DVD PLAYER
DVD-611
DVD-511
SERVICE MANUAL
SERVICE Manual
DVD-611/511
DVD PLAYER CONTENTS
1. Precautions
2. Reference Information
ELECTRONICS
3. Product Specification
4. Disassembly and Reassembly
OPEN/CLOSE
5. Circuit Descriptions
DIGITAL VIDEO
DIGITAL VIDEO
STANDBY/ON
PLAY/PAUSE STOP SKIP
OPEN/
CLOSE
6. Troubleshooting
DVD-611
7. Exploded Views and Parts List
8. Electrical Parts List
9. Block Diagrams
10. PCB Diagrams
11. Wiring Diagram
OPEN/CLOSE
STANDBY/ON
PLAY/PAUSE STOP SKIP
OPEN/
CLOSE
12. Schematic Diagrams
DVD-511
�? Samsung Electronics Co., Ltd. MAR. 2000
Printed in Korea
AH68-00434A
1. Precautions
1-1 Safety Precautions
Any measurements not within the limits specified
1) Before returning an instrument to the customer,
herein indicate a potential shock hazard that must
always make a safety check of the entire instrument,
be eliminated before returning the instrument to
including, but not limited to, the following items:
the customer.
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(READING SHOULD
(1)Protective shields are provided to protect both NOT BE ABOVE
0.5mA)
the technician and the customer. Correctly replace LEAKAGE
DEVICE
all missing protective shields, including any CURRENT
TESTER
UNDER
remove for servicing convenience. TEST
(2)When reinstalling the chassis and/or other as- TEST ALL
sembly in the cabinet, be sure to put back in place EXPOSED METER
SURFACES
all protective devices, including, but not limited to,
2-WIRE CORD
nonmetallic control knobs, insulating fish papers,
adjustment and compartment covers/shields, and ALSO TEST WITH EARTH
isolation resistor/capacitor networks. Do not oper- PLUG REVERSED GROUND
(USING AC ADAPTER
ate this instrument or permit it to be operated with- PLUG AS REQUIRED)
out all protective devices correctly installed and
functioning. Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
(2) Be sure that there are no cabinet openings through
the power supply cord and connect a jumper wire
which adults or children might be able to insert
between the two prongs of the plug. (2) Turn on the
their fingers and contact a hazardous voltage. Such
power switch of the instrument. (3) Measure the
openings include, but are not limited to, excessive-
resistance with an ohmmeter between the
ly wide cabinet ventilation slots, and an improper-
jumpered AC plug and all exposed metallic cabinet
ly fitted and/or incorrectly secured cabinet back
parts on the instrument, such as screwheads,
cover.
antenna, control shafts, handle brackets, etc. When
an exposed metallic part has a return path to the
(3) Leakage Current Hot Check-With the instrument
chassis, the reading should be between 1 and 5.2
completely reassembled, plug the AC line cord
megohm. When there is no return path to the chas-
directly into a 120V AC outlet. (Do not use a isola-
sis, the reading must be infinite. If the reading is
tion transformer during this test.) Use a leakage
not within the limits specified, there is the possibil-
current tester or a metering system that complies
ity of a shock hazard, and the instrument must be
with American National Standards institute (ANSI)
re-pared and rechecked before it is returned to the
C101.1 Leakage Current for Appliances and
customer. See Fig. 1-2.
Underwriters Laboratories (UL) 1270 (40.7). With
the instrumentâ??s AC switch first in the ON position
and then in the OFF position, measure from a
Antenna
known earth ground (metal water pipe, conduit, Terminal
etc.) to all exposed metal parts of the instrument
(antennas, handle brackets, metal cabinets, screw-
heads, metallic overlays, control shafts, etc.), espe-
Exposed
cially any exposed metal parts that offer an electri- Melal Part
cal return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the out- ohm
ohmmeter
let and repeat the test. See Fig. 1-1.
Fig. 1-2 Insulation Resistance Test
Samsung Electronics 1-1
Precautions
2) Read and comply with all caution and safety re- 5) Components, parts, and/or wiring that appear to
lated notes non or inside the cabinet, or on the chas- have overheated or that are otherwise damaged
sis. should be replaced with components, parts and/ or
wiring that meet original specifications.
3) Design Alteration Warning-Do not alter of add to Additionally, determine the cause of overheating
the mechanical or electrical design of this instru- and/or damage and, if necessary, take corrective
ment. Design alterations and additions, including action to remove any potential safety hazard.
but not limited to, circuit modifications and the
addition of items such as auxiliary audio output 6) Product Safety Notice-Some electrical and mechani-
connections, might alter the safety characteristics of cal parts have special safety-related characteristics
this instrument and create a hazard to the user. Any which are often not evident from visual inspection,
design alterations or additions will make you, the nor can the protection they give necessarily be
service, responsible for personal injury or property obtained by replacing them with components rated
damage resulting therefrom. for higher voltage, wattage, etc. Parts that have spe-
cial safety characteristics are identified by shading,
4) Observe original lead dress. Take extra care to an ( )or a ( )on schematics and parts lists. Use
assure correct lead dress in the following areas: of a substitute replacement that does not have the
(1) near sharp edges, (2) near thermally hot parts (be same safety characteristics as the recommended
sure that leads and components do not touch ther- replacement part might created shock, fire and/or
mally hot parts), (3) the AC supply, (4) high voltage, other hazards. Product safety is under review con-
and (5) antenna wiring. Always inspect in all areas tinuously and new instructions are issued whenev-
for pinched, out-of-place, or frayed wiring, Do not er appropriate.
change spacing between a component and the
printed-circuit board. Check the AC power cord for
damage.
1-2 Samsung Electronics
Precautions
1-2 Servicing Precautions
(4) An insulation tube or tape is sometimes used and
CAUTION : Before servicing Instruments covered
some components are raised above the printed
by this service manual and its supplements, read and
wiring board for safety. The internal wiring is
follow the Safety Precautions section of this manual.
sometimes clamped to prevent contact with heat-
ing components. Install such elements as they
Note : If unforseen circument create conflict between
were.
the following servicing precautions and any of the
safety precautions, always follow the safety precau-
(5) After servicing, always check that the removed
tions. Remember: Safety First.
screws, components, and wiring have been in-
stalled correctly and that the portion around the
1-2-1 General Servicing Precautions
serviced part has not been damaged and so on.
Further, check the insulation between the blades of
(1) a. Always unplug the instrumentâ??s AC power cord
the attachment plug and accessible conductive
from the AC power source before (1) re-moving
parts.
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
1-2-2 Insulation Checking Procedure
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
Disconnect the attachment plug from the AC outlet
substitute in parallel with an electrolytic capaci-
and turn the power ON. Connect the insulation resi-
tor in the instrument.
stance meter (500V) to the blades of the attachment
b. Do not defeat any plug/socket B+ voltage inter-
plug. The insulation resistance between each blade of
locks with which instruments covered by this
the attachment plug and accessible conductive
service manual might be equipped.
parts(see note) should be more than 1 Megohm.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all
Note : Accessible conductive parts include metal pan-
solid-state device heat sinks are correctly in-
els, input terminals, earphone jacks, etc.
stalled.
d. Always connect a test instrumentâ??s ground lead
to the instrument chassis ground before connect-
ing the test instrument positive lead. Always
remove the test instrument ground lead last.
Note : Refer to the Safety Precautions section ground
lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servic-
ing, follow the printed or indicated service precau-
tions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength.
When replacing components, use components
which have the same ratings. Components i-enti-
fied by shading, by( ) or by ( ) in the circuit dia-
gram are important for safety or for the characteris-
tics of the unit. Always replace them with the exact
replacement components.
Samsung Electronics 1-3
Precautions
1-3 ESD Precautions
(7) Immediately before removing the protective ma-
Electrostatically Sensitive Devices (ESD)
terials from the leads of a replacement ESD device,
touch the protective material to the chassis or cir-
Some semiconductor (solid state) devices can be dam-
cuit assembly into which the device will be
aged easily by static electricity.
installed.
Such components commonly are called Electrostati-
cally Sensitive Devices(ESD). Examples of typical ESD
CAUTION : Be sure no power is applied to the ch-
devices are integrated circuits and some field-effect
assis or circuit, and observe all other safety precau-
transistors and semiconductor chip components. The
tions.
following techniques should be used to help reduce
the incidence of component damage caused by static
(8) Minimize bodily motions when handling unpack-
electricity.
aged replacement ESD devices. (Otherwise harm-
less motion such as the brushing together of your
(1) Immediately before handling any semiconductor
clothes fabric or the lifting of your foot from a car-
component or semiconductor-equipped assembly,
peted floor can generate static electricity sufficient
drain off any electrostatic charge on your body by
to damage an ESD device).
touching a known earth ground. Alternatively,
obtain and wear a commercially available dis-
charging wrist strap device, which should be
removed for potential shock reasons prior to apply-
ing power to the unit under test.
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conduc-
tive surface such as aluminum foil, to prevent elec-
trostatic charge buildup or exposure of the assem-
bly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as
â?�anti-staticâ?ť can generate electrical charges suffi-
cient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage
ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically short-
ed together by conductive foam, aluminum foil or
comparable conductive materials).
1-4 Samsung Electronics
Precautions
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer elec- WRIST-STRAP
trostatic breakdown because of potential static elec- FOR GROUNDING
tricity from clothing and your body.
1M
The following method is recommended. THE UNIT
(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.) CONDUCTIVE SHEET
1M
(2) Place the set on the conductive sheet so that the
Fig.1-3
chassis is grounded to the sheet.
(6) Short the short terminal on the PCB, which is in-
(3) Place your hands on the conductive sheet(This
side the Pick-Up ASSâ??Y, before replacing the Pick-
gives them the same ground as the sheet.)
Up. (The short terminal is shorted when the Pick-
Up Assâ??y is being lifted or moved.)
(4) Remove the optical pick up block
(7) After replacing the Pick-up, open the short termi-
(5) Perform work on top of the conductive sheet. Be
nal on the PCB.
careful not to let your clothes or any other static
sources to touch the unit.
Be sure to put on a wrist strap grounded to the
sheet.
Be sure to lay a conductive sheet made of copper etc.
Which is grounded to the table.
Samsung Electronics 1-5
Precautions
1-5 Pick-up disassembly and reassembly
1-5-1 Disassembly 1-5-2 Assembly
1) Remove the power cable. 1) Replace the Pick-up.
2) Switch SW3 on deck PCB to â?�OFFâ?ť before 2) Assemble the deck PCB.
removing the FPC. 3) Reassemble the deck.
( Inserted into Main PCB DCN1. See Fig. 1-4) 4) Insert FPC into Main PCB DCN1 and switch SW3 on
3) Disassemble the deck. deck PCB to â?�ONâ?ť. (See Fig 1-4)
4) Disassemble the deck PCB.
Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.
FPC
TO MAIN PCB
(DCN1)
Fig. 1-4
1-6 Samsung Electronics
2. Reference Information
2-1 IC Descriptions
2-1-1 AIC1 (AK4393 ; Digital-to-Analog Converter)
DVSS CKS2
1 28
Left Channel
DVDD CKS1
2 27
Right Output +
De-emphasis 8X Multi-bit �?â?� Switched
Serial MCLK CKS0
3 26
Right Output -
Soft Mute Interpolator Modulator Capacitor Filter
Input Control PD P/S
4 25
Serial BICK VCOM
Left/Right Clock 5 24
Input SDATA AOUTL+
6 23
Bit Clock Interface LRCK AOUTL-
7 22
SMUTE AOUTR+
Left Output +
Serial Data 8 21
De-emphasis 8X Multi-bit �?â?� Switched
DFS AOUTR-
Left Output - 9 20
Soft Mute Interpolator Modulator Capacitor Filter
DEM0 AVSS
10 19
Right Channel
DEM1 AVDD
11 18
Power Down
DIF0 VREFH
12 17
Control
Soft Mute
DIF1 VREFL
De-emphasis 13 16
Register Clock Divider
Double Control DIF2 BVSS
14 15
Speed Select
Master Clock Clock Control
No. Pin Name I/O Pin Function and Description
1 DVSS - Digital Ground. Digital ground is 0V.
2 DVDD - Digital Supply. 3.3V or 5.0V nominal.
3 MCLK I Master Clock Input.
4 PD I Power-down and Reset. When low the AK4393 is in Power-down Mode and held in reset.
The AK4393 should always be reset after power-up.
5 BICK I Audio Serial Data Clock Input. A clock input of 64fs or more is recommended.
6 SDATA I Serial Data Input.
7 LRCK I Left/Right Clock Input. Defines the sampling rate, Fs.
8 SMUTE I Soft Mute Input or Chip Select Input. If the P/S pin (pin 25) is high, SMUTE controls the
(or CS) soft mute function as follows:
- When SMUTE goes high, the soft mute cycle is initiated.
- When SMUTE goes low, the output mute is slowly released.
If the P/S pin is low, SMUTE is the Chip Select Input for the Serial Control Mode. Chip
select is active when SMUTE is low.
9 DFS I Double Sampling Speed Input. When low, this pin defines the Normal Speed Mode, and
128 x Fs oversampling is implemented. When high, the DFS pin defines the Double Speed
Mode, implemented with 64 x Fs oversampling. This pin features an internal pull-down.
10 DEM0 I De-emphasis Enable #0 or Control Data Clock Input. If the P/S pin (pin 25) is high,
(or CCLK) DEM0 is used to select the De-emphasis Mode according to Table 3. If the P/S pin os low
DEM0 is the clock input for the Serial Control Mode.
11 DEM1 I De-emphasis Enable #1 or Control Data Input. If the P/S pin (pin 25) is high, DEM1 is
(or CDTI) used to select the De-emphasis Mode according to Table 3. If the P/S pin is low, DEM1 is
the control data input for the Serial Control Mode.
12 DIF0 I Digital Input Format Select #0.
13 DIF1 I Digital Input Format Select #1.
14 DIF2 I Digital Input Format Select #2.
15 BVSS - Substrate Ground Pin. Substrate ground is 0V.
16 VREFL I Low Level Voltage Reference Input. Normally connected to analog ground.
17 VREFH I High Level Voltage Reference Input. Normally connected to analog supply.
18 AVDD - Analog Supply. Analog supply is 5V nominal.
19 AVSS - Analog Ground. Analog ground is 0V.
20 AOUTR- O Right Channel Negative Output.
21 AOUTR+ O Right Channel Positive Output.
22 AOUTL- O Left Channel Negative Output.
23 AOUTL+ O Left Channel Positive Output.
24 VCOM O Common Voltage Output. Common voltage output is 2.6V nominal.
25 P/S I Parallel/Serial Control Mode Select Input. If Low, the Serial Control Mode is
implemented. If High, the Parallel Control Mode is selected. This pin has an internal
pull-up.
26 CKS0 I Master Clock Select #0.
27 CKS1 I Master Clock Select #1.
28 CKS2 I Master Clock Select #2.
Samsung Electronics 2-1
2-2
Reference Information
T o MICOM (15)
MDAT[7:0]_BI , MRZA_IN, ZCS_IN, M W R_IN,
T o RF (9)
PW MO[ 7:0]_OUT, BCARZ_IN MRD_IN, ZIRQZD_OUT, ZW AI T_OUT, ZRST_IN
Fr om 16-8
32BIT S R Descrambler
Servo (3) DEMOD MICOM I/F
EFMI_IN
PL CK_IN
FG_ IN
(6,4,3)
Frame Sync EDC
2-1-2 DIC1 (KS1453 ; Data Processor)
DE T/PROT/INS ECSY efm wr ID ECC
T o DRAM
(17.57KHz)
256K*16
(6,4,3)
26 .1 6MHz (208,192,17) (32)
trans ID ECC DD[1 5:0]_BI
(182,172,11)
X -t al (4) VCO Tim ing DADR[8:0]_ OUT
XTI_ IN X -tal & Tim ing ECC
Generator ZRAS _OUT
XTO_ OUT Generator
ZUCAS _OUT
17 .58KHz= 26 .1 6M/1 488
CK33MI_IN 67 6.08Hz
Deinterleave ZLCAS _ OUT
CK33MO_ OUT RFCK 1 7.58/7 .3 5KHz M ZOE [ 1 :0 ]_OUT
&
7 5Hz
7.3 5KHz= 4 .3 218M/588 ZW E[ 1:0]_OUT
RAM Control
To VCO Tim ing (32,28,5)
DVD CLV/CAV
S er vo (6) T o AV (13)
Generator (28,24,5)
M ON_OUT M SDATA[ 0]_OUT/
CIRC
W FCK 17 .58/7.3 5KHz
M DP_OUT CDATA
DVDP,
M DS_OUT CD CLV/CAV SDATA[ 1]_OUT/L RCK
SQ-V CD
FSW _OUT Frame Sync SDATA[ 2]_OUT/B CLK
PLLLOCK_ DET/PROT/INS SDATA[ 3]_OUT/C2PO
EFM
OUT V-C D ,CD -D A SDATA[ 4]_OUT/S Q DT
(7.35KHz) DEMOD
SERLOCK_ M M SDATA[ 5]_OUT/W FSY
OUT SDATA[ 6]_OUT/S 0 S1
SDATA[ 7]_BI /SQ CK
DATREQ _ IN
CD- G
SUBCODE I/F
23BIT SR CSTROB E _ OUT
DTER_OUT
DATACK_OUT
TOS _ OUT
Mon i tor (9) Pow er (34)=VDD(11)+GND(23) T es t Pin (3)
GFS_OUT, FRSY Z_ OUT, TX_OUT, EFM O_ OUT, TES T0_IN, TES T1_IN, TES T2_IN
W FCK_ OUT, RFCK_ OUT, CK1 6M_OUT, DEMPHA_ OUT
CLVLOCK_ OUT
Samsung Electronics
No. Pin Name Description I/O
No. Pin Name Description I/O Notes Notes
1 DVSS Digital GND (0 V) 65 SDATA5_OUT DVD Data/Subcode Frame Sync (WFSY) O AV Decoder
2 ZCS_IN Chip Select (Active Low) I MICOM 66 SDATA6_OUT DVD Data/Subcode Block Sync (S0S1) O AV Decoder
3 MRZA_IN Micom Register Select (L REGISTER H �?? DATA) I MICOM 67 SDATA7_BI DVD Data/Subcode Serial Clock (SQCK) B AV Decoder
4 DVSS Digital GND (0 V) 68 DVSS Digital GND (0 V)
5 MDAT7_BI MICOM Data Bus B MICOM 69 CSTROBE_OUT Data Strobe (Clock) Output O AV Decoder
6 MDAT6_BI MICOM Data Bus B MICOM 70 DATREQ_IN Data Request from A/V Decoder or ROM Decoder I AV Decoder
7 MDAT5_BI MICOM Data Bus B MICOM 71 DTER_OUT DVD Data Error Output O AV Decoder
8 MDAT4_BI MICOM Data Bus B MICOM 72 DVSS Digital GND (0 V)
Samsung Electronics
9 MDAT3_BI MICOM Data Bus B MICOM 73 PWMO7_OUT PWM Output Signal O RF
10 MDAT2_BI MICOM Data Bus B MICOM 74 PWMO6_OUT PWM Output Signal O RF
11 MDAT1_BI MICOM Data Bus B MICOM 75 PWMO5_OUT PWM Output Signal O RF
12 MDAT0_BI MICOM Data Bus B MICOM 76 PWMO4_OUT PWM Output Signal O RF
13 DVDD Digital Power (+5V) 77 DVDD Digital Power (+5 V)
14 XTI_IN System Clock Input for 26.16 MHz I XTAL 78 PWMO3_OUT PWM Output Signal O RF
15 XTO_OUT System Clock Output for 26.16 MHz O XTAL 79 PWMO2_OUT PWM Output Signal O RF
16 DVSS Digital GND (0 V) 80 PWMO1_OUT PWM Output Signal O RF
17 DD15_BI DRAM Data Bus B DRAM 81 PWMO0_OUT PWM Output Signal O RF
18 DD0_BI DRAM Data Bus B DRAM 82 DVSS Digital GND (0 V)
19 DD14_BI DRAM Data Bus B DRAM 83 DVSS Digital GND (0 V)
20 DD1_BI DRAM Data Bus B DRAM 84 DVSS Digital GND (0 V)
21 DVSS Digital GND (0 V) 85 DVDD DIGITAL Power (+5 V)
22 DD13_BI DRAM Data Bus B DRAM 86 DVDD DIGITAL Power (+5 V)
DRAM Address Bus
23 DD2_BI DRAM Data Bus B DRAM 87 DVSS Digital GND (0 V)
24 DD12_BI DRAM Data Bus B DRAM 88 DVSS Digital GND (0 V)
25 DD3_BI DRAM Data Bus B DRAM 89 DVSS Digital GND (0 V)
26 DVDD Digital Power (+5 V) 90 DVSS Digital GND (0 V)
27 DD11_BI Digital Data Bus B DRAM 91 FRSYZ_OUT Frame Sync Out O Monitor
28 DD4_BI Digital Data Bus B DRAM 92 TX_OUT Digital Out O Monitor
29 DD10_BI Digital Data Bus B DRAM 93 GFS_OUT Good Frame Sync Detection State Output (OK at H) O Monitor
30 DD5_BI Digital Data Bus B DRAM 94 DVSS Digital GND (0 V)
31 DVSS Digital GND (0 V) 95 CK33MI_IN System Clock Input for 33.8688 MHz I X-tal
32 DD9_BI DRAM Data Bus B DRAM 96 CK33MO_OUT System Clock Output for 33.8688 MHz O X-tal
33 DD6_BI DRAM Data Bus B DRAM 97 DVDD Digital Power (+5 V)
34 DD8_BI DRAM Data Bus B DRAM 98 TEST0_IN Test Mode Selection Terminal I
35 DD7_BI DRAM Data Bus B DRAM 99 TEST1_IN Test Mode Selection Terminal I
36 DVSS Digital GND (0 V) 100 TEST2_IN Test Mode Selection Terminal I
37 ZLCAS_OUT DRAM Low Column Address Strobe O DRAM 101 EFMO_OUT EFM Out O Monitor
38 ZUCAS_OUT DRAM Upper Column Address Strobe O DRAM 102 WFCK_OUT Write Frame Pulse O Monitor
39 ZWE1_OUT DRAM Write Enable 1 (8M ONLY) O DRAM 103 RFCK_OUT Reference Frame Pulse O Monitor
40 ZWE0_OUT DRAM Write Enable 0 (4M, 8M, 16M) O DRAM 104 PLCK_IN Phase Locked Clock I Servo
41 ZOE1_OUT DRAM Output Enable 1 (16M MODE DADR9) O DRAM 105 DVSS Digital GND (0 V)
42 DVDD Digital Power (+5 V) 106 PLLLOCK_OUT Lock Signal for PLL O Servo
43 ZOE0_OUT DRAM Output Enable 0 O DRAM 107 CLVLOCK_OUT Lock Signal for CLV O Monitor
44 ZRAS_OUT DRAM Row Address Strobe O DRAM 108 SERLOCK_OUT Lock Signal for SERVO O Servo
45 DADR8_OUT O DRAM 109 MDP_OUT Spindle Motor Phase Control Signal (3-STATE) O Servo
46 DADR7_OUT DRAM Address Bus O DRAM 110 MDS_OUT Spindle Motor Speed Control Signal (3-STATE) O Servo
47 DVSS Digital GND (0 V) 111 DVSS Digital GND (0 V)
48 DADR0_OUT DRAM Address Bus O DRAM 112 DVSS Digital GND (0 V)
49 DADR6_OUT DRAM Address Bus O DRAM 113 MON_OUT Spindle Motor Output Filter Switching Output O Servo
50 DADR1_OUT DRAM Address Bus O DRAM 114 FG_IN Reference Signal for CAV I Servo
51 DADR5_OUT DRAM Address Bus O DRAM 115 FSW_OUT Spindle Motor Output Filter Switching Output (3-STATE) O Servo
52 DADR2_OUT DRAM Address Bus O DRAM 116 EFMI_IN EFM/EFM+ Signal Input I Servo
Notes
53 DADR4_OUT DRAM Address Bus O DRAM 117 DVDD Digital Power (+5 V)
54 DADR3_OUT DRAM Address Bus O DRAM 118 DVDD Digital Power (+5 V)
55 DVSS Digital GND (0 V) 119 DVDD Digital Power (+5 V)
56 DVSS Digital GND (0 V) 120 CK16M_OUT CK33Ms 2 Division Clock / 16.9344 MHz O Monitor
57 TOS_OUT Top of Sector O AV Decoder 121 DEMPHA_OUT HIGH , when on Deemphasis O Monitor
58 DATACK_OUT Data Acknowledge Signal Output O AV Decoder 122 BCARZ_IN BCA Input Signal I RF
59 DVDD DIGITAL Power (+5 V) 123 DVSS Digital GND (0 V)
60 SDATA0_OUT DVD Data/CD Data Bit Stream (CDATA) O AV Decoder 124 ZRST_IN Hardware Reset (Active Low) I MICOM
61 SDATA1_OUT DVD Data/CD Data L/R Clock (LRCK) O AV Decoder 125 ZWAIT_OUT Micom Read / Write Access Wait (Wait at L) O MICOM
62 SDATA2_OUT DVD Data/CD Data Bit Clock (BLCK) O AV Decoder 126 ZIRQZD_OUT Interrupt Request to Micom O MICOM
63 SDATA3_OUT DVD Data/CD Data Error Flag (C2PO) O AV Decoder 127 MRD_IN Micom Read Strobe (Active Low) I MICOM
64 SDATA4_OUT DVD Data/Subcode Serial Data (SQDT) O AV Decoder 128 MWR_IN Micom Write Strobe (Active Low) I MICOM
2-3
Reference Information
Reference Information
2-1-3 DIC2 (KM416C254D ; CMOS 4M DRAM)
WE
CASL CAS DATA-IN BUFFER
CONTROL
LOGIC IO0
CASH
16
NO.2 CLOCK IO15
GENERATOR
DATA-OUT
BUFFER
COLUMN OE
9 COLUMN
ADDRESS 9
DECODER
BUFFER 16
D0
512
D1 8 8
REFRESH
D2 SENSE AMPLIFIERS
CONTROLLER
VO GATING
D3
D4 512x16
REFRESH
D5 COUNTER
D6
D7 9
DECODER
D8
ROW
512x512x16
ROW.
