3. The flat pack-IC on the CBA is affixed with glue, soWith Soldering Iron:
be careful not to break or damage the foil of each(1) Using desoldering braid, remove the solder from all
pin or the solder lands under the IC when removingpins of the flat pack-IC. When you use solder flux
it.which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Hot-air
Flat Pack-ICFlat Pack-ICDesoldering Braid
Desoldering
Machine
CBA
Masking
Flat Pack-ICTapeSoldering Iron
TweezersFig. S-1-3
Fig. S-1-2
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA con-
tact pads as shown in Fig. S-1-5
1-4-2DVD_NOTE |
ACEC
FUNAI
