3-4. SCAN IC(Y DRV B/D: IC1~8) Damage(4) In case of shorting the SCAN IC output by a dust, foreign
substance, it may overlap two horizontal lines on screen.
(1) In case of SCAN IC poor, one horizontal line may open atOTest Point: ICT measurance of GND~Y DRV B/D output
OWave format: As shown below figure.
screen.
OTest Point: ICT measurance of GND~Y DRV B/D output
OWave format: As shown below figure.
<When SCAN IC output is short>
<When SCAN IC is poor>
(2) Screen may not shown when SCAN IC is damaged by
SCAN IC poor, external electricity or spark.
OTest Point: ICT measurance of GND~Y DRV B/D output
OWave format: Output wave format isnOt output (You can
see the damage for Y DRV B/D Top or BottomOs SCAN
IC)
Section
(3) Screen shaked horizontally when Y DRV B/D Top and
Bottom cable is poor
OTest Point: ICT measurance of GND~Y DRV B/D output
OWave format: As shown below figure.
<When Y DRV B/D Top and Bottom cable is poor>
<SCAN IC Normal Output Wave >
OMeasurance position: SCAN section enlarge the after
measuring output ICT of Y DRV B/D.
(Full White Pattern)
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ACEC