MEMORY
512
9 9
ADDRESS
ARRAY
BUFFERS(9)
NO.1CLOCK
RAS GENERATOR
Vcc
Vss
2-4 Samsung Electronics
Reference Information
PIN NO. SYM. TYPE DESCRITION
16~19, 22~26 A0~A8 Input Address Input
14 RAS Input Row Address Strobe
28 CASH Input Column Address Strobe/Upper Byte Control
29 CASL Input Column Address Strobe/Lower Byte Control
13 WE Input Write Enable
27 OE Input Output Enable
2~5, 7~10, 31~34, 36~39 I/O0~I/O15 Input/Output Data Input/Output
1, 6, 20 Vcc Supply Power, 5V
21, 35, 40 Vss Ground Ground
11, 12, 15, 30 NC - No Connect
Samsung Electronics 2-5
Reference Information
2-1-4 MIC1 (TMP95C265 ; Main Micom)
AND~AN2 900/H CPU VCC [3]
(PA0~PA2)
VSS[3]
AN3/ADTRG
XWA WA
(PA3)
XBC BC
10BIT 8CH
AN4~AN7
X1
A/D DE
XDE
(PA4~PA7) OSC
CONVERTER X2
VREFH XHL HL
VREFL XIX IX
AVCC CLK
XIY IY
AV55
AM8/16
XIZ IZ
EA
XSP SP
8BIT 2CH RESET
32bit
A/D
DAOUT0,1
SR F
CONVERTER (P00~P07)
PORT0
D0~D7 *
PC
TxD0(P80) SERIAL I/O PORT1 (P10~P17)
RxD0(P81) (CH. 0)
D8~D15
SCLK0/CT50(P82) WATCHDOG
TIMER
TxD1(P83)
SERIAL I/O
(P20~P27)
PORT2
RxD1(P84) (CH. 1)
A15~A23 *
SCLK1/CT51(P85)
TxD2(P86) SERIAL I/O
RxD2(P87) PORT3 (P30~P37)
(CH. 2)
SCLK2/CT52(P57) A8~A15 *
2KB ROM
PORT4 (P40~P47)
A0~A7 *
8BIT TIMER
T10/INT(P70) (TIMER 0)
RD(P50)*
WR(P51)*
8BIT TIMER HWR(P52)
PORT5
TO1(P71)
(TIMER 1)
BUSRQ(P53)
BUSAK(P54)
8BIT TIMER WAIT(P55)
(TIMER 2) CS/WAIT C50(P60)
CONTROLLER C51(P61)
8BIT TIMER (4-BLOCK) C52(P62)
TO3/INT2(P72)
(TIMER 3) C53(P63)
NIMI
8BIT TIMER INTERRUPT
T14/INT3(P73) (TIMER 4) 64KB ROM CONTROLLER INTO(P56)
8BIT TIMER
TO5(P74) (TIMER 5)
T18/INT5(P90)
16BIT TIMER T19/INT6(P91)
8BIT TIMER (TIMER 8) TO8(P92)
(TIMER 6)
TO9(P93)
TIA/INT7(P94)
16BIT TIMER
8BIT TIMER Not included in TIB/INT8(P95)
TO7/INT4(P75)
(TIMER 7) TMP95C265 (TIMER 9) TOA/TOB(P96)
2-6 Samsung Electronics
NO PORT NAME ASSIGNED NAME DESCRIPTION TYPE REMARK NO PORT NAME ASSIGNED NAME DESCRIPTION TYPE REMARK
1 VREFL DGND A/D Ref Input(L) I DGND 51 D6 HAD6 Data6 I/0
2 AVss DGND A/D Ref Input - DGND 52 D7 HAD7 Data7 I/0
3 AVcc 5D A/D VCC Input - 5D 53 P10 CLSW Close Switch I DECK
4 DAOUT0 MTP1 0 NC 54 P11 OPSW Open Swithc I DECK
5 DAOUT1 MPT2 0 NC 55 P12 MTP8 Reserved I/0 0 NC
Samsung Electronics
6 /NMI - PULL-UP I 56 P13 MTP9 Reserved I/0 0 NC
7 P53 CSB D. Servo IC Chip Select 0 KS1452(10) 57 P14 MTP10 Reserved I/0 0 NC
58 P15 MTP11 Reserved I/0 0 NC
8 P54/BUSAK MTP3 0
59 P16 MTP12 Reserved I/0 0 NC
9 /WAIT /MWAIT /Wait(ZiVA, DSP) I /MWait
60 P17 MTP13 Reserved I/0 0 NC
10 P56 DVD/CD DVD/CD RF AGC Gain Select 0 RF(KS1461)
61 AM8/16 AM8 Address Mode(H:8 BIT MODE) I VCC
11 SCLK2 SCLK Serial Data Clock I FRONT
62 Vss DGND - GND
12 P80/TXD0 MD RF Contrl Data 0 KS1461(69)
63 Vcc 5D - VCC
13 P81/RXD0 STB RF Data Latch I/0 KS1461(71)
64 A23 HA23 SERVO /RD Strobe Mask Signal 0 74HCOO(5)
14 P82/SCLKO MC RF Control Clock 0 KS1461(70)
65 P26/A22 MRP14 Reserved Address Port 0 NC
15 P83/TXD1 MTP5 0 NC
66 P25/A21 MRP15 Reserved Address Port 0 NC
16 P84/RXD1 MTP6 0 NC
67 P24/A20 MRP16 Reserved Address Port 0 NC
17 P85/SCLK1 MTP4 0 NC
68 A19 HA19 Address 19 0 EPROM, SRAM ADDRESS
18 TXD2 RXD Serial Data Output 0 FRONT
69 A18 HA18 Address 18 0 EPROM, SRAM ADDRESS
19 RXD2 TXD Serial Data Input I FRONT
70 A17 HA17 Address 17 0 EPROM, SRAM ADDRESS
20 CSO /CSO EPROM(M27C801) Select 0 EPROM(M27C801)
71 A16 HA16 Address 16 0 EPROM, SRAM ADDRESS
21 CS1 /CS1 SRAM(KM681000) Select 0 SRAM(KM681000)
72 A15 HA15 Address 15 0 EPROM, SRAM ADDRESS
22 CS2 /DVD1CS AVDecoder(ZiVA4) Select 0 AVDecoder(ZiVA4)
73 A14 HA14 Address 14 0 EPROM, SRAM ADDRESS
23 CS3 /DSPCS Data Processor(KS1453) Select 0 Data Processor(KS1453)
74 A13 HA13 Address 13 0 EPROM, SRAM ADDRESS
24 CLK CLK CLOCK OUTPUT (System Clock 2) 0 fc/2
75 A12 HA12 Address 12 0 EPROM, SRAM ADDRESS
25 Vcc 5D - VCC
76 A11 HA11 Address 11 0 EPROM, SRAM ADDRESS
26 Vss GDND GND - GND
77 A10 HA10 Address 10 0 EPROM, SRAM, Zlva Adrs
27 X1 X1 High Frequency OSC in I
20MHz
78 A9 HA9 Address 9 0 EPROM, SRAM, Zlva Adrs
28 X2 X2 High frequency OSC out 0
79 A8 HA8 Address 8 0 EPROM, SRAM, Zlva Adrs
29 /EA /EA Internal ROM Less Mode I GND
80 A7 HA7 Address 7 0 EPROM, SRAM ADDRESS
30 /REST /MRST Master reset from FRONT I FRONT, IC
81 A6 HA6 Address 6 0 EPROM, SRAM ADDRESS
31 INT1 SRQ Interrupt from Front Micom I FRONT
82 A5 HA5 Address 5 0 EPROM, SRAM ADDRESS
32 P71 RRQ Request to Front Micom 0 FRONT
83 A4 HA4 Address 4 0 EPROM, SRAM ADDRESS
33 P72 SCL EEPROM CLOCK 0 KS24C020(6)
84 A3 HA3 Address 3 0 EPROM, SRAM ADDRESS
34 P73 SDA EEPROM DATA I/O 0 KS24C020(5)
85 A2 HA2 Address 2 0 EPROM, SRAM ADDRESS
35 P74 OPEN Tray Out Motor Control Output 0 DRIVER(0PIN-, 16)
86 A1 HA1 Address 1(SERVO DAB) 0 EPROM, SRAM ADDRESS
36 P75 CLOSE Tray In Motor Control Output 0 DRIVER(0PIN-, 17)
87 A0 HA0 Address 0(DSP DAB) 0 EPROM, SRAM ADDRESS
37 INT5 FGINT Interrupt from Spindle Motor FG I DRIVER(FG, 2)
88 /RD /RD /Read Strobe 0 /Read
38 P91 ACT MUTE Driver IC MUTE(Actuator) 0 DRIVER(MUTE4, 37)
89 /WR /WR /Write Strobe 0 /Write
39 P92 M/D MUTE Driver IC MUTE(Spindle) 0 DRIVER(MUTE3, 38)
90 P52 RSTB RF&Servo IC Reset 0 KS1461 (73), KS1452 (9)
40 P93 ZRST DSP H/W reset 0 KS1453(124)
91 Vss DGND - DGND
41 INT7 /DVDINT Interrupt from AV-DEC I INV(ZiVA-4(51))
92 PA0 RFRP Tracking Lock monitir from SERVO I KS1452 (7)
42 INT8 /DSPINT Interrupt from DSP I INV(KS1453(126))
93 PA1 TILTO Monitor signal I KS1452 (69)
43 P96 ZIVA_RST AV Decoder Reset(Active H:4.0, L:4.1) 0 ZiVA-4(52)
94 PA2 MTP17 Reserved I I NC
44 Vcc 5D
95 PA3 SENSE SENSE monitor from SERVO I KS1452 (22)
45 D0 HAD0 Data 0 I/0
96 PA4 FR Spindle direcrion from SP Driver I BA6849FP (20)
46 D1 HAD1 Data 1 I/0
97 PA5 SLOCK LOCK monitor from DSP I KS1453 (108)
47 D2 HAD2 Data 2 I/0
98 PA6 FOKB Focus lock monitor from RF I KS1461 (48)
48 D3 HAD3 Data 3 I/0
99 PA7 RFO RF sum signal (Analog Lnput) I RFO
49 D4 HAD4 Data 4 I/0
100 VREFH 5D A/D Ref Input (H) I 5D
50 D5 HAD5 Data 5 I/0
2-7
Reference Information
Reference Information
2-1-5 MIC2 (M27C801 ; 8Mbit (1Mbx8) UVEPROM and OTP EPROM)
LOGIC DIAGRAM
Vcc
8
20
A0-A19 A0-Q7
E
GVpp
Vss
TOP VIEW
FUNCTION
NAME
32 Vcc
A19 1
A16 31 A18
2 A0-A19 Address Inputs
30 A17
A15 3
Data Outputs
Q0-Q7
29 A14
A12 4
Chip Enable
E
28 A13
A7 5
27 A8 Output Enable/Program Supply
A6 6 OVpp
26 A9
A5 7
Vcc Supply Voltage
25 A11
A4 8
Vss Ground
24 GVPP
A3 9
23 A10
A2 10
22 E
A1 11
21 Q7
A0 12
20 Q6
Q0 13
19 Q4
Q1 14
18 Q4
Q2 15
17 Q3
Vss 16
2-8 Samsung Electronics
Reference Information
2-1-6 MIC3 (KM681000C ; CMOS 1M SRAM)
BLOCK DIAGRAM
Clk gen. Precharge circuit.
