid direct exposure to beam.
5-1. Block Diagram �CD SECTION� .............................. 9
5-2. Block Diagram �Tuner SECTION� ........................ 10
CAUTION
5-3. Printed Wiring Boards (FJ215 only) �Side A� .........11
Use of controls or adjustments or performance of procedures other
Printed Wiring Boards (FJ215 only) �Side B� ........ 12
than those specified herein may result in hazardous radiation
5-4. Printed Wiring Boards (FJ210 only) �Side A� ........ 13
exposure.
Printed Wiring Boards (FJ210 only) �Side B� ........ 14
5-5. Schematic Diagram �MAIN SECTION (1/4)� ....... 15
Flexible Circuit Board Repairing
5-6. Schematic Diagram �MAIN SECTION (2/4)� ....... 16
Y Keep the temperature of the soldering iron around 270°C during
5-7. Schematic Diagram �MAIN SECTION (3/4)� ....... 17
repairing.
5-8. Schematic Diagram �MAIN SECTION (4/4)� ....... 18
Y Do not touch the soldering iron on the same conductor of the
5-9. IC Pin Function Description ..................................... 22
circuit board (within 3 times).
Y Be careful not to apply force on the conductor when soldering or
6. EXPLODED VIEWS
unsoldering.
6-1. Cabinet Section ......................................................... 24
6-2. Optical pick-up Section (CDM-3325ER) ................. 25
Notes on chip component replacement
Y Never reuse a disconnected chip component.
Y Notice that the minus side of a tantalum capacitor may be dam-7. ELECTRICAL PARTS LIST...................................26
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
z UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with theCOMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
lead-free mark (LF) indicating the solder contains no lead.
PARTS LIST ARE CRITICAL TO SAFE OPERATION.
(Caution: Some printed circuit boards may not come printed
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
with the lead free mark due to their particular size.)
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
: LEAD FREE MARK
Unleaded solder has the following characteristics.
Y Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
Y Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
Y Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
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ACEC
SONY
