TABLE OF CONTENTSSERVICING NOTES
1.GENERAL............................................................NOTES ON HANDLING THE OPTICAL PICK-UP4
BLOCK OR BASE UNIT
2.DISASSEMBLY...................................................7
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
3.TEST MODE.......................................................15
by the charged electrostatic load, etc. on clothing and the human
body.
4.MECHANICAL ADJUSTMENTS....................18During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
5.ELECTRICAL ADJUSTMENTSrepair parts.
DECK Section...........................................................The flexible board is easily damaged and should be handled with18
CD Section...............................................................care.21
VIDEO Section.........................................................22
NOTES ON LASER DIODE EMISSION CHECK
6.DIAGRAMS
6-1. IPin Function DescriptionC .......................................The laser beam on this model is concentrated so as to be focused23
6-2. Printed Wiring Boar d NBD SectionN........................on the disc ref33lective surface by the objective lens in the optical
6-3. Schematic Diagram NBD SectionN...........................pick-up bloc35k. Therefore, when checking the laser diode emis-
6-4. Printed Wiring Boar ds NCD MO TOR SectionN......... 37sion, observe from more than 30 cm away from the objective lens.
6-5. Sc hematic Dia gram NCD MO TOR SectionN............. 39
6-6. Printed Wiring Boar ds NVIDEO SectionN.................LASER DIODE AND FOCUS SEARCH OPERA42TION
6-7. Schematic Diagram NVIDEO SectionN.....................CHECK 45
6-8. Schematic Diagram NDECK SectionN...................... 51
6-9. Printed Wiring Boar ds NDECK SectionN..................Carry5 out the OS curv5e check� in OCD section adjustment� and
6-10.Printed Wiring Boar dscheck that the S curve waveforms is output three times.
NMAIN/DECK/POWER SUPPL Y SectionN ............. 58
6-11.Schematic DiagramNotes on chip component replacement
NMAIN/POWER SUPPL Y SectionN ........................Y Never reuse a disconnected c61hip component.
6-12. Shematic Diacgram NP ANEL SectionN.....................Y Notice that the minus side of a tantalum capacitor may be dam-68
6-13. Printed Wiring Boar ds NP ANEL SectionN.................aged by heat.71
6-14.Schematic Diagram
NPOWER AMP/KEY CONTR OL SectionN ..............Fle74xible Circuit Board Repairing
6-15.Printed Wiring Boar dsY Keep the temperature of the soldering iron ar ound 270 uC during
NPOWER AMP/KEY CONTR OL SectionN .............. repairing.77
Y Do not touch the soldering iron on the same conductor of the
7.EXPLODED VIEWS..........................................circuit board (within 3 times).88
Y Be careful not to apply force on the conductor when soldering or
8.ELECTRICAL PARTS LIST.............................unsoldering.97
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ACEC