VCC
A4
VSS
A5
A6
A7 Memory array
Row 1024 rows
A8
select 128�? 8 columns
A12
A13
A14
A15
A16
I/O Circuit
Data
I/O1
cont Column select
I/O8
Data
cont
A0 A1 A2 A3 A9 A10 A11
CS1
Control
CS2
logic
WE
OE
TOP VIEW Name Function Name Function
CS1,CS2 Chip Select Inputs I/O1~I/O8 Data Inputs/Out-
VCC
N.C 1 32
OE Output Enable Vcc Power
A15
A16 2 31
CS2
A14 3 30
WE Write Enable Vss Ground
WE
A12 4 29
A0~A16 Address Inputs N.C No Connection
A13
A7 28
5
A8
A6 27
6
A9
A5 26
7
A11
A4 25
8
OE
24
A3 9
A10
23
A2 10
CS1
22
A1 11
I/O8
21
A0 12
I/O7
20
I/O1 13
19 I/O6
I/O2 14
18 I/O5
I/O3 15
17 I/O4
VSS 16
Samsung Electronics 2-9
Reference Information
2-1-7 FIC1 (LC86P6232 ; Front Micom)
IR PLA
ROM
Interrupt Control
Stand-by Control
CF BUS PC
Clock
RC
Generator
Xâ??tal
ACC
Base Timer Bus Interface B Reg
SIO 0 Port 1 C Reg
SIO 1 Port 7
Timer 0 Port 8
BUS
ALU
Timer 1 Port 2
ADC Port 3
Port 4
INT0-3
PSW
Noise Filter
Port 5
PWM 1 RAR
Real Time
Service
RAM
XRAM
Stack Pointer
(128 bytes)
VFD Controller
PORT 0
Watch Dog Timer
High Voltage
Output
2-10 Samsung Electronics
NO PORT NAME TYPE ASSIGNED NAME DESCRIPTION REMARK
NO PORT NAME TYPE ASSIGNED NAME DESCRIPTION REMARK
51 S18 - SEG7 FLT SEGMENT CONTROL FLT
1 P52 0 MRST Front end reset RESET
52 S19 - SEG8 FLT SEGMENT CONTROL FLT
2 PWM1 - TP1 NC
53 S20 - SEG9 FLT SEGMENT CONTROL FLT
3 P20 0 CS1 Chip Select 1 AK4393
54 S21 0 SEG10 FLT SEGMENT CONTROL FLT
4 P21 0 CCLK Control Data Clock AK4393/AK4356
55 S22 0 SEG11 FLT SEGMENT CONTROL FLT
5 P22 0 CDTI Control Data AK4393/AK4356
Samsung Electronics
56 S23 0 SEG12 FLT SEGMENT CONTROL FLT
6 P23 0 CS2 Chip Select 2 AK4356
57 S24 0 SEG13 FLT SEGMENT CONTROL FLT
7 P24 0 DARST PD(Power Down) AK4393
58 S25 0 SEG14 FLT SEGMENT CONTROL FLT
8 P25 0 DARST 1 PD(Power Down) AK4356
59 S26 0 SEG15 FLT SEGMENT CONTROL FLT
9 P26 0 VMUTE0 BA7660 MUTE(VIC2) VIDEO(RESERVED)
60 S27 0 SEG16 FLT SEGMENT CONTROL FLT
10 P27 0 VMUTE1 BA7660 MUTE(VIC1) VIDEO(RESERVED)
61 S28 0 SEG17 FLT SEGMENT CONTROL FLT
11 TEST1 - TP4 NC
62 S29 0 SEG18 FLT SEGMENT CONTROL FLT
12 *RES I *RES Reset
63 S30 0 SEG19 FLT SEGMENT CONTROL FLT
13 XT1 - GND Low Frequency OSC in
64 S31 0 SEG20 FLT SEGMENT CONTROL FLT
14 XT2 - TP5 Low Frequency OSC out
65 P00 I MODE4 HARDWARE MODE SELECT MARKET CODE
15 VSS - GND
66 P01 I MODE3 HARDWARE MODE SELECT MARKET CODE
16 CF1 I - High Frequency OSC in
67 P02 I MODE2 HARDWARE MODE SELECT MARKET CODE
17 CF2 0 - High Frequency OSC out
68 P03 I MODE1 HARDWARE MODE SELECT MARKET CODE
18 VDD - VDD
69 P04 I MODE0 HARDWARE MODE SELECT MARKET CODE
19 ANO/P8 0 I ECHO_VR ECHO volume A/D input KARAOKE
70 P05 - TP10 NC
20 AN1/P8 1 I MIC_DET MIC detect KARAOKE
71 P06 - TP11 NC
21 AN2/P8 2 - TP19 NC
72 P07 -- NC
22 AN3/P8 3 I KEY0 KEY SCAN TACT SW
73 P10/S0 0 0 TXD SERIAL DATA OUT SERIAL DATA OUT
23 AN4/P8 4 I KEY1 KEY SCAN TACT SW
74 P11/S1 0 I RXD SERIAL DATA IN SERIAL DATA IN
24 AN5/P8 5 I KEY2 KEY SCAN TACT SW
75 P12/SC K0 0 SCLK SERIAL CLOCK SERIAL CLOCK
25 AN6/P8 6 - NC
76 P13/S0 1 - TP12 NC
26 AN7/P8 7 - NC
77 P14/SI 1 - TP13 NC
27 P70/IN TO I RRQ Request to Front Micom MAIN MICOM
78 P15/SC K1 - TP14 NC
28 P71/IN T1 - TP25 NC
79 P16/BU Z - TP15 NC
29 P72/IN T2 - TP26 NC
80 P17/PW MO - TP16 NC
30 P73/IN T3 I REMOCON REMOCON data in REMOCON EYE
81 P30 I S1 SHUTTLE DATA JOG/SHUTTLE
31 S0/T0 0 GRID11 FLT GRID CONTROL FLT
82 P31 I S2 SHUTTLE DATA JOG/SHUTTLE
32 S1/T1 0 GRID10 FLT GRID CONTROL FLT
83 P32 I S3 SHUTTLE DATA JOG/SHUTTLE
33 S2/T2 0 GRID9 FLT GRID CONTROL FLT
84 P33 I S4 SHUTTLE DATA JOG/SHUTTLE
34 S3/T3 0 GRID8 FLT GRID CONTROL FLT
85 P34 I J1 JOG DATA JOG/SHUTTLE
35 S4/T4 0 GRID7 FLT GRID CONTROL FLT
86 P35 I J2 JOG DATA JOG/SHUTTLE
36 S5/T5 0 GRID6 FLT GRID CONTROL FLT
87 P36 I AT VIDEO OUT SEL. VIDEO SELECT(OPEN)
37 S6/T6 0 GRID5 FLT GRID CONTROL FLT
88 P37 I AD VIDEO OUT SEL. VIDEO SELECT
38 S7/T7 0 GRID4 FLT GRID CONTROL FLT
89 VSS - +5V
39 S8/T8 0 GRID3 FLT GRID CONTROL FLT
90 VDD - GND
40 S9/T9 0 GRID2 FLT GRID CONTROL FLT
91 P40 0 RGBCTL SCART CONTROL SCART JACK
41 S10/T10 0 GRID1 FLT GRID CONTROL FLT
92 P41 0 SCON_B SCART CONTROL SCART JACK
42 S11/T11 0
93 P42 - TP28 NC
43 S12/T12 0 SEG1 FLT SEGMENT CONTROL FLT
94 P43 0 WIDE SCART CONTROL SCART JACK
44 S13/T13 0 SEG2 FLT SEGMENT CONTROL FLT
95 P44 0 SRQ request to main micom NC
45 S14/T14 0 SEG3 FLT SEGMENT CONTROL FLT
96 P45 0 SAVE POWER SAVE MODE POWER
46 S15/T15 0 SEG4 FLT SEGMENT CONTROL FLT
97 P46 0 AMUTE1 REAR MUTE AUDIO
47 VOD - +5V
98 P47 0 AMUTE0 FRONT MUTE AUDIO
48 VP - -28V
99 P50 0 LED STANDBY LED LED
49 S16 0 SEG5 FLT SEGMENT CONTROL FLT
100 P51 0 ON/OFF POWER ON/OFF CONTROL POWER
50 S17 0 SEG6 FLT SEGMENT CONTROL FLT
2-11
Reference Information
Reference Information
2-1-8 RIC1 (KS1461 ; RF Signal Processor)
AGCLEVEL
RFAGCO
MROFST
VZOCTL
EQGND
RFEQO
EQVCC
RFRPN
BCATH
AGCC
MIRRI
RDPF
AGCP
AGCB
RFRP
RFCT
PLLF
AGCI
EQIN
EQG
EQF
CP1
CB1
CP2
CB2
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
t o RF EQ
TUNI NG BLOCK
AGC-HOLD(00 H) AGC_ D ET
75 BCAO
1 BCA
MUX
ACD BLOCK
2
BCD 74 BCAI
CCD +
3 A
DCD B RF
+
4 RF SUM
RF C & AGC
Equalizer
MUX + BCA
5 D
ADVD RFRP
+
6
BDVD
CDVD 7 GAIN_ EQ(02 H)
DDVD 8 73 RESET
AUTO
RFCT OFSTCTL
CD1 S12
72 OSC
&
CDRSEL(00 H )
TE1RES MIRR
HOLD_CTL(08H) CD1
DELAY _SE L(00H)
DPDMUTE S12
PLLCTL
DELAY_AB(07 H ) DPD_MUTE(02H) DVD1
TBA L(01H)
DELAY_C D(07 H) SEOFHOLD DVD2
FLT_CTL(00H)
PLL CTL LDONB
g a_ R FSUM(08 H ) DPDEQ1 71 STB
CAL_ENDB(02H) FLT_CTL
RREFBF 9 DVCTL_SE L(02H) CDRSE L
S/ I F
VREF TES E L
70 CLOCK
PD,LPF
DELAY
D +
RREFEQ 10 BLO K
C
GENERATOR AGCHOLD
COM
GCA EQ TB AL
+
RREF 11 TEOFST(04H) GAI N_TE 3
69 DATA
D
ENV_SE L
MUX3 PDL IMITRES DVCTL_SE L
TE1_LIMIT
D DPD_MUTE
+
COM GAI N_EQ
EQ
GCA
GAI N_FE
D + PD_LIMI T(08H) GAI N_AB CD
68 RREFDLY
TE_OFST
GA_PLL DN (09 H) DPDEQ2 FE_OFST
GA_PLL DP(09 H ) AB CD_OFST
DPD
DELAY _CD
Ab normal waveform FAUL TOUT 67 VREFDPD
VC AMP
DELAY _AB
Detectio n circu it PDLIM I T
EQ VC
VREFEQ 12 ga_RFSUM
AMP GAIN_ TE3(02 H ) HOLD_CTL
DELAY _SE L(00H)
66 DPDGND
ga_PLLDP
PLLCTL
ga_PLLDN
E 13 GCA
TE3B
-
65 TE1RES
+
F 14 GCA
64 PLLCTL
OFSTHOLD
TEOFST(04 H ) 63 DPDMUTE
t o DPD
TBAL(01 H) BLO K
C
62 FAULTOUT
CDR SEL(00 H)
61 DPDEQ 2
GAIN_ ABCD(00 H )
15 60 DPDEQ 1
ADVD1
+ EQIN
16
BDVD1 D1
+
B1
17 AB CD
CDVD1 +
59 TE3OFST
SUM
C1
18
DDVD1 SUB A1 ENV_SEL(02 H)
+
- 58 BCA
RF
19 MUX GAIN_ FE(03 H)
ACD1 57 MIRR
OFSTHOLD
20
BCD1 MUX
ABCD_ OFST(06 H )
21
CCD1 FE
FE_OFST(05 H ) 56 DPDVCC
DCD1 22
OFSTHOLD
55 DFCT2
AVCC 23 MUX
CDRSEL(00 H )
54 DFCT1
LDONB(00 H)
ANALOG TESEL(00 H )
VREFA 24 53 DFCTTH1
VC AMP
ENVELOPE FOK DEFECT
52 DFCTTH2
+ -
ALPC - +
FOFST 25
FOFST
51 DVCC
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
OFSTHOLD
VREFLP_BGI
LDODVD
PDVD
LDOCD
PDCD
AGND
FE
FEN
TEN
TE
PDLIMITRES
ABCDN
ABCD
ABCDI
ENVP
ENVB
ENV
DGND
FOKTH
FOKB
DFCT_CP1
DFCT_CP2
CC1
CC2
2-12 Samsung Electronics
Reference Information
Pin Related Pin Related
Pin Name I/O Description Related Block Pin Name I/O Description Related Block
No. Part No. Part
Cap connection terminal (open) for 3B TE Offset
1 ACD I Optical main beam A, AC Coupling input terminals for CD of RF PRE AMP P/U 59 TE3OFST - 3B TE AMP -
block
DPD EQ (A+C) output terminal
60 DPDEQ1 O DPD -
2 BCD I Optical main beam B, AC Coupling input terminals for CD of RF PRE AMP P/U
DPD EQ (B+D) output terminal
61 DPDEQ2 O DPD -
block
DPD abnormal wave form output terminal (monitor)
62 FAULTOUT O DPD -
3 CCD I Optical main beam C, AC Coupling input terminals for CD of RF PRE AMP P/U
DPD TE MUTE control terminal (H: Mute)
block 63 DPDMUTE I DPD MICOM
DPD TE PLL variable input terminal
4 DCD I Optical main beam D, AC Coupling input terminals for CD of RF PRE AMP P/U 64 PLLCTL I DPD SERVO
block
DPD TE PLL variable bias resistance
65 TE1RES I DPD -
5 ADVD I Optical main beam A, AC Coupling input terminals for DVD of RF PRE AMP P/U
Power GND input terminal for DPD TE
66 DPDGND P DPD -
block
CAP connection terminal for DPD TE center voltage
67 VREFDPD O DPD VC AMP -
6 BDVD I Optical main beam B, AC Coupling input terminals for DVD of RF PRE AMP P/U
block Bias resistance connection terminal for Delay Block
68 RREFDLY - Delay Block -
7 CDVD I Optical main beam C, AC Coupling input terminals for DVD of RF PRE AMP P/U Data input terminal
69 DATA I Serial Interface MICOM
block
Clock input terminal
70 CLOCK I Serial Interface MICOM
8 DDVD I Optical main beam D, AC Coupling input terminals for DVD of RF PRE AMP P/U
Data Enable input terminal
71 STB I Serial Interface MICOM
block
Input terminal for RC value of OSC, for Auto Offset Block
72 OSC Auto OFSTCTL -
9 RREFBF - RF AMP I/O buffer bias resistance connection terminal RF AMP -
Reset input terminal (L: Reset) for Auto Offset Block
73 RESET I Auto OFSTCTL MICOM
10 RREFEQ - RF EQ BIAS resistance connection terminal RF EQ -
BCA Filter1
74 BCAI I BCA -
11 RREF - Analog Block bias resistance connection terminal ANALOG -
BCA Filter2
75 BCAO O BCA -
12 VREFEQ - CAP connection terminal for RF EQ Center voltage EQ VC AMP - Related
RF Ripple Center voltage output terminal for Mirror
76 RFCT O MIRROR DSSP
13 E I CD Optical sub beam E input terminal for Servos TE 3B P/U
CAP connection terminal of RC value of Bottom Hold, for RFCT
77 CB2 - MIRROR -
14 F I CD Optical sub beam F input terminal for Servos TE 3B P/U
generation
15 ADVD1 I Optical main beam A input terminal for DVD of Servo block SERVO AMP P/U CAP connection terminal of RC value of Peak Hold, for RFCT gen- MIRROR
78 CP2 - -
eration
16 BDVD1 I Optical main beam B input terminal for DVD of Servo block SERVO AMP P/U
RF Ripple Amp output terminal for Mirror
79 RFRP O MIRROR DSSP
17 CDVD1 I Optical main beam C input terminal for DVD of Servo block SERVO AMP P/U
Input terminal for selecting RFRP Amp gain
80 RFRPN I MIRROR -
18 DDVD1 I Optical main beam D input terminal for DVD of Servo block SERVO AMP P/U
RF Ripple Offset control terminal for Mirror
81 MROFST I MRROR -
19 ACD1 I Optical main beam A input terminal for CD of Servo block SERVO AMP P/U
RC connection terminal of RC value of Bottom Hold, for RFRP
82 CB1 - MRROR -
20 BCD1 I Optical main beam B input terminal for CD of Servo block SERVO AMP P/U generation
RC connection terminal of RC value of Peak Hold, for RFRP gen-
21 CCD1 I Optical main beam C input terminal for CD of Servo block SERVO AMP P/U 83 CP1 - MRROR -
eration
22 DCD1 I Optical main beam D input terminal for CD of Servo block SERVO AMP P/U
Input terminal for MIRR signal generation
84 MIRRI I MRROR -
23 AVCC P Power voltage input terminal for Analog Part ANALOG -
Power voltage input signal for RF EQ
85 EQVCC P RF EQ -
24 VREFA I/O CAP connection terminal for Analog Part center voltage ANA VC AMP SERVO
RF EQ output terminal
86 RFEQ0 0 RF EQ PLL
Uses an external block
BCA Comparating Level control terminal
87 BCATH I BCA DSP
25 FOFST - CAP connection terminal (open) for Focus Auto Offsets FE AMP -
RFAGCO input terminal for RF EQ
88 EQIN I RFEQ,RFENV DSSP
26 OFSTHOLD I On/Off terminal for Auto Offset Block. OFSTCTL MICOM
RF AGC AMP output terminal
(L: Auto Offset Adjustments, H: Serial Offset Adjustments) 89 RFAGCO O RF AGC -
CAP connection terminal for time constant of AGC
90 AGCC - RF AGC -
27 VREFLP_BGI I Band gap voltage input block for ALPC ALPC -
AGC voltage input terminal while in AGC hold
Optical Laser Diodes operation voltage output terminal for DVD 91 AGCI I RF AGC -
28 LDODVD O ALPC P/U
Optical Laser Monitor Diode voltage input terminal for DVD Power GND input terminal for RF EQ
29 PDDVD I ALPC P/U 92 EQGND P RF EQ -
Optical Laser Diode operating voltage output terminal for CD AGC Level control voltage input terminal (3.5 V) while in AGC hold RF AGC
30 LDOCD O ALPC P/U 93 AGCLEVEL I -
off
Optical Laser Monitor Diode voltage input terminal for CD
31 PDCD I ALPC P/U
RC connection terminal for RC value of Bottom Hold, for RF AGC RF AGC
94 AGCB - -
Power GND terminal for Analog Part
32 AGND P ANALOG -
RC connection terminal for RC value of Peak Hold, for RF AGC
95 AGCP - RF AGC -
FE AMP output terminal
33 FE O FE AMP DSSP
Bias resistance connection terminal for selecting RF EQ frequency RF EQ
96 RDPF - -
Input terminal for selecting FE AMP Gain
34 FEN I FE AMP -
RF EQ Boost Gain control voltage input terminal
97 EQG I RF EQ DSSP
Input terminal for selecting TE AMP Gain
35 TEN I TE AMP -
RF EQ Peak Frequency control voltage input terminal
98 EQF I RF EQ DSSP
TE AMP output terminal
36 TE O TE AMP DSSP
Wide-band PLL compatible RF EQ Peak Frequency Control termi- RF EQ
99 PLLF I DSSP
Bias resistance terminal for PDLIMIT nal
37 PDLIMTRES - DPD -
RF EQ zero control terminal
100 VZOCTL I RF EQ DSSP
ABCD AMP for selecting Gain (- ) input terminal
38 ABCDN I ABCD AMP -
ABCD AMP output terminal
39 ABCD O ABCD AMP -
ABCD AC Coupling input terminal for servo monitor
40 ABCDI I SERVO MONIT -
CAP connection terminal for selecting the RC value of Peak Hold
41 ENVP - RF ENV -
for detecting RF Envelopes
CAP connection terminal for selecting the RC value of Bottom
42 ENVB - RF ENV -
Hold for detecting RF Envelopes
RF Envelope Detect Output terminal
43 ENV O RF ENV DSSP
Power GND input terminal for digital circuits
44 DGND P DIGITAL -
Focus OK comparating level input terminal
45 FOKTH I FOKB -
Focus OK comparator output terminal (L: Focus OK)
46 FOKB O FOKB DSSP
Connection terminal for RC value of Peak Hold, for selecting the
47 DFCT_CP1 - DFCT -
maximum time for Servo signal
Connection terminal for RC value of Peak Hold, for selecting the
48 DFCT_CP2 - DFCT -
minimum defect time for PLL
Peak Hold Output terminal for selecting the minimum Defect time
49 CC1 O DFCT -
for Defect
Peak Hold AC Coupling Input terminal for Defect
50 CC2 I DFCT -
Power voltage input terminal for digital circuit
51 DVCC P DIGITAL -
Resistance connection terminal for selecting the Defect Comparat- DEFECT
52 DFCTTH2 - -
ing Level for PLL
Resistance connection terminal for selecting the Defect Comparat- DEFECT
53 DFCTTH1 - -
ing Level for Servo
Defect output terminal for Servo
54 DFCT1 O DEFECT DSSP
Defect output terminal for PLL
55 DFCT2 O DEFECT PLL
Power voltage input terminal for DPD TE
56 DPDVCC P DPD -
Mirror output terminal
57 MIRR O MIRR DSSP
BCA output terminal
58 BCA O BCA DSP
Samsung Electronics 2-13
2-14
Reference Information
SSTOP/PS0
PS1
PHI1
MIRR
SMON
DIRC
TEST
XOUT
DFCT
TILTO
XO
TILTI
XI
RSTB
TZCA
FOKB
LOCK
FL KB
VR EF TIM IN G
TL KB
I/O IN TER FACE BLOC K
EN V GEN ER ATOR L D ON B
A/D
TZC O
C ON VER TER
2-1-9 SIC1 (KS1452 ; Servo Processor)
SM E
BLOC K
TE D AB
FE C SB
MW RB
SYSC ON MRDB
IN TER FACE M D ATA[ 7 :0 ]
C OU T TR ACK C OU NTER
SEN SE
D SP C OR E BLOC K
PSB
F OR
FOD M D OU T[3 :0 ]
D IGIT AL SER VO
TRD
D /A
SL D
PL LLOC K
C ON VER TER
SPD
R FD
FBA L BLOC K
R PD
TBA L
EFM R TD
D VC T L
PL CK
R VC O
W ID E C APTU RE
R OM
EFM I
VC TR L
R ANGE PLL
R FI
EQC TL
ASY D VD M AG I C 0
EF M ASYMM ETR Y
FD C TL
ASY C D
IN T 0_224
EFM
PL LHD
EFM OA
Samsung Electronics
No Name I/O Description
No Name I/O Description
41 PVDD P PLL logic block VDD power supply pin
1 MDOUT3 O Mode data3 out controlled by micom
42 PLCK O PLCK
2 SSTOP/PS0PS1 I Limit switch/sled position sensor input pin0
43 PLLLOCK O Frequency lock detect output (H: lock, L: unlock)
3 PS1 I Sled motor position sensor input pin1
44 EFMRTD O Latched EFM output signal
4 TEST I Test pin (L: normal H: test)
Samsung Electronics
45 PVSS P PLL logic block VSS power supply pin
5 COUT O Counter clock
46 RVCO I Resistor pin for VCO gain
6 FLKB O Focus servo lock signal output pin
47 RFD I Gain adjust resister for frequency detector
7 TLKB O Tracking servo lock signal output pin
48 RPD I Gain adjust resister for phase detector
8 PSB I 0: 1 Bit, 1: 8 Bit
49 VCTL I control voltage for VCO
9 RSTB I System reset signal input pin
50 MAGIC0 I Input for controlling hysteresis of the FD output (for testing)
10 CSB I MICOM chip select pin
51 EFMOA I EFM offset adjustment pin
11 DAB I MICOM data/addrs select pin
52 TZCO O Tracking zero cross output pin
12 MWRB I MICOM write clock signal input pin
53 SVDD P Servo CPU VDD power supply pin
13 MRDB I MICOM read clock signal input pin
54 EQCTL O EQ control signal
14 MDATA0 I/O MICOM data pin0
55 EFMI I EFM signal for test
15 MDATA1 I/O MICOM data pin1
56 EFMO O EFM signal
16 MDATA2 I/O MICOM data pin2
57 LPFDVD I Asymmetric input signal for DVD
17 MDATA3 I/O MICOM data pin3
58 LPFCD I Asymmetric input signal for CD
18 MDATA4 I/O MICOM data pin4
59 RFI I Rf input signal
19 MDATA5 I/O MICOM data pin5
60 SVSS P Servo CPU VSS power supply pin
20 MDATA6 I/O MICOM data pin6
61 AVSS P Analog block VSS power supply pin
21 MDATA7 I/O MICOM data pin7
62 SME I Spindle error input pin
22 SENSE O Internal status monitor pin
63 VREF I Reference voltage input pin
23 DVDD P Servo logic & ROM VDD power supply pin
64 TE I Tracking error signal input pin
24 XI I System clock signal input pin
65 FE I Focus error signal input pin
25 XO O System clock signal output pin
66 ENV I RF envelope input pin
26 XOUT O Clock out (33.9688MHz) to DSP
27 DVSS P Servo logic & ROM VSS power supply pin 67 TILTI I TILT in (reserved)
28 SQCK O Clock output pin for subcode data read 68 AVDD P Analog block VDD power supply pin
29 SQSI I Subcode data input pin 69 TILTO O TILT out (reserved)
30 SCOR I Timing detection input pin for subcode data read 70 DVCTL O Depth variation control signal output pin
31 SMON I Motor ON signal input pin 71 TBAL O Tracking balance signal output pin
32 LOCK I Lock signal input pin 72 FBAL O Focus balance signal output pin
Direct jump control (for 1 track jump)
33 DIRC I 73 SLD O Sled motor drive signal output pin
34 FOKB I Focus OK signal input pin 74 SPD O Spindle motor drive signal output pin
35 FDCTL I PLL frequency detect control input pin 75 FOD O Focus actuator drive signal output pin
36 LDONB O Laser diode ON signal output pin 76 TRD O Tracking actuator drive signal output pin
37 DFCT I Defect detection signal input pin 77 TZCA I TE signal for tracking zero cross input pin
38 MIRR I Mirror signal input pin 78 MDOUT0 O Mode data0 out controlled by micom
39 PLLHD I PLL hold signal from micom 79 MDOUT1 O Mode data1 out controlled by micom
40 INT0_224 O Servo interrupt monitor pin 80 MDOUT2 O Mode data2 out controlled by micom
2-15
Reference Information
Reference Information
2-1-10 SIC4 (KA3017 ; Motor & Actuator Driver)
SIGGND
VCC2
ECR
CS1
PC1
DIR
FIN (GND)
VM
EC
FG
VH
SB
SS
12 11 10 9 8 7 6 5 4 3 2 1
PWRGND 13
Short vrake
+- 48 H3+
Hall bias
Power
Save Absolute
Values
A3 14
47 H3-
Comparator
FG
TSD
+-
A2 15
46 H2+
Direction
Detector
A1 16 Detector
45 H2-
Distributor
Lower
Hall amp matrix
Direction select
OPIN + 17
44 H1+
Distributor
Upper
OPIN - 18 43 H1-
- +
FIN (GND)
FIN (GND)
2P
- +
OPOUT 19
42 BTLSGND
VCC1 20
41 BIAS
- -
- -
+ + + +
10k
10k
10k
10k
AVM12 21 40 AVM4
- -
+ - +
-
+ +
DI4 22 39 MUTE12
MUTE
MUTE
MUTE
DI3 23 38 MUTE3
2P
2P
2P
2P
2P
2P
2P
2P
37 MUTE4
DI2 24
25 26 27 28 29 30 31 32 33 34 35 36
DO1 +
DO2 +
DO3 +
DO4 +
DI1
BTLPGND1
BTLPGND2
AVM3
DO1 -
DO2 -
DO4 -
DO3 -
FIN (GND)
2-16 Samsung Electronics
Reference Information
No. Symbol I/O Description
1 VH I HALL BIAS
2 FG O FG SIGNAL OUTPUT
3 ECR I TORQUE CONTROL REFERENCE
4 EC I TORQUE CONTROL SIGNAL
5 VCC2 â?? SUPPLY VOLTAGE
6 PC1 â?? PHASE COMPENSATION CAPACITOR
7 SIGGND â?? SIGNAL GROUND
8 VM â?? MOTOR SUPPLY VOLTAGE
9 CS1 I CURRENT SENSOR
10 S/S I START/STOP
11 DIR O 3-PHASE ROTATIONAL DIRECTION OUTPUT
12 SB I SHORT BRAKE
13 PWRGND â?? POWER GROUND
14 A3 O 3-PHASE OUTPUT 3
15 A2 O 3-PHASE OUTPUT 2
16 A1 O 3-PHASE OUTPUT 1
17 OPIN+ I OP AMP INPUT (+)
18 OPIN- I OP AMP INPUT (-)
19 OPOUT O OP AMP OUTPUT
20 VCC1 â?? SUPPLY VOLTAGE
21 AVM12 â?? BTL CH-1, 2 MOTOR SUPPLY VOLTAGE
22 DI4 I BTL DRIVE INPUT 4
23 DI3 I BTL DRIVE INPUT 3
24 DI2 I BTL DRIVE INPUT 2
25 DI1 I BTL DRIVE INPUT 1
26 DO1- O BTL DRIVE 1 OUTPUT (-)
27 DO1+ O BTL DRIVE 1 OUTPUT (+)
28 DO2- O BTL DRIVE 2 OUTPUT (-)
29 DO2+ O BTL DRIVE 2 OUTPUT (+)
30 BTLPGND1 â?? BTL POWER GROUND 1
31 BTLPGND2 â?? BTL POWER GROUND 2
32 DO3- O BTL DRIVE 3 OUTPUT (-)
33 DO3+ O BTL DRIVE 3 OUTPUT (+)
34 AVM3 â?? BTL CH3 MOTOR SUPPLY VOLTAGE
35 DO4- O BTL DRIVE 4 OUTPUT (-)
36 DO4+ O BTL DRIVE 4 OUTPUT (+)
37 MUTE4 I BTL DRIVE MUTE CH 4
38 MUTE3 I BTL DRIVE MUTE CH 3
39 MUTE12 I BTL DRIVE MUTE CH 1, 2
40 AVM4 â?? BTL CH 4 MOTOR SUPPLY VOLTAGE
41 BIAS â?? BTL BIAS VOLTAGE
42 BTLSGND â?? BTL DRIVE SIGNAL GROUND
43 H1- I HALL1(-) INPUT
44 H1+ I HALL1(+) INPUT
45 H2- I HALL2(-) INPUT
46 H2+ I HALL2(+) INPUT
47 H3- I HALL3(-) INPUT
48 H3+ I HALL3(+) INPUT
Samsung Electronics 2-17
2-18
Reference Information
SDRAM Memory OSD
Interface Controller Decoder
2-1-11 ZIC1 (ZIVA 4.1 ; A/V Decoder)
Digital
Video Video
Subpicture Video
Mixer Out
Host Decoder Encoder
Host
Interface
Interface
Control Logic MPEG Video
Decoder
SecureView
CD-DA and LPCM
CSS
Decoder
Program
Descrambling
DVD/CD Stream
Interface Digital
Decoder Audio
Dolby Digital Audio
Bus Key Audio
Audio Interface
Decoder
Authentication DSP
Interface
(optional)
MPEG Audio
Decoder
Digital Audio Input
Samsung Electronics
Pin No. Pin Name I/O Voltage I/O Type Pin No. Pin Name I/O Voltage I/O Type
Pin No. Pin Name I/O Voltage I/O Type Pin No. Pin Name I/O Voltage I/O Type
1 RD 3.3V I 97 SD-BS 3.3V O 144 VSS_VIDEO ANALOG GND
49 PIO4 3.3V I/O
98 MADDR10 3.3V O 145 Y/B/U 3.3V ANALOG O
2 R/W 3.3V I 50 PIO5 3.3V I/O
99 MADDR0 3.3V O 146 VDD_DAC 3.3V ANALOG
3 VDD_3.3 3.3V 51 PIO6 3.3V I/O
100 VDD_3.3 3.3V 147 VDD_VIDEO 3.3V ANALOG
4 WAIT 3.3V O, OD, PU
Samsung Electronics
52 PIO7 3.3V I/O
101 VSS GROUND 148 NC No Connect O
5 RESET 3.3V I 53 MDATA0 3.3V I/O
102 MADDR1 3.3V O 149 VSS_DAC ANALOG GND
6 VSS GROUND 54 MDATA1 3.3V I/O
7 VDD_3.3 3.3V 103 MADDR2 3.3V O 150 VSS_VIDEO ANALOG GND
55 VDD_3.3 3.3V
104 MADDR3 3.3V O 151 C/R/V 3.3V ANALOG O
8 INT 3.3V O, OD, PU 56 VSS GROUND
105 RESERVED ANALOG GND 152 VDD_DAC 3.3V ANALOG
9 NC No Connect O 57 MDATA2 3.3V I/O
106 NC No connect O 153 VDD_VIDEO 3.3V ANALOG
10 NC No Connect O 58 MDATA3 3.3V I/O
107 NC No connect O 154 VSS_RREF ANALOG GND
11 NC No Connect O 59 MDATA4 3.3V I/O
108 RESERVED 3.3V I 155 RREF 3.3V ANALOG O
12 NC No Connect O 60 MDATA5 3.3V I/O
13 VDD_2.5 2.5V 109 NC No connect O 156 VDD_RREF 3.3V ANALOG
61 MDATA6 3.3V I/O
110 RESERVED 3.3V I 157 A_VSS GROUND
14 VSS GROUND 62 MDATA7 3.3V I/O
111 RESERVED 3.3V ANALOG 158 SYSCLK 3.3V I
15 NC No Connect O 63 MDATA15 3.3V I/O
112 RESERVED 3.3V I 159 VCLK 3.3V I
16 NC No Connect O 64 VDD_3.3 3.3V I/O
113 DAI-LRCK 3.3V I/O 160 A_VDD 3.3V ANALOG
17 NC No Connect O 65 VSS GROUND I/O
114 DAI-BCK 3.3V I/O 161 DVD-DATA0/CD-DATA 3.3V I
18 NC No Connect O 66 MDATA14 3.3V I/O
19 VSS GROUND 115 VDD_3.3 3.3V 162 DVD-DATA1/CD-LRCK 3.3V I
67 VDD_2.5 2.5V
116 VSS GROUND 163 DVD-DATA2/CD-BCK 3.3V I
20 VDD_3.3 3.3V 68 VSS GROUND
117 DAI-DATA 3.3V I/O 164 DVD-DATA3/CD-C2P0 3.3V I
21 VDATA0 3.3V O 69 MDATA13 3.3V I/O
118 DA-DATA3 3.3V O 165 DVD-DATA4/CDG-SDATA 3.3V I
22 VDATA1 3.3V O 70 MDATA12 3.3V I/O
119 DA-DATA2 3.3V O 166 VSS GROUND
23 VDATA2 3.3V O 71 MDATA11 3.3V I/O
120 DA-DATA1 3.3V O 167 VDD_3.3 3.3V
24 VDATA3 3.3V O 72 MDATA10 3.3V I/O
25 VDATA4 3.3V O 121 DA-DATA0 3.3V O 168 DVD-DATA5/CDG-VFSY 3.3V I
73 MDATA9 3.3V I/O
122 DA-LRCK 3.3V O 169 DVD-DATA6/CDG-S0S1 3.3V I
26 VDATA5 3.3V O 74 VDD_3.3 3.3V
123 VDD_3.3 3.3V 170 DVD-DATA7/CDG-SCLK 3.3V I
27 VDATA6 3.3V O 75 VSS GROUND
124 VSS GROUND 171 VDACK 3.3V I
28 VDATA7 3.3V O 76 MDATA8 3.3V I/O
125 DA-XCK 3.3V I/O 172 VREQUEST 3.3V O
29 VSYNC 3.3V I/O 77 LDQM 3.3V O
126 DA-BCK 3.3V O 173 VSTROBE 3.3V I
30 HSYNC 3.3V I/O 78 SD-CLK 3.3V O
31 VSS GROUND 127 DA-IEC 3.3V O 174 ERROR 3.3V I
79 CLKSEL 3.3V I
128 VDD_2.5 2.5V 175 VDD_3.3 3.3V
32 VDD_3.3 3.3V 80 MADDR9 3.3V O
129 VSS GROUND 176 RESERVED GROUND
33 RESERVED 3.3V I 81 MADDR8 3.3V O
130 NC No Connect O 177 VDD_3.3 3.3V
34 RESERVED 3.3V I 82 VDD_3.3 3.3V
131 VSS_DAC ANALOG GND 178 VSS GROUND
35 RESERVED 3.3V I 83 VSS GROUND
132 VSS_VIDEO ANALOG GND 179 NC No connect O
36 VDD_2.5 2.5V 84 MADDR7 3.3V O
37 VSS GROUND 133 CVBS + sync 3.3V ANALOG O 180 NC No connect O
85 MADDR6 3.3V O
134 VDD_DAC 3.3V ANALOG O 181 NC No connect O
38 RESERVED 3.3V I 86 MADDR5 3.3V O
135 VDD_VIDEO 3.3V ANALOG 182 HADDR0 3.3V I
39 RESERVED 3.3V I 87 VDD_2.5 2.5V
136 NC No Connect O 183 HADDR1 3.3V I
40 RESERVED 3.3V I 88 VSS GROUND
137 VSS_DAC ANALOG GND 184 HADDR2 3.3V I
41 RESERVED 3.3V I 89 MADDR4 3.3V O
138 VSS_VIDEO ANALOG GND 185 RESERVED 3.3V I
42 RESERVED 3.3V I 90 MWE 3.3V O
43 PIO0 3.3V I/O 139 CVBS/G/Y 3.3V ANALOG O 186 RESERVED 3.3V I
91 SD-CAS 3.3V O
140 VDD_DAC 3.3V ANALOG 187 RESERVED 3.3V I
44 VSS GROUND 92 VDD_3.3 3.3V
141 VDD_VIDEO 3.3V ANALOG 188 VSS GROUND
45 VDD_3.3 3.3V 93 VSS GROUND
142 NC No Connect O 189 VDD_2.5 2.5V
46 PIO1 3.3V I/O 94 SD-RAS 3.3V O
143 VSS_DAC ANALOG GND 190 RESERVED 3.3V I
47 PIO2 3.3V I/O 95 SD-CS0 3.3V O
48 PIO3 3.3V I/O 96 SD-CS1/MADDR11 3.3V O
2-19
Reference Information
2-20
Pin No. Pin Name I/O Voltage I/O Type Pin No. Pin Name I/O Voltage I/O Type
191 VSS GROUND 199 HDATA6 3.3V I/O
192 VDD_3.3 3.3V 200 HDATA5 3.3V I/O
Reference Information
193 RESERVED 3.3V I 201 HDATA4 3.3V I/O
194 RESERVED 3.3V I 202 HDATA3 3.3V I/O
195 RESERVED 3.3V I 203 HDATA2 3.3V I/O
196 RESERVED 3.3V I 204 VDD_3.3 3.3V
197 HDATA7 3.3V I/O 205 VSS 3.3V
198 VSS GROUND 206 HDATA1 3.3V I/O
207 HDATA0 3.3V I/O
208 CS 3.3V I
Samsung Electronics
Reference Information
2-1-12 ZIC2/ZIC3 (KM416S1120D ; CMOS 16M SDRAM)
I/O Control
LWE
VDD 1 50 VSS
Data Input Register DQ0 2 49 DQ15
DQ1 3 48 DQ14
LDQM
Bank Select
VSSQ 4 47 VSSQ
DQ2 5 46 DQ13
DQ3 6 45 DQ12
Refresh Counter
Output Buffer
Row Decoder
Sense AMP
VDDQ 7 44 VDDQ
512K x 16
Row Buffer
DQ4 8 43 DQ11
DQi DQ5 9 42 DQ10
Address Register
VSSQ 10 41 VSSQ
512K x 16
CLK
DQ6 11 40 DQ9
DQ7 12 39 DQ8
VDDQ 13 38 VDDQ
ADD
LDQM 14 37 N.C/RFU
Column Decoder WE 15 36 UDQM
LRAS
LCBR
Col. Buffer
CAS 16 35 CLK
RAS 17 34 CKE
Latency & Burst Length
CS 18 33 N.C
BA 19 32 A9
A10/AP 20 31 A8
LCKE
Programming Register
A0 21 30 A7
A1 22 29 A6
LRAS LCBR LWE LCAS LWCBR LDQM
A2 23 28 A5
A3 24 27 A4
VDD 25 26 VSS
Timing Register
CLK CKE CS RAS CAS WE L(U)DQM
Pin Name Input Function
CLK System Clock Active on the positive going edge to sample all inputs.
Disables or enables device operation by masking or enabling all inputs except
CS Chip Select
CLK, CKE and L(U)DQM
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
CKE Clock Enable
Disable input buffers for power down in standby.
Row / column addresses are multiplexed on the same pins.
A0 ~ A10/AP Address
Row address : RA0 ~ RA10, column address : CA0 ~ CA7
Selects bank to be activated during row address latch time.
BA Bank Select Address
Selects bank for read/write during column address latch time.
Latches row addresses on the positive going edge of the CLK with RAS low.
RAS Row Address Strobe
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK with CAS low.
CAS Column Address Strobe
Enables column access.
Enables write operation and row precharge.
WE Write Enable
Latches data in starting from CAS, WE active.
Makes data output Hi-Z, tSHZ after the clock and masks the output.
L(U)DQM Data Input/Output Mask
Blocks data input when L(U)DQM active.
DQ0 ~ 15 Data Input/Output Data inputs/outputs are multiplexed on the same pins.
VDD/VSS Power Supply/Ground Power and ground for the input buffers and the core logic.
Isolated power supply and ground for the output buffers to provide improved noise
VDDQ/VSSQ Data Output Power/Ground
immunity.
No Connection/
N.C/RFU This pin is recommended to be left No Connection on the device.
Reserved for Future Use
Samsung Electronics 2-21
Reference Information
MEMO
2-22 Samsung Electronics
3. Product Specifications
Power Requirements AC 120V, 60Hz
Power Consumption 17W
Weight 3.1kg
GENERAL
Dimensions W 430mm X D 280mm X 89mm
Operating Temperature Range +5�°C ~ +35�°C
Operating Humidity Range 10% to 75%
DVD Reading Speed : 3.49 m/sec
(Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
CD : 12Cm Reading Speed : 1.2 to 1.4 m/sec
(Compact Disc) Maximum Play Time : 74min.
DISC
CD : 8Cm Reading Speed : 1.2to 1.4 m/sec.
(Compact Disc) Maximum Play Time : 20min.
Reading Speed : 1.2 to 1.4 m/sec.
VCD : 12Cm
Maximum Play Time : 74min. (Video + Audio)
Composite Video 1 channel : 1.0Vp-p (75ohm load)
Y : 1.0Vp-p (75ohm load) ; DVD-611 Only
Component Video Pr : 0.70Vp-p (75ohm load) ; DVD-611 Only
Video Output
Pb : 0.70Vp-p (75ohm load) ; DVD-611 Only
Luminance Signal : 1Vp-p (75ohm load)
S-Video
Color Signal : 0.286Vp-p (75ohm load)
2 Channel L (1/L), R (2/R)
Audio Output 48KHz Sampling : 4Hz to 22 KHz
* Frequency Response
96KHz Sampling : 4Hz to 44KHz
* S/N Ratio 115dB
* Dynamic Range 105dB
* Total Harmonic Distortion 0.003%
* : Nominal specification
Samsung Electronics 3-1
Product Specification
MEMO
3-2 Samsung Electronics
3. Product Specifications
Power Requirements AC 120V, 60Hz
Power Consumption 17W
Weight 3.1kg
GENERAL
Dimensions W 430mm X D 280mm X 89mm
Operating Temperature Range +5�°C ~ +35�°C
Operating Humidity Range 10% to 75%
DVD Reading Speed : 3.49 m/sec
(Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
CD : 12Cm Reading Speed : 1.2 to 1.4 m/sec
(Compact Disc) Maximum Play Time : 74min.
DISC
CD : 8Cm Reading Speed : 1.2to 1.4 m/sec.
(Compact Disc) Maximum Play Time : 20min.
Reading Speed : 1.2 to 1.4 m/sec.
VCD : 12Cm
Maximum Play Time : 74min. (Video + Audio)
Composite Video 1 channel : 1.0Vp-p (75ohm load)
Y : 1.0Vp-p (75ohm load) ; DVD-611 Only
Component Video Pr : 0.70Vp-p (75ohm load) ; DVD-611 Only
Video Output
Pb : 0.70Vp-p (75ohm load) ; DVD-611 Only
Luminance Signal : 1Vp-p (75ohm load)
S-Video
Color Signal : 0.286Vp-p (75ohm load)
2 Channel L (1/L), R (2/R)
Audio Output 48KHz Sampling : 4Hz to 22 KHz
* Frequency Response
96KHz Sampling : 4Hz to 44KHz
* S/N Ratio 115dB
* Dynamic Range 105dB
* Total Harmonic Distortion 0.003%
* : Nominal specification
Samsung Electronics 3-1
Product Specification
MEMO
3-2 Samsung Electronics
4. Disassembly and Reassembly
4-1 Cabinet and PCB
Note : Reassembly in reverse order.
4-1-1 Top Cabinet Removal
1) Remove 3 Screws Ĺ? on the back Top Cabinet.
2) Remove 2 Screws �´, �? on the left and right side.
3) Lift up the Top Cabinet in direction of arrow.
Ĺ? 3 SCREWS
�´ 1 SCREW
�? 1 SCREW
Fig. 4-1 Top Cabinet Removal
4-1
Samsung Electronics
Disassembly and Reaasembly
4-1-2 Door-Tray Removal
1) Supply power and open Tray Ĺ?.
2) Disassemble the Door-Tray �´ in direction of arrow â?�Aâ?ť.
3) Close Tray Ĺ? and power off.
Note : If Tray Ĺ? doesnâ??t open, insert a Screw driver �¨ into the Emergency hole �? (as shown in detailed draw-
ing) and then push it in the direction of arrow â?�Bâ?ť. Open Tray manually.
Ĺ? TRAY
�´ DOOR-TRAY
"A"
"B"
�? EMERGENCY HOLE
�¨ SCREW DRIVER
<Side View>
Fig. 4-2 Door-Tray Removal
Samsung Electronics
4-2
Disassembly and Reaasembly
4-1-3 Assâ??y Front-Panel, Key PCB Removal
1) Remove Assâ??y Front-Panel Ĺ?.
2) Remove 5 Screws �´ and Key PCB �?.
�´ 5 SCREWS
�? KEY PCB
Ĺ? ASS'Y FRONT-PANEL
Fig. 4-3 Assâ??y Front-Panel, Key PCB Removal
4-3
Samsung Electronics
Disassembly and Reaasembly
4-1-4 Assâ??y Deck Removal
1) Remove 4 Screws Ĺ? from the Assâ??y Deck and lift it up.
CAUTIONS ;
(1) When disassembling, switch the SW3 to â?�OFFâ?ť on the Deck PCB and remove the FPC connected to DCN1 on Main PCB.
(2) When assembling, insert the FPC into the DCN1 on Main PCB and switch SW3 to â?�ONâ?ť on the Deck PCB.
Ĺ? 3 SCREWS
DECK-ASS'Y
FPC
3
SW
ON
OFF
MAIN PCB
DCN1
Fig. 4-4 Assâ??y Deck Removal
Samsung Electronics
4-4
Disassembly and Reaasembly
4-1-5 Main PCB, Jack PCB Removal
1) Remove 1 Screw Ĺ?.
2) Remove 2 Screws �´ and lift up the Jack PCB �?.
3) Remove 3 Screws �¨ and lift up the Main PCB �?.
�´ 2 SCREWS
�? JACK PCB
�¨ 3 SCREWS
�? MAIN PCB
Ĺ? 1 SCREW
Fig. 4-5 Main PCB, Jack PCB Removal
4-5
Samsung Electronics
Disassembly and Reaasembly
4-2 PCB Location
JACK PCB
MAIN PCB
KEY PCB
Fig. 4-6 PCB Location
Samsung Electronics
4-6
Disassembly and Reaasembly
4-3 Connector Diagram
DECK-ASS'Y
CT3
�?
JACK PCB CT4
â?Ź
CT2
�? â?ť
�¨
�´ MAIN PCB
�?
CT1
Ĺ?
KEY PCB
NO. CONNECTOR NO. DIRECTION CONNECTOR NO. NO.
Ĺ? �´
CON21 KEY PCB JACK PCB CN2
CT1
�? �¨
CT2
PCNS1 JACK PCB MAIN PCB PCN1
�? �?
FPC DECK-ASS'Y MAIN PCB DCN1
CT3
â?Ź â?ť
CN1 JACK PCB MAIN PCB CN8
CT4
Fig. 4-7 Connector Diagram
4-7
Samsung Electronics
Disassembly and Reaasembly
4-4 Deck
4-4-1 PCB Deck Assâ??y and Assâ??y P/U Deck Removal
1) Remove the soldering of SLED+, SLED- Ĺ? and TM+, TM- �´.
2) Disconnect CN3 �?, CN2 �¨.
3) Remove 1 Screw �? and lift up the PCB Deck �?.
4) Remove 1 Screw â?Ź.
5) Push the Hook â?ť in the direction of arrow â?�Aâ?ť and lift up the Assâ??y P/U Deck â?? in direction of arrow â?�Bâ?ť.
�? 1 SCREW
Ĺ? SLED+/SLED-
�´ TM+/TM-
�¨ CN2
�? DECK PCB
�? CN3
â?Ź 1 SCREW
â?? ASS'Y P/U DECK
"B"
<Assembly Point>
"A"
â?ť HOOK
Fig. 4-8 PCB Deck Assâ??y and Assâ??y P/U Deck Removal
Samsung Electronics
4-8
Disassembly and Reaasembly
4-4-2 Tray Disc Removal
1) Insert a Screw Driver Ĺ? into Emergency Hole �´ and push the Sider Housing �? in the direction arrow â?�Aâ?ť.
2) When the Tray Disc �¨ comes out little, pull it in the direction arrow â?�Bâ?ť by hand.
3) Pull the Tray Disc �¨ to disassemble , while simultaneously pushing 2 Stoppers �? (left, right) in the direction
arrow â?�Câ?ť, â?�Dâ?ť.
�? STOPPER
"C"
"A"
"D"
�¨ TRAY DISC
"B"
�? SLIDER HOUSING
�? STOPPER
Ĺ? SCREW DRIVER
�´ EMERGENCY HOLE
Fig. 4-9 Tray Disc Removal
4-9
Samsung Electronics
Disassembly and Reaasembly
4-4-3 Slider Housing Removal
1) Push the Slider Housing Ĺ? in the direction arrow â?�Aâ?ť.
2) Lift up the Slider Housing Ĺ?.
Ĺ? SLIDER HOUSING
"A"
Assembly
PUSH
Fig. 4-10 Slider Housing Removal
Samsung Electronics
4-10
Disassembly and Reaasembly
4-4-4 Housing Assâ??y Removal
1) Remove Belt Ĺ? and 1 Screw �´.
2) Remove 1 Screw �? and lift up the Pulley Gear �¨.
3) Push the Hook �? in the direction arrow â?�Aâ?ť and lift up Gear Tray �?, Gear Housing â?Ź.
4) Push the 4 Hooks â?ť bottom side in the direction arrow â?�Bâ?ť and lift up the Motor Load Assâ??y â??.
5) Remove Clamper Assâ??y �ť.
�? HOOK
"A"
�ť CLAMPER ASS'Y
Ĺ? BELT
�? 1 SCREW
�¨ PULLEY GEAR
�´ 1 SCREW
�? GEAR TRAY
â?Ź GEAR HOUSING
"B"
"B"
"B" "B"
â?ť 4 HOOKS
<Bottom Side>
â?? MOTOR LOAD ASS'Y
Fig. 4-11 Housing Assâ??y Removal
4-11
Samsung Electronics
Disassembly and Reaasembly
4-4-5 Sub Chassis Removal
1) Remove the 4 Screws Ĺ?.
2) Lift up the Assâ??y Brkt Deck �´.
Ĺ? 4 SCREWS
�´ ASSY-BRAK DECK
Fig. 4-12 Sub Chassis Removal
Samsung Electronics
4-12
Disassembly and Reaasembly
4-4-6 Assâ??y Brkt Deck Removal
1) Remove Washer Ĺ?.
2) Remove Gear Feed B �´ , Gear Feed A �?.
3) Remove 2 Screws �¨.
4) Remove Shaft Pick-Up �? and Pick-Up Assy �?.
5) Remove 1 Screw â?Ź.
6) Remove 2 Screws â?ť.
7) Remove 3 Spring Spindle â?? and Motor Spindle Assâ??y �ť.
�ť MOTOR SPINDLE
�? PICK-UP ASS'Y
�? SHAFT PICK-UP
�¨ 2 SCREW
â?? SPRING SPINDLE
Ĺ? WASHER
�´ GEAR FEED B
â?Ź 1 SCREW
â?ť 2 SCREWS
�? GEAR FEED A
Fig. 4-13 Assâ??y Brkt Deck Removal
4-13
Samsung Electronics
Disassembly and Reaasembly
MEMO
Samsung Electronics
4-14
5. Circuit Descriptions
5-1 S.M.P.S.
5-1-1 Comparsion between Linear Power Supply and S.M.P.S.
5-1-1 (a) Linear
Vout Vreg
REGULATOR
+ +
Common power +
Vp Vs
(Ex.120/220V 50/60Hz)
(Np) â?? â?? (Ns)
Fig. 5-1 Linear Power Supply
â?? Waveform/Description
Vs
Input : Common power to transformer (Vp).
0
t
Fig. 5-2
Vs
The output Vs of transformer is determined by the ratio
of 1st Np and 2nd Ns.
0
t Vs = (Ns/Np) x Vp
Fig. 5-3
Vout
Vout is output (DC) by diode and condensor.
0
t
Fig. 5-4
Samsung Electronics 5-1
Circuit Descriptions
â?? Advantages and disadvantages of linear power supply
Change by common power
v
1) Advantages : Little noise because the output waveform Vout
of transformer is sine wave.
2) Disadvantages : Vreg
Ĺ? Additional margin is required because Vs is chan-
ged (depending on power source). (The regulator
loss is caused by margin design). 0 t
�´ Greater core size and condensor capacity are ne-
Regulator loss
eded, because the transformer works on a single
power frequency. Fig. 5-5
5-1-1 (b) S.M.P.S. (Pulse width modulation method)
Vout
Transformer
(Np) (Ns)
REGULATOR
+ +
(Vp) (Vs)
â?? â??
+
+ Switch
Vin +
Vs switch
â??
ON/OFF Control I switch
Fig. 5-6
â?? Terms
1) 1st : Common power input to 1st winding.
2) 2nd : Circuit followings output winding of transformer.
3) F (Frequency) : Switching frequency (T : Switching cycle)
4) Duty : (Ton/T) x 100
5-2 Samsung Electronics
Circuit Descriptions
5-1-2 Circuit description (FLY-Back Control)
5-1-2 (a) AC Power Rectification/Smoothing Terminal
1) PDS01, PDS02, PDS03, PDS04 : Convert AC power to DC(Wave rectification).
2) PE3 : Smooth the voltage converted to DC.
3) PCR01, PCR02, PCD01, PCD02, PCD03, PLS01, PBS01 : Noise removal at power input/output.
4) PVA1 : SMPS protection at power surge input (PVA1 pattern open is to remove noise).
5-1-2 (b) SNUBBER Circuit : PER11, PDS11, PCR11, PCD12, PRS11, PRS12
1) Prevent residual high voltage at the terminals of
Vswitch switch during switch off/Suppress noise.
Inverted power High inverted power occurs at switch (PIC1) off,
by leakage
because of the 1st winding of transformer :
inductance
(V= LI xdi/dt. LI : Leakage Induction)
A very high residual voltage exists on both terminals
of PQR11 because dt is a very short.
dt
2) SNUBBER circuit protects PIC1 from damage
through leakage voltage suppression by RC,
(Charges the leakage voltage to PER11, PDS11, PCR11,
PCD12, and discharges to PR15 and PR16).
0 t
Toff
Fig. 5-7
5-1-2 (c) Driving circuit
When Vin supplied, driving current Ig occurs throuhg the PRR11. By this IC (=HfexIg) occurs throug the PQR11
and the Vb is inducted to base winding coil NB of PQR11. By inducted Vb, Ib start flow and the PQR11 is saturat-
ed (S/W ON). Ib is constant and Ic increases in propotion to time. After constant time passed Ib become to
shotage and PQR11 is cut OFF (S/W OFF).
Fig. 5-8 Driving Circuit
Samsung Electronics 5-3
Circuit Descriptions
5-1-2 (d) Feedback Control Circuit
Fig. 5-9
â?? Operation descriptions
1) Internal OP-Amp â??+â?? base potential of PICS2 is 2.5V and external â?�-â?ť input potential is connected with PRS33
and PRS34 to maintain Vout of 5.8V.
2) If load of 5.8V terminal decreses (or AC inout voltage increases) and Vout increases over 5.8V,
Then : PICS2 Vs potential up over 2.5V --> PICS2 Vc down --> PICS1 A-K potential down --> PICS1 C-E current
up --> PQR12 base current up --> PQR11 base current down --> Vout down --> Maintain 5.8V
- PRD31, PRD32 : Reduce 5.8V overshoot.
- PRS32, PCS32 : Prevent PICS2 oscillation (for phase correction).
5-4 Samsung Electronics
Circuit Descriptions
5-1-3 Internal Block Diagram
â?? Internal Block Diagram
FLT Driving
Smoothing Circuit
Circuit
3.3V Rectified
Noise 3.3V Rectified
Converter
VoltageCircuit
Removal Smoothing Circuit
(SNUBBER)
O
5V Rectified 5V Rectified
U
Rectified Circuit Smoothing Circuit VoltageCircuit (x2)
T
P
Motor 8V U
1 Port T
Power TR
Control Circuit
Line Filter 8V Rectified
8V Rectified
VoltageCircuit
Smoothing Circuit
Voltage
Detection
-8V Rectified
Circuit -8V Rectified
VoltageCircuit
Smoothing Circuit
Power IN
(85~265V)
Fig. 5-10
Samsung Electronics 5-5
Circuit Descriptions
5-2 RF
5-2-1 RIC1 (KS1461)
KS1461 is combined with KS1452 and KS1453 as bipolar IC developed for DVD SERVO system.
Main features include DVD waveform equalizing, CD waveform equalizing, focus error signal generation, 3-beam
tracking error signal generation, DPD 1-beam tracking error, defect, envelope, MIRR output, etc. after receiving the
pick-up output converted into I/V.
5-2-1 (a) Basic Potentiometer
KS1461 uses a single power method and each circuit is based on V of 2.5V.
V (Pin 12, 20, 24, 67) terminal is needed for IC, which uses the peripheral V.
5-2-1(b) RF signal
Fig. 5-11 shows the flow of signal generated by the pick-up.
A, B, C, D signals detected from pick-up are converted in to RF signal(A+B+C+D) via RF summing AMP.
104
RFAGCO 474 MIRRI
EQIN
? . m
G MIRR
MIRR
104
%
A
104
^
B RE SUM , RFEQO
PICK-UP RF EG
104
&
C & AGC
104
* TESEL
D
PD LD F E
DPD
y TE
Mhx
TE
3
4 TE
ABCDI
5 i
103
6 ABCD I ABCD
7 SUM
P
ENV ENV
8 [ FOKB
FOK
F DFCT2
d DFCT1
DEFECT
T FE
FE
w ALPC
E
Fig. 5-11
Fig. 5-12 shows the waveform-equalizing block diagram for the RF signal.
It outputs to EQout (Pin 86) terminal by initially changing switching AMP gain of DVD and CD, and then adjust-
ing the level in RF SUM & AGC. It controls RF SUM & AGC gain by means of Pin 89-95 and interfaces with PWM
signal, (output from PWM terminal of KS1453, via low-pass filter to adjust boost gain and peak frequency.
5-6 Samsung Electronics
Circuit Descriptions
474
EQIN
. ,
REAGCO ? RFEQO
RF EQ
â?�
â?š
�?
�°
VZOCTL
PLLGF
EQG
EQF
PWM1
PWM2
RFDVCC
VREFEQ
Fig. 5-12
The control parameters of DVD EQ and CD EQ are as follows.
1) DVD CD EQ control parameter
Ĺ? EQG (Pin 97) : Changes the gain of peak frequency with EQ frequency characteristic. Convert PWM signal,
output from KS1453, into DC via low-pass filter.
�´ EQF (Pin 98) : Changes the peak frequency with EQ frequency characteristic. Convert PWM signal, output
from KS1453, into DVD via low-pass filter.
Samsung Electronics 5-7
Circuit Descriptions
5-3 System Control
5-3-1 Outline
The main micom peripheral circuit is composed of 16bit Micom (MIC1 ; TMP95C265), 8M EPROM (MIC2 ;
M27C801) for Microcode and data save, 256 byte EE-PROM (MIC4 ; KS24C020) for permanent storage of data need-
ed at power off.
The Micom (MIC1 ; TMP95C265) mounted in main board analizes the key commands of front panel or instructions
of remote control through communication with Micom (FIC1 ; LC86P6232) of front and controls the devices on
board to execute the corresponding commands after initializing the devices connected with micom on board at
power on.
5-3-2 Block Diagram
RIC1 SIC1 DIC1 ZIC1 AIC1
RF AMP DIGITAL SERVO DATA PROCESSOR A/V DECODER D/A CONVERTER
KS1461 KS1452 KS1453 ZIVA4.1 AK4393
FIC1 MIC1
FRONT MICOM MAIN MICOM
LC86P6232 TMP95C265
DATA BUS
MIC5 MIC8
ADDRESS
EEPROM EPROM
MICOM
KS24C020 AT27C080
BLOCK
Fig. 5-13
5-8 Samsung Electronics
Circuit Descriptions
5-3-3 Waveform Description
When micom accesses each device sharing bus, it falls the chip select signal of corresponding chip to (/CS1:MIC3-
22, /CS2:MIC2-22, /DSPCS:DIC1-2, /DVD1CS:ZIC1-208, CSB:SIC1-10) 0 (Low) before trial.
So to speak, the bus is used by time-division as shown in Fig 5-14, 5-15, 5-16.
Two and more devices can't be accessed simultaneously.
/CS2
/DSPCS
/DVD1CS
/CSB
/WR
/RD
Fig. 5-14
â?� CH1 : CS2 (MIC2-22, EPROM CHIP SELECT)
â?� CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)
â?� CH3 : DVD1CS (ZIC1-208, A/V DECODER CHIP SELECT)
â?� CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)
â?� CH5 : WR (MIC1-89, MICOM OUTPUT WRITE SIGNAL)
â?� CH6 : RD (MIC1-88, MICOM OUTPUT READ SIGNAL)
/CS2
/DSPCS
/DVD1CS
/CSB
/WR
/RD
Fig. 5-15 DSP Access
â?� CH1 : CS2 (MIC2-22, EPROM CHIP SELECT)
â?� CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)
â?� CH3 : DVD1CS (ZIC1-208, A/V DECODER CHIP SELECT)
â?� CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)
â?� CH5 : WR (MIC1-89, MICOM OUTPUT WRITE SIGNAL)
â?� CH6 : RD (MIC1-88, MICOM OUTPUT READ SIGNAL)
Samsung Electronics 5-9
Circuit Descriptions
/CS2
/DSPCS
/DVD1CS
/CSB
/WR
/RD
Fig. 5-16 Servo Access
â?� CH1 : CS2 (MIC2-22, EPROM CHIP SELECT)
â?� CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)
â?� CH3 : DVD1CS (ZIC1-208, A/V DECODER CHIP SELECT)
â?� CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)
â?� CH5 : WR (MIC1-89, MICOM OUTPUT WRITE SIGNAL)
â?� CH6 : RD (MIC1-88, MICOM OUTPUT READ SIGNAL)
5-10 Samsung Electronics
Circuit Descriptions
5-4 Servo
5-4-1 Outline
SERVO system of DVD is divided into Focusing SERVO, Tracking SERVO, SLED Linked SERVO and CLV
SERVO (DISC Motor Control SERVO).
1) Focusing SERVO
Focuses the optical spot output from object lens onto the disc surface. Maintains a uniform distance between
object lens of Pick-up and disc (for surface vibration of disc).
2) Tracking SERVO
Make the object lens follow the disc track in use of tracking error signal (created from Pick-up).
3) SLED Linked SERVO
When the tracking actuator inclines outwardly as the object lens follows the track during play, the SLED motor
moves slightly (and counteracts the incline).
4) CLV SERVO (DISC Motor Control SERVO)
Controls the disc motor to maintain a constant linear velocity (necessary for RF signal).
5-4-2 Block Diagram
DISC
Fig. 5-17
Samsung Electronics 5-11
Circuit Descriptions
5-4-3 Operation
1) FOCUSING SERVO
(1) FOCUS INPUT
The focus loop is changed from open loop to closed loop, and the triangular waveform moves the object lens up
and down (at pin 75 of SIC1 during Focus SERVO ON.) At that time, S curve is input to pin 65 of SIC1.
ABAD (pin 39 of RIC1) signal, summing signal of PD A, B, C, D, is generated, and zero cross(2.5V) point occurs
when S curve is focused and ABAD signal exceeds a preset,constant value. The focus loop is changed to
closed loop, and the object lens follows the disc movement, maintaining a constant distance from the disc.
(these operations are same in CD and DVD).
Vref
Pin75 of SIC1 (FOD)
Pin65 of SIC1 (FEI) Vref
1.5V
Pin39 of RIC1 (ABCD)
Fig. 5-18
(2) PLAY
When focus loop closes the loop during focus servo on, both pin 65 and pin 75 of SIC1 are controlled by VREF
voltage (approx. 2.5V), and pin 26, 27 of SIC4 are approximately 4.5V.
2) TRACKING SERVO
(1) NORMAL PLAY MODE
Ĺ? For DVD
Composite : The signal output from PD A, B, C, D of Pick-up, the tracking error signal (pin36 of RIC1) uses the
phase difference of A+C and B+D in RIC1, and inputs to terminal 64 of SIC1. Then, it is output to SIC1 pin 76 via
digital equalizer, and applied to the tracking actuator through SIC4.
Pins 76 of SIC1 is controlled by VREF(approx. 2.5V) during normal play.
Meanwhile, DVD repeats the track jump from 1 to 4 in inner direction at normal play (because data- read speed
from disc is faster than data output speed on screen).
�´ For CD, VCD
Receive the signal output through E, F of Pick-up, from RIC1. The tracking error signal is similar to DVD.
5-12 Samsung Electronics
Circuit Descriptions
(2) SEARCH Mode :
Search mode : Fine seek,(Moving the tracking actuator slightly little below 255 track) and coarse search, moving
much in use of sled motor. The coarse search will be described in sled linked servo and now, the fine seek is
explained shortly.
If the object lens is located near target, cut off the tracking loop and give the control signal as many as desired
count to move the tracking actuator via SIC1 pin 76 terminal(TRD).
3) SLED LINKED SERVO
â?� Normal play mode
Move SLED motor slightly by means of PWM signal in SIC1 pin 73, as the tracking actuator moves along with
track during play. Control to move the entire Pick-up as the tracking actuator moves.
â?� Coarse serach mode
In case of long-distance search (such as chapter serach), SIC1 uses MIRR and TZC signal of SIC1-38, 52.
Then, read ID and compute the existing track count after input of next
track. If the existing track count is within fine seek range, tracking begins using fine seek.
4) CLV SERVO(DISC MOTOR CONTROL SERVO)
Input RF signal (from Pick-up) to SIC1 pin59. Detect SYNC signal from RF in SIC1, and output PWM signal to
SIC1 pin 55 for constant linear velocity.
Samsung Electronics 5-13
Circuit Descriptions
5-5 DVD Data Processor
5-5-1 Outline
DIC1(KS1453) performs Sync detection, EFM demodulation and error correction and Spindle motor control (CLV
control) after inputting sliced EFM signal of RF signal at disc playback and EFM read clock (PLCK) signal generat-
ed from PLL. Outputs data which converted to the last audio and video from A/V decoder (ZIC1). KS1453 uses
external memory(4M DRAM) as buffer as well as for error correction and carries out Variable Bit Rate transfer func-
tion. VBR function uses the external buffer as buffer to absorb the difference of transfer rate occurring because the
transfer rate of disc playback is faster than data transfer rate demanded by A/V decoder(Video/Audio Signal
Process Chip).
In case of general disc refresh, the memory is almost filled up periodically. It is because Write rate to memory after
disc playback and signal process is faster than Read of A/V decoder. When the memory is filled, this status is report-
ed by interrupt to main micom, which controls the servo to kick back the pick-up to the previous track after mem-
orizing the last data read from disc until now. It takes some times to jump to the previous track and return to the
original(jump location) again. The memory will have an empty space because A/V decoder reads out data of mem-
ory.
When the memory has an empty space, where data can be processed and written and the pick-up correctly gets to
the original location(before kick back location) again, it reads data again avoids the interrupt of data read previ-
ously. The basic operation repeats to perform as described above.
5-5-2 Block Diagram
DIC2 (KM416C254)
D
[
A
1
[
8 CLOCK 27MHz
5 RC
.
. .
. AA W O
0
0 CLOCK 33.8688MHz
SS E E
[
[
CLOCK 27MHz
D Z Z ZZ 14
D
A R C WO
D
159
D A A EE
[
95
1
R S S OO
5
.
[
8
. .
.
0
0
EFM 116
[
SDATA[7..0] zIC1
[
DVD-D[7..0]
EFMI
173
PLCK 104 69
CSTROBE VSTROBE (ZiVA4.1)
PLCK 70 172
DATREQ REQUEST
DIC1
58 171 HDATA[7..0]
DATACK DACK
(KS1453)
HADDR[2..0]
MDP 109 71 174
DTER *ERR /CS
MDS 110 MDAT[7:0] /RD
MRZA(3) /WR
ZCS(2) /INT
MWR(128) ZWAIT
MRD(127)
ZIRQZD(126)
1WAIT
MAD[7..0] INT7(ZIRQZD)
HA[10..8] INT8(/DVDINT)
*RD(88)
*WR(89)
HA0
MIC1 TMP95C265F
Fig. 5-19
5-14 Samsung Electronics
Circuit Descriptions
5-5-3 Waveform Description
It measures the timing that data processed in DIC1 at DVD playback.
STROBE
REQ
DACK
SDATA all
2 2 0 1 0
Fig. 5-20
â?� CH1 : STROBE (DIC1-69, CLOCK)
â?� CH2 : REQ (DIC1-70, DATA REQUEST)
â?� CH3 : DACK (DIC1-58, DATA ACKNOWLEDGE)
â?� CH4 : SDATA (DIC1-60~67, DATA)
Samsung Electronics 5-15
Circuit Descriptions
5-6 Video
5-6-1 Outline
ZIC1(A/V decoder with video encoder) diverges from the 27MHz crystal, then generates VHSYNC and HSYNC.
ZIC1(A/V decoder with video encoder) does RGB encoding, copy guard processing and D/A conversion of 8bit
video data internally inputted from video decoder block by MIC1(Micom).
Video signal converted into analog signal is outputted via amplifier of analog part.
(Main Board) (Output Board)
CVBS
CVBS_S
Video
ZIC1
data
A/V Decoder with VIC1
Y/Pb
video encoder Amplifier
Y
ZiVA-4 BA7660
C/Pr C
Low Pass Filter
CVBS/Y
(6MHz)
DVD-611 Only
Y
MIC1 VIC2
Pr
Main Micom Amplifier
TMP95C265F BA7660
Pb
Fig. 5-21 Video Output Block Diagram
5-6-2 NTSC Digital Encoder (ZIVA-4.1 ; Buit in video encode)
ZIC1 inputted from pin159 with 27MHz generates HSYNC and VSYNC which are based on video signal.
ZIC1 is synchronous signals with decoded video signal and control the output timing of 8bit video signal of ITU-
R601 format.
The inputted 8bit data which decoded from video decoder block is demuxed with each 8bit of Y, R-Y, B-Y. The
separate signal is encoded to NTSC by control of MIC1.
The above signals, which are CVBS(Composite Video Burst Synchronized)/G(GREEN)/Y[PIN139],
Y(S_VIDEO)/B(BRUE)/Pb[PIN145] and C(S_VIDEO)/R(RED)/Pr[PIN151], are selectively outputted CVBS
+S_VIDEO, Y+Pr+Pb by the rear switch.
In Course of encoding,8bit data can extend to 10bit or more. To convert the extended data to quantization noise as
possible,ZIC1 adopts 10bit D/A converter. ZIC1 perform video en-coding as well as copy protection.
5-16 Samsung Electronics
Circuit Descriptions
5-6-3 Amplifier (VIC1, VIC2 : BA7660)
VIC1 and VIC2 are 6dB amplifier. Based on CVBS signal, the final output level must be 2Vpp without 75ohm ter-
minal resitance. Because the level of video encoder output is only 1.1Vpp, the level is adjusted with the special
amplifier. When mute of pin 1 is high active, if the pin is floating and connecte to power, the output isgnal is
never outputted. CVBS,Y,C,Y,Cr,Cb outputted from video encoder are inputted to VIC1(Pin 7,Pin2,Pin4),and
VIC2(Pin7,Pin4,Pin2) respectively and outputted from VIC1(Pin15,Pin13,Pin10) and VIC2(Pin15,Pin13,Pin10).
Pin9, Pin12, Pin14 of VIC1, VIC2 are feedback pin to SAG compensation(DC characteristic compensation of
siganl).
The signal to which gain is adjusted by amplifier is outputted from jack via 75ohm Resistance(VR10~VR13,
VR22~24).
Samsung Electronics 5-17
Circuit Descriptions
5-7 Audio
5-7-1 Outline
The four data (Data 0~3) outputted from A/V decoder (ZIC1 ; ZiVA4.1) are supplied to DATA 0 for 2-channel
mixed audio output and to DATA 1~3 for Analog audio output (5.1-channel).
The audio data (0~3) transmitted from A/V decoder (ZIC1 ; ZiVA4.1) are converted into analog signal via audio
D/A converter and outputted via post filter and amplifier.
CD and VCD are outputted with only 2 channels audio data and transmit them to Data 0 and Data 1.
Front L/R channel is outputted in mixed audio output (L/R output) and analog audio output and surround L/R,
center and subwoofer arenâ??t outputted.
If DVD of 2 channels source disc is used, it is outputted by the same way with CD and VCD.
If 5.1-channel source disc, front L/R channel is outputted in Data 1, Surround L/R in Data 2 and Center/Sub-
woofer in Data 3. At that time, 5.1 channel can be downmixed in 2 channel in Data 0.
Mixed Audio Output (2-Channel)
ZIC1 DATA0 POST L
AMP
AIC1
(ZiVA4.1) FILTER
LRCK AK4324
A/V Decoder BCK POST
D/A CONVERTER R
AMP
FILTER
Fig. 5-22 Audio Output Block Diagram
5-18 Samsung Electronics
Circuit Descriptions
5-7-2 DVD Audio Output
Source Data Types :
MPEG-1,-2, Dolby Digital,
CD-DA, LPCM
ZIC2, 3 (LOCAL DRAM) ZIC1 (ZiVA4.1 ; A/V DECODER)
HOST or DVD/CD
INTERFACE
RECEIVER
or
IEC-958/1937 IEC-958/1937
AUDIO INPUT
DECODER
OUTPUT PROCESS INTERFACE
BUFFER
(IEC-958/1937)
Compressed Data
2-Channel LPCM, Decoder
(MPEG, Dolby Digital),
Dolby Digital, Decoded MPEG
CD-DA, LPCM
AUDIO DECODER
(MPEG, DOLBY DIGITAL,
CD-DA, LPCM
Uncompressed 16- or 24-bit
LPCM camples at
fs=44.1,48,96KHz
2-, 4, or 6-
AUDIO OUTPUT DIGITAL AUDIO AUDIO
CHANNEL OUTPUT
BUFFER INTERFACE DAC
PROCESS
Fig. 5-23 Audio Decoder and Output Interface Datapath
1) Compressed Data
The audio data inputted to ZIC1 (ZiVA4.1) A/V decoder is divided into compressed data and uncompressed data.
It is compressed data that is compressed with multi-channel audio data such as Dolby digital, MPEG, DTS, etc.
The compressed data inputted to ZIC1 (ZiVA4.1) is converted into the uncompressed data of 2, 4, and 6 channels
through ZiVA4.1 built-in audio decoder and is outputted to Data 0, 1, 2, and 3 through digital audio interface.
The compressed data is transmitted to external AC-3 amplifier or MPEG/DTS amplifier as IEC-958/1937 trans-
mission data format compressed by ZiVA4.1 built-in IEC-958 output process.
2) Uncompressed Data
The uncompressed data is that data isnâ??t compressed, so it is called CD-DA, LPCM data.
The 2 channels data is converted through audio decoder 2-channel data and Data 0 and Data 1 are outputted in
digital audio interface.Via IEC-958 output process, they is transmitted to digital amplifier or AC-3/MPEG/DTS
amplifier built in the external digital input source with IEC-958/1937 transmission format.
Samsung Electronics 5-19
Circuit Descriptions
MEMO
5-20 Samsung Electronics
No focus incoming
No Disc recognition
A
Samsung Electronics
LD is outputted FE in SIC1-65 No
No
B Check RIC1 and A, B, C, D input.
from object lens at is within specified range?
play key input?
6. Troubleshooting
Yes
Yes
No focus incoming and
no disc occurs. No
DRIC4-1, 2 output
Check DRIC4
are normal?
Yes
A
Check open state from
DRIC4 to pick-up.
6-1
6-2
No pick-up home positing NO LD ON
B
Troubleshooting
No
RIC1-28 is 5V? Check MIC1
No
SLD, SIC1-73
Check MIC1
output is normal?
Yes
Yes
Divide RQ1 emitter terminal
voltage and 5V real voltage
LED+, SLED- No difference into 10ohm.
Check SIC4
SIC4-32, 33 output are
normal?
Yes
Yes
No
Open check in related circuit.
Current exceeds 0.1A?
Check the Sled Motor and connection
Yes
LD out pick-up replace.
Samsung Electronics
No Search Operation FINE SEEK Check
Samsung Electronics
FINE SEEK MIRR Yes
No
MIRR, SIC1-38 No
RFAGCO, RIC1-89 Check RIC1 Peripheral curcuit.
signal (RIC1-57) is missing?
output is nrmal? output level is normal?
No
Yes
Check pick-up.
Yes
TZCO signal No
Check SIC1 Peripheral curcuit.
Check RIC1 peripheral circuit. (SIC1-52) is occurs?
Yes
No
Track incomming is Time out due to many jump counts.
No
Actual velocity occurs delayed?
Check SIC1 peripheral circuit.
at SIC1-73 terminal?
Yes
Yes
No No
TE is within SIC1-76 output
2V and 3V? is normal?
Actual velocity occurs No
Check SIC4 peripheral circuit.
at ISC4-32, 33 terminal?
Yes Yes Check RIC1-36 terminal.
Yes
SIC4-28, 29
No No
Pick-up transfer smooth. terminal outputs are
normal?
Yes Yes Check SIC4 peripheral circuit.
TE occurs in No
No
A
Focus On?
search range? Check MECHA.
Yes
Check SIC1 peripheral circuit. Check DCN1 and pick-up.
See "Fine Seek Check"
6-3
Troubleshooting
6-4
Abnormal rotation of
No Tray open/close
disc motor
Troubleshooting
No
No
Input of RF signal RIC1-88 output
MIC1-84, 85 is
is normal? (SIC1-59) is normal? No
Open ; "L", "L" ? Micom (MIC1) error.
Close ; "H", "H"?
Yes Yes
Check RIC1 peripheral Yes
circuit and A, B, C, D.
No
No RIC1-86 output
SPD output is normal?
are normal?
(SIC1-74)
No
Check SIC4-35, 36
Check SIC4.
output at open/close
Yes Yes
After resoldering SIC1. Check RIC1 soldering and power.
Yes
Check path to RIC1 and SIC1.
Check signal line state from
SIC4-35, 36 to tray motor.
No
SIC4-2 output (FG) Check DRIC1 soldering and power.
is normal?
Yes
No
SIC4-9 signal Check DIC1, MIC1.
MON is "H" ?
Yes
Check or replace disc motor.
Samsung Electronics
CD/VCD/DVD L/R output error
Digital output error
(Mixed Audio output)
Samsung Electronics
No No
Normal DATA 0 is
Output in ZIC1-127 is normal?
Check ZIC1-121 output. Check ZIC1 peripheral circuit.
input in AIC1-6?
Yes Yes
Check ZIC1-125
Analog output of Output in
No No
(CD/VCD ; 16.9344MHz, Check AIC3.
AIC1-20, 21, 22, 23 is AIC3-6, 8, 10 is
DVD ; 18.432MHz)
normal? normal?
Yes Yes
Check AVJ4, 5 peripheral
No
AOP1-1, 7 output soldering shot.
Check AOP1 peripheral circuit.
is normal?
Yes
Base terminal level No
Check FIC1-47 mute.
of AQ1, AQ3
are "L"?
Yes
Check AVJ2 peripheral
soldering shot.
6-5
Troubleshooting
6-6
Key operation or
No Power
remote control error
(Standby LED OFF)
Troubleshooting
All power is measured Yes
correctly and front cable is Check A/V decoder signal process block.
Yes
Replace fuse.
PFD01 error? properly connected?
Yes
Yes
No
All clocks (20MHz,
No
33.8688MHz, 27MHz) of main PCB Check all clock oscillating parts.
oscillate normally?
No
PDS01 voltage Yes
Replace PDS01 ~ 04.
is missing? Yes
Check short pin out of micom
common-bus (8-bit).
Yes No
Check short or operating of micom.
/CS2, /RD, /WR signal occur?
Check soldering of micom and
communication devices.
Collector of No
Yes
Check 2d voltage. Yes
PQR11 output normal
voltage?
Yes
No
Check ZIC1 peripheral unit.
Play works?
Yes
No
Operation of
Replace PQR12.
PQR11 is normal?
C
Yes
Yes
Switching operation Replace PQR11.
of PQR11 is normal? Check feed back.
No
Replace PQR11.
Samsung Electronics
C
No front (SET) operation
Yes
MIC1-9 is fixed to 0V? Check A/V decoder signal process block. No
Samsung Electronics
REF +/-, 5V-all, -28V Check power status.
power is supplied.
No
Yes
Yes
Check DVD signal process block.
MIC7-4, 5 pin is fixed to 0V? No
Check X-TAL peripheral circuit.
12MHz oscillation (FY1)?
No
Yes
MIC1-10, 19
Yes
waveform state (0, 1) Check MIC1 peripheral soldering.
No
changes whenever pressing Reset working in
Check reset peripheral circuit of FIC2.
front key? FIC1-12?
No
Yes
Check eith article
"No Front (SET) Operation"
No
Check FIC1 soldering.
FIC1 soldering is OK?
No
Check S/W interface.
No Check communication status with
Key of STOP, PLAY, OPEN
main micom
work normally?
(Check FIC1 pins 27, 73, 74, 75, 95)
Yes
If the problem persists ;
Check after replacing Jack PCB,
with another one.
Check other parts for abnormal
front operation persists.
6-7
Troubleshooting
6-8
DVD play error S-Video output error
Troubleshooting
'NO DISK' appears
No No
VSW1 video select
after pick-up moves up and Check DIC1, MIC1 peripheral short. Move the select switch to up position.
switch is up position?
down twice at power on?
Yes Yes
No No
27MHz clock is VR121 of VSW1
Check 27MHz oscillating part. Check the soldering of VSW1.
input in DIC1-14? is high state?
Yes Yes
No No
Signals are output Check the connection between
Pin 87 in FIC1
Replace SIC1.
from SIC1-42, 44? pin 87 in FIC1 and VR121.
is high state?
Yes Yes
D
ZIC1 peripheral soldering
and short check.
Samsung Electronics
CVBS output error
Y/Pr/Pb output error
D
Pin of VDD_2.5 & No Check the connection between
VDD-3.3 in Zic1 has pin 1 in PCNS1 and pin 3 in ZIC5.
No
VSW1 video select
Samsung Electronics
normal level?
Move the select switch to down position.
switch is down position?
Yes
Yes 27MHz clock
No Check the connection between
input is normal at
pin 6 in ZIC4 and pin 129 in ZIC1.
pin 159 in ZIC1?
No
VR121 of VSW1 Check the soldering of VSW1. Yes
is low state?
Analog output No
Yes Check the soldering of ZIC1.
is normal at pin 133
in ZIC1?
Yes
No Check the connection between
Pin 87 in FIC1
pin 87 in FIC1 and VR121.
is high state?
Analog signals are No Check the connection netween
inputted normally pin 133 in ZIC1 and VIC1.
Yes pin 7 in VIC1?
Yes
D
Power is No Check the connection betwen
normal at pin 16 VIC1 and emitter of PQS58.
in VIC1?
Yes
Pin 1 in VIC1 No Check the connection between
is in low stste? pin 10 in FIC1 and pin 1 in VIC1.
Yes
Peak to peak
No
voltage level of pin 10 Check the soldering of VIC1.
in VIC1 is 2V?
Yes
Video signal of No Check the connection between
about 1V appears at VIC1 and output jack.
output jack?
Yes
Check the RCA cable.
6-9
Troubleshooting
Troubleshooting
MEMO
6-10 Samsung Electronics
7. Exploded View and Parts List
Page
7-1 Cabinet Assembly (DVD-611) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 7-2
7-2 Cabinet Assembly (DVD-511) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 7-4
7-3 Deck Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 7-6
Samsung Electronics 7-1
7-2
S.N.A. : Service Not Available 151
Exploded Views and Parts List
S.N.A (DECK-DVD MECHA)
151
150
150
602 (ASS'Y-PCB-JACK)
CN1A
7-1 Cabinet Assembly (DVD-611)
151
101
601 (ASSY-PCB-MAIN)
1 150
610
11 UT01
13
152
151
701
l
S.N.A. (CHASSIS-REAR)
2
S.N.A. (CABINET-BOTTOM)
12
12
Samsung Electronics
Exploded Views and Parts List
Loc. No Parts No. Description ; Specification Remark
1 AH97-00359A ASSY FRONT CABINET;DVD-611/XAA,ASSY,XAA
2 AH97-00364A ASSY-DOOR;DVD-611,ASSâ??Y,-
11 AH61-00301A HOLDER-DECK;-,HIPS94V2,-,BLK,-,DVD-811
12 AH64-80001E FOOT-FRONT;-,ABS94,HB,T2,SIL,H/STAMP,DVD
13 AH61-00303A HOLDER-CORD POWER;-,ABS 94HB,-,BLK,-,DVD
101 AH64-00489A CABINET TOP;-,PCM T0.65,-,-,-,BLK,-,DVD-
150 6003-000275 SCREW-TAPTITE;BH,+,B,M3,L10,BLK,SWCH1018
151 6003-000276 SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(YEL),SWC
152 6003-000282 SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(BLK),SWCH
601 AH92-00337B ASSY PCB-MAIN;DVD-611/XAA,MAIN PCB
602 AH92-00338D ASSY PCB-JACK;DVD-611/XAA,JACK PCB
610 AC39-10200N POWER-CORD;EP2,SPT-2,AWG#18,1.8MT,WAFER,
701 AH92-00583A ASSY PCB-KEY;DVD-611/XAA,KEY PCB
CN1A 3809-001180 CABLE-FLAT;30V,-30to+80C,80mm,35P,1.25mm
UT01 AH59-00056A REMOCON-ASSâ??Y;-,-,-,-,DVD-611,XAA
Samsung Electronics 7-3
7-4
S.N.A. : Service Not Available 151
Exploded Views and Parts List
S.N.A (DECK-DVD MECHA)
151
150
150
602 (ASS'Y-PCB-JACK)
CN1A
7-2 Cabinet Assembly (DVD-511)
151
101
601 (ASSY-PCB-MAIN)
1 150
610
11 UT01
13
152
151
701
l
S.N.A. (CHASSIS-REAR)
2
S.N.A. (CABINET-BOTTOM)
12
12
Samsung Electronics
Exploded Views and Parts List
Loc. No Parts No. Description ; Specification Remark
1 AH97-00360A ASSY FRONT CABINET;DVD-610/XAA,ASSY,XAA
2 AH97-00365A ASSY-DOOR;DVD-610,ASSâ??Y,-
11 AH61-00301A HOLDER-DECK;-,HIPS94V2,-,BLK,-,DVD-811
12 AH64-80001E FOOT-FRONT;-,ABS94,HB,T2,SIL,H/STAMP,DVD
13 AH61-00303A HOLDER-CORD POWER;-,ABS 94HB,-,BLK,-,DVD
101 AH64-00489A CABINET TOP;-,PCM T0.65,-,-,-,BLK,-,DVD-
150 6003-000275 SCREW-TAPTITE;BH,+,B,M3,L10,BLK,SWCH1018
151 6003-000276 SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(YEL),SWC
152 6003-000282 SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(BLK),SWCH
601 AH92-00337B ASSY PCB-MAIN;DVD-611/XAA,MAIN PCB
602 AH92-00338E ASSY PCB-JACK;DVD-511/XAA,JACK PCB
610 AC39-10200N POWER-CORD;EP2,SPT-2,AWG#18,1.8MT,WAFER,
701 AH92-00582A ASSY PCB-KEY;DVD-511/XAA,KEY PCB
CN1A 3809-001180 CABLE-FLAT;30V,-30to+80C,80mm,35P,1.25mm
UT01 AH59-00056A REMOCON-ASSâ??Y;-,-,-,-,DVD-611,XAA
Samsung Electronics 7-5
Exploded Views and Parts List
7-3 Deck Assembly
H107
H103 H102
H100
900
H108 905
H105
H104
H109
H101
H110
H106
H220
H200
H203
900
901
900
906
H201
H206
H207
H205
H204
H208
H210
904
903
H209
900
H240
H241
900
7-6 Samsung Electronics
Exploded Views and Parts List
Loc. No Parts No. Description ; Specification Remark
900 6003-001157 SCREW-TAPTITE;PWH,+,B,M2,L6,ZPC(YEL),SWR
901 6001-001332 SCREW-MACHINE;FH,+,M2,L8,ZPC(YEL),SWRCH1
903 6001-001333 SCREW-MACHINE;SOCKET,HEX,M2.6,L8,ZPC(YEL
904 6001-001196 SCREW-MACHINE;BH,+-,M2,L4,ZPC(YEL),SWRCH
905 BG60-10020A SCREW-SP MOTOR;-,BHW TOOTH,-,-M1.7,L3-
906 AH60-00010A SCREW-MACHINE-MOTOR;-,+SWCH18AK,M1.7,L2
H100 AH61-00391A HOUSING-ASSY;DP-5,ABS+POM,-,-,-,-,-,-,-,
H101 AH61-00272A CHASSIS-HOUSING;-,ABS(SR-0320),-,-,-,-,B
H102 AH66-00111A CLAMPER-ASSY;DP-5,POM+MAGNET,-,-,-,DP-5
H103 AH66-00080A LEVER-S/W;WHITE,-,-,-,-,-,-,-
H104 AH66-00074A GEAR-HOUSING;-,POM M90-44,-,-,-,-,-,-,-,
H105 AH66-00072A PULLEY-GEAR;-,POM M90-44,-,-,-
H106 AH31-00015A MOTOR-LOAD ASSY;-,DP-5,-,-
H107 AH66-00112A BELT-PULLEY;-,CR,T1.5,ID30,-,-,DP-5
H108 AH66-00073A GEAR-TRAY;-,POM M90-44,-,-,-,-,-,-,-,-
H109 AH66-00079A SLIDER-HOUSING;DP-5,-,-,-,PBT #2002K,-
H110 AH66-00081A TRAY-DISC;-,ABS(GF) VG4820,-,BLK,-,DP-5
H200 AH97-00369A ASSY-P/U DECK;DP-5,-,-
H201 AH97-00410A ASSY-BRKT-SUB;SECC+RUBBER+MOTOR,DP-5,-
H203 AH61-50327A SHAFT-P/U;DP,SUS420J2,OD3,L84.7,S/FINISH
H204 AH66-00075A GEAR-FEED A;-,POM M90-44,-,-,-,-,-,-,-,-
H205 AH66-00076A GEAR-FEED B;-,POM M90-44,-,-,-,-,-,-,-,-
H206 AC60-30306A WASHER-SLIT;-,-,ID2.1,OD5.0,T0.5,-,POLYS
H207 AH31-00017A MOTOR-SPINDLE ASSY;-,DP-5,-,-
H208 AH61-00403A SPRING-SPINDLE;-,SWPB,-,CS,PI4.9,PI0.7,-
H209 AH61-00273A CHASSIS-SUB;-,ABS(SR-0320),-,-,-,-,BLK,-
H210 AH31-00016A MOTOR-FEED ASSY;-,DP-5,-,-
H220 AH30-00008A PICK UP-ASSY;VALINO(1LD)
H240 AH92-00608A ASSY PCB-DECK;VALINO DECK 1L
H241 3809-001181 CABLE-FLAT;30V,-30to+80C,80mm,40P,1.25mm
Samsung Electronics 7-7
Exploded Views and Parts List
MEMO
7-8 Samsung Electronics
8. Electrical Parts List
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
601 AH92-00337B ASSY PCB-MAIN;DVD-611,MAIN PCB DVD-611/511 MR10 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MR11 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MR12 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
CN8 3708-001364 CONNECTOR-FPC/FC/PIC;35P,1.25MM,STRAIGHT
MR13 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
DC1 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MR14 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
DC10 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MR15 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
DC12 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MR2 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
DC13 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MR3 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
DC14 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MR4 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
DC15 2203-001640 C-CERAMIC,CHIP;0.39nF,10%,50V,X7R,TP,160
MR5 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
DC16 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MR6 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
DC2 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MR7 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
DC23 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MR8 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
DC24 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MR9 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
DC3 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MY1 2801-000199 CRYSTAL-UNIT;20MHz,50ppm,28-AAA,16pF,50o
DC4 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC1 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
DC5 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC2 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
DC7 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC3 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
DCN1 3708-001085 CONNECTOR-FPC/FC/PIC;40P,1.25mm,STRAIGHT
PC4 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
DIC1 AH13-10030P IC-ASIC;-,KS1453,TQFP,128P,DATA PRO. I
PCN1 3711-003358 CONNECTOR-HEADER;BOX,8P,1R,2.5mm,STRAIGH
DIC2 1105-001233 IC-DRAM;416C256,256KX16BIT,SOJ,40P,400MI
PE1 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
DIC3 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110
PE2 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
DR1 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608
PE3 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
DR16 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608
PE4 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
DR17 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608
RC1 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DR18 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
RC10 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
DR19 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
RC11 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DR2 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608
RC12 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,
DR20 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
RC13 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,
DR21 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
RC14 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DR22 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
RC16 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DR3 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608
RC17 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DR4 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608
RC2 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DR5 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608
RC20 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DR7 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608
RC21 2203-000384 C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,160
DR8 2011-000816 R-NETWORK;100ohm,5%,63mW,L,CHIP,8P,TP
RC22 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DR9 2011-000816 R-NETWORK;100ohm,5%,63mW,L,CHIP,8P,TP
RC23 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC1 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC24 2203-001697 C-CERAMIC,CHIP;0.082nF,5%,50V,NP0,TP,160
MC10 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC25 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC11 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
RC26 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC12 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC27 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC13 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC28 2203-001052 C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160
MC14 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC29 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC15 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC3 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC16 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC30 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC17 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC32 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC2 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC33 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC3 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
RC34 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC4 2203-000426 C-CERAMIC,CHIP;0.018nF,5%,50V,NP0,TP,160
RC35 2203-000236 C-CERAMIC,CHIP;0.1nF,5%,50V,NP0,TP,1608
MC5 2203-000426 C-CERAMIC,CHIP;0.018nF,5%,50V,NP0,TP,160
RC36 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
MC6 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC39 2203-000531 C-CERAMIC,CHIP;2.7nF,10%,50V,X7R,TP,1608
MC7 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
RC40 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC8 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC41 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC9 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC42 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MIC1 0903-001185 IC-MICROCONTROLLER;95C265,16Bit,LQFP,100
RC43 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MIC2 1102-001090 IC-EPROM;27C081,1MX8BIT,DIP,32P,600MIL,1
RC44 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MIC3 1106-000401 IC-SRAM;681000,128Kx8BIT,SOP,32P,525MI
RC45 2203-001652 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
MIC4 1103-001133 IC-EEPROM;24C020,256x8BIT,SOP,8P,150MIL,
RC46 2203-001652 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
MIC5 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110
RC47 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MIC6 0801-000411 IC-CMOS LOGIC;74HC32,OR GATE,SOP,14P,150
RC48 2203-001652 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
MIC7 0801-002517 IC-CMOS LOGIC;7SET00,NAND GATE,SOP,5P,63
RC50 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MIC8A 3704-000472 SOCKET-IC;32P,DIP,SN,2.54mm
RC51 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MR1 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
8-1
Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
RC52 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 RR45 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
RC53 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 RR46 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
RC54 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 RR47 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
RC55 2203-000888 C-CERAMIC,CHIP;4.7nF,10%,50V,X7R,TP,1608 RR48 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
RC56 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 RR49 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
RC6 2203-001052 C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160 RR5 2104-001068 VR-SMD;10Kohm,25%,1/20W,TOP
RC7 2203-001640 C-CERAMIC,CHIP;0.39nF,10%,50V,X7R,TP,160 RR50 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
RC8 2203-000384 C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,160 RR51 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608
RC9 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 RR52 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608
RD1 0401-000008 DIODE-SWITCHING;DAN217,80V,100mA,SOT-23, RR53 2007-000312 R-CHIP;10OHM,5%,1/8W,DA,TP,3216
RD2 0403-001079 DIODE-ZENER;UDZ3.9B,7%,200MW,SOD-323,TP RR57 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
RD3 0401-000008 DIODE-SWITCHING;DAN217,80V,100mA,SOT-23, RR58 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
RD6 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT- RR59 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608
RE11 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m RR6 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
RE12 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 RR62 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
RE13 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 RR65 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608
RE14 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m RR68 2007-000130 R-CHIP;39Kohm,5%,1/16W,DA,TP,1608
RE17 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 RR69 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
RE2 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 RR7 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608
RE8 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 RR70 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608
RE9 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 RR72 2007-000103 R-CHIP;120Kohm,5%,1/16W,DA,TP,1608
RIC1 AH13-10030Y IC ASIC;-,KS1461,VQFP,100pin,RF IC RR8 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608
RIC3 1202-000121 IC-VOLTAGE COMP.;2903,SOP,8P,150MIL,DUAL RR80 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
RL2 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm RR81 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
RL3 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- RR82 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
RL4 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- RR83 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
RL5 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm RR85 2007-000108 R-CHIP;510Kohm,5%,1/16W,DA,TP,1608
RQ1 0501-000279 TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW,SOT- RR86 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
RQ2 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP RR87 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
RQ3 0501-000279 TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW,SOT- RR9 2007-000312 R-CHIP;10OHM,5%,1/8W,DA,TP,3216
RR1 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608 SC1 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RR10 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608 SC10 2203-001222 C-CERAMIC,CHIP;820pF,10%,50V,X7R,TP,1608
RR11 2007-000512 R-CHIP;2.4Kohm,5%,1/16W,DA,TP,1608 SC11 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR12 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608 SC14 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608
RR13 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608 SC15 2203-001052 C-CERAMIC,CHIP;0.56nF,10%,50V,X7R,TP,160
RR14 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608 SC16 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR15 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 SC17 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,
RR16 2007-000704 R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608 SC18 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR17 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 SC19 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
RR18 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 SC2 2203-001573 C-CERAMIC,CHIP;0.012nF,5%,50V,NP0,TP,160
RR19 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 SC26 2203-002398 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,1608
RR2 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608 SC29 2203-000372 C-CERAMIC,CHIP;15nF,10%,50V,X7R,TP,1608,
RR20 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 SC3 2203-001573 C-CERAMIC,CHIP;0.012nF,5%,50V,NP0,TP,160
RR21 2007-000704 R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608 SC30 2203-000372 C-CERAMIC,CHIP;15nF,10%,50V,X7R,TP,1608,
RR22 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 SC31 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608
RR23 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 SC32 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608
RR24 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 SC33 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR25 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 SC36 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR28 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 SC38 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR29 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 SC40 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR3 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608 SC41 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,
RR30 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608 SC44 2203-002398 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,1608
RR31 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608 SC49 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR32 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 SC50 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR33 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608 SC51 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR34 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 SC52 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR35 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 SC53 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RR36 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 SC55 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR37 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 SC57 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR38 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 SC58 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR39 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 SC59 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR4 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 SC6 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR40 2007-000655 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608 SC60 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR41 2007-000708 R-CHIP;3.9Kohm,1%,1/16W,DA,TP,1608 SC61 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR43 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 SC62 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RR44 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 SC64 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
Samsung Electronics
8-2
Electrical Parts List
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
SC65 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 SR70 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
SC66 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 SR71 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
SC68 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 SR73 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
SC7 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608 SR74 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
SC9 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP, SR75 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
SD2 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT- SR76 2007-000616 R-CHIP;24Kohm,5%,1/16W,DA,TP,1608
SD3 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT- SR77 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608
SE1 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 SR80 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SE2 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 SR81 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SE3 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 SR82 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SE5 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m SR83 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SE53 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 SR84 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SE54 2401-002075 C-AL;4.7uF,20%,50V,GP,TP,5x11,5 SR85 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SE55 2401-002075 C-AL;4.7uF,20%,50V,GP,TP,5x11,5 SR9 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
SE56 2401-002075 C-AL;4.7uF,20%,50V,GP,TP,5x11,5 SY1 2801-000261 CRYSTAL-UNIT;33.8688MHZ,50PPM,28-AAA,12P
SE63 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 ZC1 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SIC1 AH13-10030N IC-ASIC;-,KS1452,QFP,80P,DSSP IC ZC10 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SIC3 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110 ZC11 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SIC4 1003-001298 IC-MOTOR DRIVER;KA3017,HQFP,48P,550MIL,1 ZC12 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SIC8 AH14-10004T IC-ANALOG M/PLEXER;MC14053BD,SOP,TAPE 16 ZC13 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- ZC14 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SL4 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- ZC15 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SQ1 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP ZC16 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SQ2 0504-000156 TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K ZC17 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR1 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 ZC18 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR10 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 ZC19 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR11 2007-000107 R-CHIP;470Kohm,5%,1/16W,DA,TP,1608 ZC2 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR12 2007-001235 R-CHIP;910Kohm,5%,1/16W,DA,TP,1608 ZC29 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SR14 2007-000450 R-CHIP;180ohm,5%,1/16W,DA,TP,1608 ZC3 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR15 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 ZC37 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SR16 2007-000131 R-CHIP;91Kohm,5%,1/16W,DA,TP,1608 ZC38 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR17 2007-000081 R-CHIP;2.7Kohm,5%,1/16W,DA,TP,1608 ZC39 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR18 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608 ZC4 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
SR19 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 ZC40 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR2 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608 ZC41 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR20 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 ZC42 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR21 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ZC43 2203-001652 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
SR22 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ZC44 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR23 2007-000130 R-CHIP;39Kohm,5%,1/16W,DA,TP,1608 ZC45 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR24 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ZC46 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR26 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608 ZC47 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR3 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 ZC48 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR32 2007-000080 R-CHIP;2Kohm,5%,1/16W,DA,TP,1608 ZC49 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR33 2007-000080 R-CHIP;2Kohm,5%,1/16W,DA,TP,1608 ZC5 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
SR34 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 ZC50 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR35 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 ZC51 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR36 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 ZC58 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
SR37 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608 ZC59 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SR38 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 ZC6 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
SR39 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 ZC60 2203-000681 C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,160
SR4 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 ZC61 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR40 2007-000101 R-CHIP;82Kohm,5%,1/16W,DA,TP,1608 ZC62 2203-000681 C-CERAMIC,CHIP;0.027nF,5%,50V,NP0,TP,160
SR41 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 ZC63 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
SR42 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 ZC65 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR43 2007-000106 R-CHIP;220Kohm,5%,1/16W,DA,TP,1608 ZC66 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR44 2007-000098 R-CHIP;56Kohm,5%,1/16W,DA,TP,1608 ZC67 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR45 2007-000655 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608 ZC68 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR47 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 ZC69 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR5 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608 ZC7 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR52 2007-000704 R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608 ZC70 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR53 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608 ZC71 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR6 2007-000098 R-CHIP;56Kohm,5%,1/16W,DA,TP,1608 ZC72 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR60 2007-000097 R-CHIP;47Kohm,5%,1/16W,DA,TP,1608 ZC73 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR67 2007-000034 R-CHIP;1OHM,5%,1/8W,DA,TP,3216 ZC74 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR68 2007-000034 R-CHIP;1OHM,5%,1/8W,DA,TP,3216 ZC75 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SR7 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608 ZC76 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
8-3
Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
ZC77 2203-000426 C-CERAMIC,CHIP;0.018nF,5%,50V,NP0,TP,160 602 AH92-00338D ASSY PCB-JACK;DVD-611,JACK PCB DVD-611
ZC78 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 AH92-00338E ASSY PCB-JACK;DVD-511,JACK PCB DVD-511
ZC8 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
ZC9 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 AC10 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
ZE30 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 AC11 2301-000423 C-FILM,PEF;3.3NF,5%,100V,TP,7X10X4.5MM,5
ZE34 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 AC13 2301-000423 C-FILM,PEF;3.3NF,5%,100V,TP,7X10X4.5MM,5
ZE35 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 AC14 2301-000402 C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
ZE36 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 AC15 2301-000402 C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
ZE37 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 AC201 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
ZIC1 1204-001673 IC-DECODER;ZIVA4.1,QFP,208P,1100MIL,PLAS AC202 2203-000260 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012 DVD-611 ONLY
ZIC2 1105-001268 IC-DRAM;3617161,16BIT,TSOP,50P,-,7NS,3 AC203 2203-000260 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012
ZIC3 1105-001268 IC-DRAM;3617161,16BIT,TSOP,50P,-,7NS,3 AC4 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
ZIC4 AH14-10004R IC;M74HCU04,SOP,TAPE 14P AC5 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
ZIC5 0402-000309 DIODE-RECTIFIER;1SR154-400,400V,1A,PSM AC6 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
ZL10 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm AC7 2301-000402 C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
ZL11 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- AC8 2301-000402 C-FILM,PEF;1nF,5%,50V,TP,5x7x2.8mm,5mm
ZL12 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm AC9 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
ZL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- AD51 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-
ZL6 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- AD54 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
ZL7 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- AD55 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
ZL9 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- AD60 0407-000116 DIODE-ARRAY;DAP202K,80V,100mA,CK2-3,SOT-
ZR1 2007-001164 R-CHIP;75ohm,1%,1/16W,DA,TP,1608 AE1 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5
ZR16 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AE17 2401-000598 C-AL;1uF,20%,50V,GP,TP,4x7,5
ZR17 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AE2 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5
ZR18 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AE21 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5
ZR23 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 AE22 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5
ZR27 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 AE3 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5
ZR28 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 AE51 2401-001969 C-AL;470uF,20%,25V,GP,TP,10x12.5,5
ZR29 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 AE52 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5
ZR30 2011-000475 R-NETWORK;33ohm,5%,63mW,L,CHIP,8P,TP AE6 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
ZR31 2011-000475 R-NETWORK;33ohm,5%,63mW,L,CHIP,8P,TP AE9 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
ZR32 2011-000475 R-NETWORK;33ohm,5%,63mW,L,CHIP,8P,TP AIC1 1002-001213 IC-D/A CONVERTER;AK4393VF,24BIT,SOP,28P,
ZR33 2011-000475 R-NETWORK;33ohm,5%,63mW,L,CHIP,8P,TP AIC3 AH14-10004R IC;M74HCU04,SOP,TAPE 14P
ZR34 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 AL1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-
ZR35 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 AL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-
ZR37 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 AL201 2901-001125 FILTER-EMI ON BOARD;50V,0.5A,-,220pF,7x7 DVD-611 ONLY
ZR38 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AOP1 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m
ZR68 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 AQ1 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-
ZR69 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 AQ3 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-
ZR70 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 AQ51 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
ZR71 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 AQ52 0504-000156 TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22K
ZR72 2011-000816 R-NETWORK;100ohm,5%,63mW,L,CHIP,8P,TP AQ55 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-
ZR73 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 AQ56 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-
ZR75 2007-001164 R-CHIP;75ohm,1%,1/16W,DA,TP,1608 AQ57 0504-001003 TR-DIGITAL;KSR2003,PNP,300MW,22K/22K,TO-
ZR76 2007-001164 R-CHIP;75ohm,1%,1/16W,DA,TP,1608 AR10 2007-000267 R-CHIP;1.8KOHM,5%,1/10W,DA,TP,2012
ZR77 2007-001164 R-CHIP;75ohm,1%,1/16W,DA,TP,1608 AR11 2001-000258 R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2M
ZR78 2007-001164 R-CHIP;75ohm,1%,1/16W,DA,TP,1608 AR14 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
ZR79 2007-007332 R-CHIP;1.18KOHM,1%,1/10W,DA,TP,2012 AR15 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
ZR82 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608 AR16 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
ZR84 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 AR17 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
ZR86 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 AR18 2007-000221 R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
ZR88 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608 AR19 2007-000221 R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
ZR89 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608 AR2 2001-000258 R-CARBON;1.8KOHM,5%,1/8W,AA,TP,1.8X3.2M
ZR90 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 AR201 2007-000766 R-CHIP;330OHM,5%,1/10W,DA,TP,2012 DVD-611 ONLY
ZR91 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AR202 2007-001247 R-CHIP;91OHM,5%,1/10W,DA,TP,2012 DVD-611 ONLY
ZR92 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AR203 2001-000515 R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
ZR93 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AR21 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
ZY1 2801-003554 CRYSTAL-UNIT;27MHz,10ppm,28-AAM,12pF,40o AR22 2001-000515 R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
AR24 2001-000515 R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
AR26 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
AR28 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
AR29 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
AR3 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
AR30 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
AR31 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012
AR32 2007-000221 R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012
Samsung Electronics
8-4
Electrical Parts List
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
AR33 2007-000221 R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012 FR32 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AR35 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR33 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AR36 2001-000515 R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM FR34 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AR38 2001-000515 R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM FR35 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AR4 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012 FR36 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AR40 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR37 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AR5 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR3S 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012
AR51 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR43 2001-000793 R-CARBON;47OHM,5%,1/8W,AA,TP,1.8X3.2MM
AR54 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM FR44 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
AR55 2001-000241 R-CARBON;1.5KOHM,5%,1/8W,AA,TP,1.8X3.2M FR45 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
AR56 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM FR46 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AR6 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR4S 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012
AR7 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR5 2001-000325 R-CARBON;120OHM,5%,1/8W,AA,TP,1.8X3.2MM
AR8 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR51 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012
AR9 2007-000267 R-CHIP;1.8KOHM,5%,1/10W,DA,TP,2012 FR52 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012
AVJ1 3722-001469 JACK-RCA;3P/4P,3.2mm,NI,BLK,- DVD-611 ONLY FR53 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AVJ2 3722-001467 JACK-RCA;3P,3.2mm,NI,BLK,- FR54 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AVJ4 3722-001053 JACK-RCA;1P,3.2mm,NI,BLK,- DVD-611 ONLY FR57 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM DVD-511 ONLY
AVJ5 3707-001005 CONNECTOR-OPTICAL;PLUG,SM,-,4.4/2.0MM FR6 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M
AZD51 0403-000551 DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500m FR7 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
CN1 3708-001364 CONNECTOR-FPC/FC/PIC;35P,1.25MM,STRAIGHT FR8 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012
CN3 AH39-00179A CONNECT WIRE;-,-,-,-,#26,-,-,-,-,-,-,-,1 FY1 2802-000108 RESONATOR-CERAMIC;12MHZ,0.5%,BK,10.0X5.0
FC10 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP, JP347 2008-000141 R-FUSIBLE;2.2ohm,5%,1/4W,AA,TP,2.6x6.7mm DVD-511 ONLY
FC14 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP, JP383 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MM DVD-511 ONLY
FC15 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP, JP58 2701-000114 INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm
FC16 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,- JP80 2007-000033 R-CHIP;0OHM,5%,1/8W,DA,TP,3216
FC2 2202-000162 C-CERAMIC,MLC-AXIAL;.015NF,5%,50V,SL,TP, JP81 2007-000033 R-CHIP;0OHM,5%,1/8W,DA,TP,3216
FC3 2202-000162 C-CERAMIC,MLC-AXIAL;.015NF,5%,50V,SL,TP, PBR11 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
FC4 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP, PBS01 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,
FC6 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP, PCD02 2201-000934 C-CERAMIC,DISC;3.3nF,20%,400V,Y5U,TP,15x
FC7 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V PCD03 2201-000934 C-CERAMIC,DISC;3.3nF,20%,400V,Y5U,TP,15x
FD10 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35, PCD12 2201-000930 C-CERAMIC,DISC;0.22nF,10%,500V,Y5P,TP,5.
FD6 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35, PCNS1 AH39-00177A CONNECT WIRE;-,-,-,-,#24,-,-,-,-,-,-,-,1
FD7 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35, PCNS2 3711-000178 CONNECTOR-HEADER;1WALL,2P,1R,3.96mm,STRA
FD8 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35, PCR01 2201-000795 C-CERAMIC,DISC;10nF,10%,400V,Y5P,TP,15x1
FD9 0403-000551 DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500m PCR02 2201-000934 C-CERAMIC,DISC;3.3nF,20%,400V,Y5U,TP,15x
FE1 2401-000922 C-AL;22uF,20%,16V,GP,TP,5x5,5 PCR11 2201-000930 C-CERAMIC,DISC;0.22nF,10%,500V,Y5P,TP,5.
FE12 2401-001475 C-AL;47uF,20%,10V,GP,TP,6.3x5,5mm PCR13 2301-000176 C-FILM,PEF;18nF,5%,100V,TP,10X9X4.3X5,5m
FE5 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 PCR14 2301-000417 C-FILM,PEF;24nF,5%,50V,TP,6.5x10.5x4mm,5
FE8 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5 PCR15 2301-000423 C-FILM,PEF;3.3NF,5%,100V,TP,7X10X4.5MM,5
FIC1 AH09-00034A IC MICOM;LC866232A,SANYO,100PIN,QFP,QFP PCS03 2201-000916 C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10x
FIC2 1203-001252 IC-VOL. DETECTOR;7545,TO-92,3P,-,PLASTIC PCS31 2301-000381 C-FILM,PEF;10nF,5%,50V,TP,6.5x5.5x3mm,5m
FIC4 AH59-00010A MODULE-REMOCON;-,-,37.9KHZ,940NM,-,-,- PCS32 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
FL2 2701-000114 INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm PDD35 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
FR1 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M PDR11 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
FR10 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM PDR12 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
FR101 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M PDS01 0402-001196 DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
FR102 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M PDS02 0402-001196 DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
FR103 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M PDS03 0402-001196 DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
FR104 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M PDS04 0402-001196 DIODE-RECTIFIER;1T5,600V,1A,TS-1,TP
FR105 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M PDS11 0402-000276 DIODE-RECTIFIER;UF4007,1KV,1A,DO-41,TP
FR106 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M PDS31 0402-001195 DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
FR11 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM PDS32 0402-001194 DIODE-RECTIFIER;UG2D,200V,2A,DO-204AC,TP
FR12 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM PDS33 0404-001097 DIODE-SCHOTTKY;SG45,45V,7500mA,TO-220A,B
FR13 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM PDS34 0404-001097 DIODE-SCHOTTKY;SG45,45V,7500mA,TO-220A,B
FR16 2001-000027 R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MM PDS36 0402-001195 DIODE-RECTIFIER;F1T4,400V,1.0A,TS-1,TP
FR17 2001-000027 R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MM PDS51 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
FR18 2007-000493 R-CHIP;2.2KOHM,5%,1/10W,DA,TP,2012 PDS52 0402-000132 DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TP
FR19 2001-000449 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M PER10 2401-003365 C-AL;150uF,20%,200V,GP,TP,18x25,7.5
FR20 2001-000449 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M PER11 2401-001235 C-AL;4.7uF,20%,250V,WT,TP,10x12.5,5
FR21 2001-000435 R-CARBON;1MOHM,5%,1/8W,AA,TP,1.8X3.2MM PER12 2401-000905 C-AL;22UF,20%,16V,BP,-,6X11,2.5MM
FR24 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM PES31 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5
FR25 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012 PES32 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5
FR26 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM PES33 2401-000118 C-AL;1000uF,20%,10V,GP,TP,10x12.5,5
FR2S 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012 PES34 2401-000118 C-AL;1000uF,20%,10V,GP,TP,10x12.5,5
FR31 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M PES35 2401-003046 C-AL;47uF,20%,50V,WT,TP,6.3x11,2.5
8-5
Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
PES36 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5 VC9 2202-000231 C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
PES37 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5 VE1 2401-000369 C-AL;100UF,20%,6.3V,GP,-,6.3X11,5 DVD-611 ONLY
PES51 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 VE10 2401-000369 C-AL;100UF,20%,6.3V,GP,-,6.3X11,5 DVD-611 ONLY
PES52 2401-000598 C-AL;1uF,20%,50V,GP,TP,4x7,5 VE11 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m DVD-611 ONLY
PES53 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5 VE2 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m DVD-611 ONLY
PES54 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 VE3 2401-000369 C-AL;100UF,20%,6.3V,GP,-,6.3X11,5 DVD-611 ONLY
PES56 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5 VE4 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m DVD-611 ONLY
PES57 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5 VE5 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5
PES58 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5 VE6 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
PFD01 3601-000194 FUSE-CARTRIDGE;250V,1A,FAST-ACTING,GLASS VE7 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5
PICS1 0604-000186 PHOTO-COUPLER;TR,-,200mW,DIP-4,ST VE8 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m
PICS2 AC14-12006D IC;KA431Z,TO-92,TAPING VE9 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5
PICS3 1203-000122 IC-NEGA.FIXED REG.;7908,TO-220,3P,-,PLAS VFD1 AH07-00024A VF DISPLAY;HNV-11SS19,21SEG,74X9.0mm,DVD
PICS4 1203-001697 IC-VOLTAGE REGULATOR;78R08,TO-220,4P,-,P VIC1 1201-001419 IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,
PICS5 1203-001083 IC-VOLTAGE REGULATOR;3RF23,TO-202,4P,12. VIC2 1201-001419 IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB, DVD-611 ONLY
PLS01 AC29-30050C FILTER-LINE NOISE;-,25MH,0.35A,AC250V,BS VL1 2701-000238 INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
PLS31 AC27-12001N COIL-CHOKE;10UH-15%,RA,K-30,Q80,150KHZ,- VL112 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-
POWER 0601-001447 LED;ROUND,RED,3.1mm,650nm VL2 2701-000238 INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
PQR11 0502-000405 TR-POWER;-,NPN,70W,TO-220,BK,10 VL3 2701-000238 INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
PQR12 0501-000442 TR-SMALL SIGNAL;KTC3203-Y,NPN,400MW,T0-9 VL4 2701-000238 INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
PQS55 0504-000152 TR-DIGITAL;KSR2101,PNP,200MW,4.7K/4.7K,S VL5 2701-000238 INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm DVD-611 ONLY
PQS56 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP VL6 2701-000145 INDUCTOR-AXIAL;1uH,5%,2.4x3.4mm DVD-611 ONLY
PQS57 0501-000616 TR-SMALL SIGNAL;KSC2328A-Y,NPN,1W,TO-92L VL7 2701-000238 INDUCTOR-AXIAL;1.8uH,10%,2.5x3.4mm
PQS58 0501-000616 TR-SMALL SIGNAL;KSC2328A-Y,NPN,1W,TO-92L VL8 2701-000145 INDUCTOR-AXIAL;1uH,5%,2.4x3.4mm
PRD11 2003-000119 R-METAL OXIDE;0.68ohm,5%,2W,AE,TP,6x16mm VR10 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
PRD31 2007-000221 R-CHIP;1.2KOHM,5%,1/10W,DA,TP,2012 VR10S 2001-001006 R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
PRD32 2007-000766 R-CHIP;330OHM,5%,1/10W,DA,TP,2012 VR11 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
PRR11 2003-002117 R-METAL OXIDE(S);330Kohm,5%,1W,AA,TP,3.3 VR12 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
PRR12 2003-000314 R-METAL OXIDE;47ohm,5%,2W,AE,TP,6x16mm VR121 2001-000515 R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM DVD-611 ONLY
PRR13 2003-000314 R-METAL OXIDE;47ohm,5%,2W,AE,TP,6x16mm VR122 2007-000572 R-CHIP;220OHM,5%,1/10W,DA,TP,2012
PRR14 2001-000003 R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm VR123 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM DVD-611 ONLY
PRR15 2001-000003 R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm VR13 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM DVD-611 ONLY
PRR17 2001-000734 R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2M VR22 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM DVD-611 ONLY
PRS11 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9x VR23 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM DVD-611 ONLY
PRS12 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9x VR24 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM DVD-611 ONLY
PRS31 2001-000440 R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MM VR7 2001-001006 R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
PRS32 2007-000468 R-CHIP;1KOHM,5%,1/10W,DA,TP,2012 VR8 2001-001006 R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM
PRS33 2004-000869 R-METAL;3Kohm,1%,1/8W,AA,TP,1.8x3.2mm VR9 2001-001006 R-CARBON;82OHM,5%,1/8W,AA,TP,1.8X3.2MM DVD-611 ONLY
PRS34 2004-000459 R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x3.2m VSW1 AH34-00010A SWITCH SLIDE;-,50V DC,-,-,100MOHM,-,-,-, DVD-611 ONLY
PRS54 2001-000449 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2M
PRS55 2001-000062 R-CARBON;470OHM,5%,1/4W,AA,TP,2.4X6.4MM
PRS56 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM
PTD1 AC26-00001N TRANS-SWITCHING;-,-,-,120V,UL/CSA,EE2821
PVA1 1405-000186 VARISTOR;470V,4500A,17x12mm,TP
PZR31 0403-001036 DIODE-ZENER;1N4745A,16V,5%,1W,DO-41,TP
PZS51 0403-000717 DIODE-ZENER;MTZJ5.1B,5.1V,4.94-5.2V,500m
SVJ1 3722-001375 JACK-DIN;4P,-,NI,BLK,-
SW1 3404-000160 SWITCH-TACT;12V,50mA,160gf+-50gf,6.55x7.
VC1 2202-000205 C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
VC10 2202-000791 C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
VC106 2203-000260 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012 DVD-611 ONLY
VC11 2202-000851 C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP DVD-611 ONLY
VC12 2202-000231 C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP DVD-611 ONLY
VC13 2202-000791 C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP DVD-611 ONLY
VC14 2202-000205 C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1. DVD-611 ONLY
VC16 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V
VC17 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,
VC18 2202-000231 C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
VC19 2202-000791 C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
VC21 2202-000205 C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
VC22 2202-000851 C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
VC3 2202-000851 C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
VC4 2202-000231 C-CERAMIC,MLC-AXIAL;330pF,10%,50V,Y5P,TP
VC5 2202-000791 C-CERAMIC,MLC-AXIAL;150pF,10%,50V,Y5P,TP
VC6 2202-000205 C-CERAMIC,MLC-AXIAL;22pF,5%,50V,SL,TP,1.
VC8 2202-000851 C-CERAMIC,MLC-AXIAL;270PF,10%,50V,Y5P,TP
Samsung Electronics
8-6
Electrical Parts List
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
701 AH92-00583A ASSY PCB-KEY;DVD-611,KEY PCB DVD-611
AH92-00582A ASSY PCB-KEY;DVD-511,KEY PCB DVD-511
CON21 AH39-00180A CONNECT WIRE;-,-,-,-,#26,-,-,-,-,-,-,-,1
FSW1 3404-000165 SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
FSW2 3404-000165 SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
FSW4 3404-000165 SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
FSW5 3404-000165 SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
FSW6 3404-000165 SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
H240 AH92-00608A ASSY PCB-DECK;VALINO DECK 1L
CN1 3708-001084 CONNECTOR-FPC/FC/PIC;40P,1.25mm,ANGLE,SN
CN2 3708-001494 CONNECTOR-FPC/FC/PIC;20P,1mm,SMD-A,SN
CN2A 3809-001182 CABLE-FLAT;30V,80C,114mm,20P,1mm,UL20696
CN3 3708-001492 CONNECTOR-FPC/FC/PIC;11P,1mm,ANGLE,SN
DC1 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
DC2 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
DC4 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
DC5 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y5S,TP,
DD2 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,
DR1 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
DR4 2001-000405 R-CARBON;180OHM,5%,1/8W,AA,TP,1.8X3.2MM
DR5 2001-000405 R-CARBON;180OHM,5%,1/8W,AA,TP,1.8X3.2MM
DR6 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM
DR7 2001-000515 R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM
SW1 3409-001045 SWITCH-DETECTOR;30V,0.1A,1,36gf,-
SW2 3409-000176 SWITCH-DETECTOR;30Vdc,100mA,SPST,-,-
SW3 3408-000227 SWITCH-SLIDE;30V,300mA,DPDT,-
8-7
Samsung Electronics
Electrical Parts List
MEMO
Samsung Electronics
8-8
9. Block Diagram
DECK ASS'Y (DP-5) Remote Control FLT Display
MIC4 2K EEPROM
FIC1
MIC1
MIC2 8M EPROM (LC86P6232)
(TMP95C265F)
Front Controller
Main Controller
MIC3 1M SDRAM
ZIC2/3 SDRAM X 2
Spindle/Sied/Tray Motor Pick-up & I/V Amp
Optical
ZIC1 (ZiVA-4.1) IEC958/1937
Coaxial
RIC1 A/V Decoder
(KS1461) DVD-611 Only
RF Amp & DPD
CSS
INPUT
Lt
FIFO Post
AUDIO AIC1 (AK4393)
Down-L/R
DIC2 4M DRAM
& Filter
DSP 2-CH Audio DAC
DEMUX Rt
SIC4
(KA3017) DIC1
Actuator & Motor Driver (KS1453)
DVD & CD Processor
A/V
Decoder
AC3 &
SIC1
MPEG 5.1
(KS1452)
Compo
Digital Servo CVBS
Post Filter
VIC1 (BA7660)
6dB AMP Yout
Y/B/Pb
Post Filter Cout
Video
R/Pr
C/R/Pr
Encoder Post Filter
(4DAC)
VIC2 (BA7660)
B/Pb
6dB AMP
Comp/G/Y
Post Filter
G/Y
DVD-611 Only
Samsung Electronics 9-1
Block Diagrams
MEMO
9-2 Samsung Electronics
10. PCB Diagrams
10-1 Main - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-2
10-2 Jack - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-3
10-3 Key - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-4
10-4 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-4
Samsung Electronics 10-1
PCB Diagrams
10-1 Main
COMPONENT SIDE
SOLDER SIDE
10-2 Samsung Electronics
PCB Diagrams
10-2 Jack
Samsung Electronics 10-3
PCB Diagrams
10-3 Key 10-4 Deck
DVD-611
DVD-511
10-4 Samsung Electronics
11. Wiring Diagram
Samsung Electronics 11-1
Wiring Diagram
MEMO
11-2 Samsung Electronics
12. Schematic Diagrams
Block Identification of PCB
12-1 Power - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-2
12-2 Main-Micom - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-3
12-3 Servo - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-4
12-4 Video - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-5
12-5 Audio- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-6
12-6 RF - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-7
12-7 ZiVA - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-8
Main PCB (Component Side)
12-8 DSP - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-9
12-9 Front-Micom/VFD Display - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-10
12-10 Key - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-11
12-11 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-12
12-12 Remote Control - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-13
Jack PCB (Conductor Side)
Samsung Electronics 12-1
Schematic Diagrams
12-1 Power
12-2 Samsung Electronics
Schematic Diagrams
12-2 Main-Micom
Samsung Electronics 12-3
Schematic Diagrams
12-3 Servo
12-4 Samsung Electronics
Schematic Diagrams
12-4 Video
Samsung Electronics 12-5
Schematic Diagrams
12-5 Audio
12-6 Samsung Electronics
Schematic Diagrams
12-6 RF
Samsung Electronics 12-7
Schematic Diagrams
12-7 ZiVA
12-8 Samsung Electronics
Schematic Diagrams
12-8 DSP
Samsung Electronics 12-9
Schematic Diagrams
12-9 Front-Micom/VFD Display
12-10 Samsung Electronics
Schematic Diagrams
12-10 Key
Samsung Electronics 12-11
Schematic Diagrams
12-11 Deck
12-12 Samsung Electronics
Schematic Diagrams
12-12 Remote Control
Samsung Electronics 12-13
Schematic Diagrams
MEMO
12-14 Samsung Electronics
ACEC
